Light source apparatus and projection type display apparatus

US9388972B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9388972-B2
Application numberUS-201314109378-A
CountryUS
Kind codeB2
Filing dateDec 17, 2013
Priority dateDec 19, 2012
Publication dateJul 12, 2016
Grant dateJul 12, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A light source apparatus of the present disclosure includes a semiconductor light source, a light source holding member on which the semiconductor light source is disposed, the light source holding member being made of a thermal conductive material, and a cooling member that radiates heat generated by the semiconductor light source through the light source holding member. In addition, the light source apparatus includes an optical lens, an optical lens holding member that holds the optical lens and that is disposed on a light-emitting portion side of the semiconductor light source, and a thermal conductive member having a hole that houses a light-emitting portion of the semiconductor light source. The thermal conductive member is sandwiched between the light source holding member and the optical lens holding member, and comes into close contact with a side surface of the light-emitting portion.

First claim

Opening claim text (preview).

What is claimed is: 1. A light source apparatus comprising: a semiconductor light source; a light source holding member on which the semiconductor light source is disposed, the light source holding member being made of a thermal conductive material; a cooling member that radiates heat generated by the semiconductor light source, through the light source holding member; an optical lens; an optical lens holding member holding the optical lens and disposed on a light-emitting portion side of the semiconductor light source; and a thermal conductive member made of an elastic material and having a hole in which a light-emitting portion of the semiconductor light source is placed, wherein the thermal conductive member is elastically deformed between the light source holding member and the optical lens holding member, and is in close contact with a side surface of the light-emitting portion by the elastic deformation, and the optical lens holding member is made of thermal conductivity material, and the light source holding member and the optical lens holding member are joined together with grease having thermal conductivity. 2. The light source apparatus according to claim 1 , wherein the thermal conductive elastic member is made of a silicone material. 3. The light source apparatus according to claim 1 , wherein the thermal conductive member is made of a phase change sheet. 4. The light source apparatus according to claim 1 , wherein the thermal conductive member is provided with at least one or more recesses along a circumference of the hole. 5. The light source apparatus according to claim 1 , wherein the thermal conductive member is provided with another hole in a position different from that of the hole. 6. A projection type display apparatus comprising: a light source apparatus according to claim 1 ; an optical modulation apparatus that modulates light from the light source apparatus according to a video signal; and a projection optical apparatus that projects light from the optical modulation apparatus onto a screen. 7. A method of manufacturing a light source apparatus including a semiconductor light source, the method comprising: disposing a semiconductor light source on a light source holding member made of a thermal conductive material; disposing, on the light source holding member, a thermal conductive elastic member which has a hole larger than a diameter of a light-emitting portion of the semiconductor light source and has a thickness larger than a height of the light-emitting portion of the semiconductor light source such that the light-emitting portion of the semiconductor light source is placed in the hole; sandwiching the thermal conductive elastic member between the light source holding member and an optical lens holding member holding an optical lens; and elastically deforming the thermal conductive elastic member to be in close contact with a side surface of the light-emitting portion by the elastic deformation, wherein the optical lens holding member is made of thermal conductivity material, and the light source holding member and the optical lens holding member are joined together with grease having thermal conductivity.

Assignees

Inventors

Classifications

  • G03B21/16Primary

    Cooling; Preventing overheating · CPC title

  • LED or laser light sources · CPC title

  • F21V29/004Primary

    Mechanical Engineering · mapped topic

  • characterised by the material (liquid coolants F21V29/56) · CPC title

  • F21V29/70Primary

    characterised by passive heat-dissipating elements, e.g. heat-sinks · CPC title

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What does patent US9388972B2 cover?
A light source apparatus of the present disclosure includes a semiconductor light source, a light source holding member on which the semiconductor light source is disposed, the light source holding member being made of a thermal conductive material, and a cooling member that radiates heat generated by the semiconductor light source through the light source holding member. In addition, the light…
Who is the assignee on this patent?
Panasonic Corp, Panasonic Ip Man Co Ltd
What technology area does this patent fall under?
Primary CPC classification G03B21/16. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jul 12 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).