Method of manufacturing surface mount device

Patent metadata

Field	Value
Publication number	US-9392702-B2
Application number	US-201514792713-A
Country	US
Kind code	B2
Filing date	Jul 7, 2015
Priority date	Jan 31, 2011
Publication date	Jul 12, 2016
Grant date	Jul 12, 2016

Abstract

Disclosed is a surface mount device to be mounted on a base member, including plural lead units, each of the plural lead units including, a lead including a body portion and a foot formed at an end of the lead; a solder portion formed at the foot of the lead to protrude toward the direction of the base member to have a summit portion, and a diffusion prevention portion provided on the lead for preventing a diffusion of a solder along the body portion of the lead.

First claim

What is claimed is:

1. A method of manufacturing a surface mount device to be mounted on a base member, the surface mount device including plural lead units each including a lead composed of a body portion and a foot formed at an end of the lead and a diffusion prevention portion for preventing a diffusion of a solder provided on the lead, comprising:
introducing solder into plural concave portions provided in a front side of a pallet and aligned to correspond to the leads of the plural lead units;
contacting or inserting each of the leads into the solder introduced in the respective concave portion while the solder is melted by heating to form a solder portion at the foot of the lead to protrude and have a summit portion extending away from the foot;
removing the leads with the solder from the concave portion so that the summit portion of the solder portion is facing the base member to mount the surface mount device to the base member; and
wherein a through hole that is open to a back side of the pallet, opposite the front side, is provided in the bottom of each of the concave portions.

Assignees

• Fujitsu Component Ltd

Inventors

• Okuyama Takeshi
• Kusagaya Toshihiro
• Yamakami Tohru

Classifications

• H05K3/3426 Primary

  characterised by the leads · CPC title

• H05K1/025

  Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance (H05K1/024 and H05K1/0243 take precedence; for semiconductor devices H10W44/20) · CPC title

• H01R4/028

  comprising means for preventing flowing or wicking of solder or flux in parts not desired · CPC title

• H01R12/724

  containing contact members forming a right angle · CPC title

• H01R13/6587

  for mounting on PCBs · CPC title