Camera module with a variable lens

Patent metadata

Field	Value
Publication number	US-9392152-B2
Application number	US-201313888105-A
Country	US
Kind code	B2
Filing date	May 6, 2013
Priority date	May 7, 2012
Publication date	Jul 12, 2016
Grant date	Jul 12, 2016

Abstract

An exemplary embodiment of the present disclosure includes a PCB mounted with an image sensor, a base installed at an upper surface of the PCB to centrally form an optical path, a lens holder coupled to an upper surface of the base to form an optical path by being mounted with at least one or more sheets of lenses, a variable lens arranged on the optical path centrally formed at the base to control a refractive index of passing light, and an infrared cut-off coating layer provided on a surface of the variable lens to filter an infrared component from the optical path-passing light.

First claim

What is claimed is:

1. A camera module, the camera module comprising:
a printed circuit board (PCB) mounted with an image sensor;
a base disposed on an upper surface of the PCB to centrally form an opening;
a lens holder coupled to an upper surface of the base and having a plurality of lenses arranged on an optical path inside the lens holder;
a variable lens fixedly arranged between an extreme rear lens of the plurality of lenses in the optical path and the base to change refractive index of passing light;
an actuator disposed between the lens holder and the image sensor to control the variable lens; and
an infrared cut-off coating layer to filter an infrared component from the passing light,
wherein the actuator has a ring shape and is coupled to an inner periphery of the opening formed in the base,
wherein the actuator is conductibly connected to the PCB and provides a control signal or an electric power for the variable lens,
wherein the variable lens is coupled inside the ring-shaped actuator, and
wherein a surface of any one of the variable lens and the plurality of lenses is coated with the infrared cut-off coating layer.

2. The camera module of claim 1 , wherein the lens holder and the base are integrally formed.

3. The camera module of claim 1 , wherein the actuator includes any one of a micro-electromechanical systems (MEMS) actuator moved by using an electrostatic force or a piezoelectric force, an actuator for a piezoelectric polymer lens, or a silicon type actuator.

4. The camera module of claim 1 , wherein the actuator includes combination of at least two of a micro-electromechanical systems (MEMS) actuator moved by using an electrostatic force or a piezoelectric force, an actuator for a piezoelectric polymer lens, or a silicon type actuator.

5. The camera module of claim 1 , wherein the actuator is connected to the PCB via a wiring member to exchange an electric power and a control signal.

6. The camera module of claim 5 , wherein the wiring member is provided with a flexible printed circuit board (F-PCB).

7. The camera module of claim 5 , wherein the wiring member is formed with the F-PCB having a plurality of terminal units to be connected to a controller mounted on the PCB.

8. The camera module of claim 5 , wherein the wiring member is provided with an electronic circuit pattern layer integrally formed with the lens holder and the base.

9. The camera module of claim 1 , wherein the lens holder includes an optical mechanism arranged on the optical path formed by the at least one or more lenses to adjust the passing light.

10. The camera module of claim 9 , wherein the optical mechanism includes an aperture and a shutter.

11. The camera module of claim 9 , wherein the optical mechanism is placed in one of a space outside the outermost lens of the plurality of lenses, a space between the plurality of lenses, a space between the variable lens and a lens of the plurality of lenses neighboring the variable lens, and a space between the image sensor and a lens of the plurality of lenses or the variable lens neighboring the image sensor.

12. The camera module of claim 1 , further comprising an actuator configured to move the variable lens along the optical path to provide a zooming function.

13. The camera module of claim 1 , wherein the infrared cut-off coating layer is formed on a bottom surface of the variable lens.

14. The camera module of claim 1 , wherein the infrared cut-off coating layer is formed on an upper surface of the variable lens.

15. The camera module of claim 1 , wherein the infrared cut-off coating layer is formed on a bottom surface of the extreme rear lens.

16. The camera module of claim 1 , wherein the infrared cut-off coating layer is formed on an upper surface of a first lens.

Assignees

• Lg Innotek Co Ltd

Inventors

• Kim Min Soo

Classifications

• G02B7/09 Primary

  adapted for automatic focusing or varying magnification · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H04N23/682

  Vibration or motion blur correction · CPC title

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title