Mechanical impact protection for implantable hermetic assemblies
US-2024399158-A1 · Dec 5, 2024 · US
Non-hermetic direct current interconnect
US9393432B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9393432-B2 |
| Application number | US-60995709-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 30, 2009 |
| Priority date | Oct 31, 2008 |
| Publication date | Jul 19, 2016 |
| Grant date | Jul 19, 2016 |
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- Title
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Abstract
Official abstract text for this publication.
A modular implantable medical device (IMD) may include a non-hermetic interconnect. The non-hermetic interconnect may electrically couple a first module and a second module of the modular IMD. A conductor in the non-hermetic interconnect may conduct electrical energy from the first module to the second module under an applied direct current (DC) voltage.
First claim
Opening claim text (preview).
The invention claimed is: 1. A modular implantable medical device (IMD) comprising: a first module; a second module; an electronic component within one of the first module and the second module; and a non-hermetic interconnect electrically coupling the first module and the second module, wherein the non-hermetic interconnect comprises a first conductor and a second conductor, wherein the first conductor and the second conductor are separated by at least 1 millimeter for substantially an entire length of the non-hermetic interconnect, and wherein the electronic component applies a DC voltage to at least one of the first conductor and the second conductor to transfer at least one of energy or a communication signal from one of the first module and the second module to the other of the first module and the second module via the at least one of the first conductor and the second conductor wherein at least one of the first conductor and the second conductor connect to at least one of the first module and the second module through a hermetic feedthrough that is comprised of lanthium borate glass. 2. A modular implantable medical device (IMD) comprising: a first module comprising a first metallic housing and a hermetic feedthrough; a second module comprising second metallic housing; an electronic component within one of the first module and the second module; and a non-hermetic interconnect electrically coupling the first module and the second module, wherein the non-hermetic interconnect comprises a metallic conductor, and wherein the electronic component applies a DC voltage to the metallic conductor to transfer at least one of energy or a communication signal from the first module to the second module via the metallic conductor and wherein the hermetic feedthrough comprises lanthium borate glass.
Assignees
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Classifications
- A61N1/3754Primary
Feedthroughs · CPC title
Details of casing-lead connections · CPC title
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Frequently asked questions
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- What does patent US9393432B2 cover?
- A modular implantable medical device (IMD) may include a non-hermetic interconnect. The non-hermetic interconnect may electrically couple a first module and a second module of the modular IMD. A conductor in the non-hermetic interconnect may conduct electrical energy from the first module to the second module under an applied direct current (DC) voltage.
- Who is the assignee on this patent?
- Wahlstrand Carl D, Skime Robert M, Medtronic Inc
- What technology area does this patent fall under?
- Primary CPC classification A61N1/3754. Mapped technology areas include Human Necessities.
- When was this patent published?
- Publication date Tue Jul 19 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).