Enhanced capacitance touch screen display and methods for use therewith
US-2024411406-A1 · Dec 12, 2024 · US
US9389452B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9389452-B2 |
| Application number | US-201314065686-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 29, 2013 |
| Priority date | Mar 4, 2013 |
| Publication date | Jul 12, 2016 |
| Grant date | Jul 12, 2016 |
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A touch display apparatus includes a base substrate, a light blocking semiconductor pattern disposed on the base substrate and configured to block a visible light and transmit an infrared light, a sensing element disposed on the light blocking semiconductor pattern and configured to detect a touch position using an incident infrared light, a driving element configured to drive the sensing element, a signal line electrically connected with the sensing element or the driving element, and a wiring connecting part disposed under the signal line and including a same material as the light blocking semiconductor pattern.
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What is claimed is: 1. A touch display apparatus comprising: a base substrate; a light blocking semiconductor pattern on the base substrate, and configured to block a visible light and transmit an infrared light; a sensing element on the light blocking semiconductor pattern and configured to detect a touch position using an incident infrared light; a driving element configured to drive the sensing element; a signal line electrically connected with the sensing element or the driving element; and a wiring connecting part under the signal line and comprising a same material as that of the light blocking semiconductor pattern. 2. The touch display apparatus of claim 1 , wherein the light blocking semiconductor pattern comprises amorphous silicon germanium. 3. The touch display apparatus of claim 1 , wherein the sensing element comprises: a semiconductor pattern on the light blocking semiconductor pattern; a source electrode overlapping a first end of the semiconductor pattern; a drain electrode spaced apart from the source electrode and overlapping a second end of the semiconductor pattern opposing the first end; and a gate electrode on the source electrode and the drain electrode. 4. The touch display apparatus of claim 1 , wherein the wiring connecting part comprises amorphous silicon germanium. 5. The touch display apparatus of claim 1 , wherein the light blocking semiconductor pattern and the wiring connecting part are in a same layer. 6. A method of manufacturing a touch display apparatus, comprising: providing a semiconductor layer on a base substrate, the semiconductor layer comprising: a light blocking semiconductor pattern configured to block a visible light and transmit an infrared light, a wiring connecting part in a display area of the apparatus and comprising a same material as that of the light blocking semiconductor pattern, and a guard ring in a peripheral area of the apparatus and connected with the wiring connecting part; providing a metal pattern comprising a signal line on the wiring connecting part and lengthwise extending in a direction; and providing a sensing element on the metal pattern, and configured to detect a touch position using an incident infrared light. 7. The method of claim 6 , wherein the providing the sensing element comprises: providing a semiconductor pattern on the light blocking semiconductor pattern; providing a source electrode and a drain electrode on the semiconductor pattern; providing an insulation layer on the source electrode and the drain electrode; and providing a gate electrode on the insulation layer. 8. The method of claim 7 , wherein the providing the insulation layer comprises partially removing the guard ring and the wiring connecting part. 9. The method of claim 6 , wherein the metal pattern further comprises: a common voltage wiring in the peripheral area and lengthwise extending in a direction crossing the signal line; and a pad part in the peripheral area, and spaced apart from the signal line. 10. The method of claim 6 , wherein the semiconductor layer comprises amorphous silicon germanium. 11. The method of claim 9 , further comprising forming a connecting electrode connecting the signal line and the pad part to each other, wherein the connecting electrode is in a same layer as the gate electrode. 12. The method of claim 9 , wherein the wiring connecting part connects the guard ring with the signal line and connects the guard ring with the pad part.
wherein the radiation-sensitive semiconductor devices control the electric light source, e.g. image converters, image amplifiers or image storage devices · CPC title
Contact-type image sensors [CIS] · CPC title
Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element · CPC title
involving infrared radiation · CPC title
Physics · mapped topic
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