Wafer dicing from wafer backside and front side
US-9224650-B2 · Dec 29, 2015 · US
US9387554B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9387554-B2 |
| Application number | US-201313961028-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 7, 2013 |
| Priority date | Aug 17, 2012 |
| Publication date | Jul 12, 2016 |
| Grant date | Jul 12, 2016 |
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Official abstract text for this publication.
A laser processing apparatus including a processing head for applying a laser beam to a workpiece. The processing head includes a focusing lens and a collecting unit provided between the focusing lens and the workpiece for collecting debris generated by the application of the laser beam focused by the focusing lens to the workpiece. The collecting unit includes a suction source for sucking the debris and a suction line having one end connected to the suction source and the other end opening to the front side of the workpiece. The laser processing apparatus further includes a cleaning liquid supplying unit for supplying a cleaning liquid to the suction line.
Opening claim text (preview).
What is claimed is: 1. A laser processing apparatus comprising: holding means for holding a workpiece; and laser beam applying means for performing ablation to said workpiece held by said holding means, said laser beam applying means including laser beam oscillating means for oscillating a laser beam and a processing head for applying said laser beam oscillated by said laser beam oscillating means to said workpiece; said processing head including a focusing lens for focusing said laser beam oscillated by said laser beam oscillating means and collecting means provided between said focusing lens and said workpiece for collecting debris generated by the application of said laser beam focused by said focusing lens to said workpiece; said collecting means including a suction source for sucking said debris and a suction line having one end connected to said suction source and the other end opening to the front side of said workpiece; said laser processing apparatus further including a cleaning liquid supplying means for supplying a cleaning liquid to said suction line, wherein said cleaning liquid supplying means includes a cleaning liquid nozzle opening within said suction line, a cleaning liquid source for supplying said cleaning liquid to said cleaning liquid nozzle, and a cleaning liquid supply line having one end connected to said cleaning liquid nozzle and the other end connected to said cleaning liquid source; wherein said cleaning liquid supply means further includes a cleaning liquid reservoir for storing additional cleaning liquid, said suction line being cleaned by moving said processing head to said liquid reservoir and immersing said processing head into said cleaning liquid reservoir with predetermined timing and operating said suction source in the condition where said processing head is immersed in said cleaning liquid reservoir.
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