Method for producing a hermetically sealed casing intended for encapsulating an implantable device, and corresponding casing

Patent metadata

Field	Value
Publication number	US-9387336-B2
Application number	US-201514674489-A
Country	US
Kind code	B2
Filing date	Mar 31, 2015
Priority date	Mar 31, 2014
Publication date	Jul 12, 2016
Grant date	Jul 12, 2016

Abstract

Method for producing a hermetically sealed casing, comprising the following steps:
a) supplying a ceramic substrate ( 20 ), b) supplying a metal surround ( 21 ) and placing it facing the said substrate ( 20 ), c) forming a first hermetically sealed joint ( 22 ) at the interface between the said substrate ( 20 ) and the said metal surround ( 21 ), in order to assemble them and form an assembly, d) superposing a cover ( 23 ) on the said assembly, e) forming a second hermetically sealed joint ( 24 ) between an upper face of the metal surround ( 21 ) which is the opposite face to the said interface, and the cover ( 23 ), in order to obtain the said casing,

characterized in that, during step c), the first hermetically sealed joint ( 22 ) is formed on a portion of the said interface and in that prior to step c), the method involves an additional step consisting in placing a ceramic surround ( 25 ) on the upper face of the metal surround so as to partially cover the said face of the metal surround, the projected surface of the said ceramic surround in a plane of projection covering the projected surface of the said first joint in this same plane of projection.

First claim

The invention claimed is:

1. Method for producing a hermetically sealed casing, comprising the following steps:
a) supplying a ceramic substrate ( 20 ),
b) supplying a metal surround ( 21 ) and placing it facing the said substrate ( 20 ),
c) forming a first hermetically sealed joint ( 22 ) at the interface between the said substrate ( 20 ) and the said metal surround ( 21 ), in order to assemble them and form an assembly,
d) superposing a cover ( 23 , 33 ) on the said assembly,
e) forming a second hermetically sealed joint ( 24 ) between an upper face ( 211 ) of the metal surround ( 21 ) which is the opposite face to the said interface, and the cover ( 23 , 33 ), in order to obtain the said casing, characterized in that, during step c), the first hermetically sealed joint ( 22 ) is formed on a portion of the said interface and in that prior to step c), the method involves an additional step consisting in placing a ceramic surround ( 25 ) on the upper face ( 211 ) of the metal surround so as to partially cover the said face of the metal surround, the ceramic surround has a projected surface defining a plane of projection, the said plane of projection covering a projected surface of the said first joint.

2. Method according to claim 1 , characterized in that the first hermetically sealed joint ( 22 ) formed during step c) is a brazed joint.

3. Method according to claim 2 , characterized in that, during step a), a substrate in which a recess is formed is supplied, the brazed joint being incorporated at least partially into the said recess.

4. Method according to claim 2 , characterized in that, during step b), a metal surround in which a recess is formed is supplied, the brazed joint being at least partially incorporated into the said recess.

5. Method of encapsulating a device consisting in implementing the method according to claim 1 and in mounting at least one component of the said device that is to be encapsulated on the said substrate ( 20 ), after step c).

6. Hermetically sealed casing comprising:
a ceramic substrate ( 20 ),
a metal surround ( 21 ) hermetically connected to the substrate by a first joint ( 22 ) situated on a portion of the interface between the said substrate ( 20 ) and the said surround ( 21 ), and
a cover ( 23 , 33 ) hermetically connected to the a cover ( 23 , 33 ) hermetically connected to the said metal surround ( 21 ) by a second hermetically sealed joint ( 24 ), so as to define a cavity ( 30 , 40 ), characterized in that a ceramic surround ( 25 ) is connected to the said metal surround ( 21 ) on an opposite face ( 211 ) to the said interface, so as to partially cover the said face ( 211 ) of the metal surround, the ceramic surround has a projected surface defining a plane of projection, the said plane of projection covering a projected surface of the said first joint.

7. Casing according to claim 6 , characterized in that the surround ( 25 ) is situated on the inside of the cavity ( 30 ).

8. Casing according to claim 6 , characterized in that the ceramic surround ( 25 ) is situated on the outside of the cavity ( 40 ).

9. Casing according to claim 6 , characterized in that the first hermetically sealed joint ( 22 ) is a brazed joint.

10. Casing according claim 6 , characterized in that the said substrate ( 20 ) and/or the said metal surround ( 21 ) comprises a recess into which the first hermetically sealed joint is at least partially incorporated.

Assignees

• Commissariat Energie Atomique

Inventors

• Perraud Simon
• Karst Nicolas

Classifications

• A61N1/375 Primary

  Constructional arrangements, e.g. casings · CPC title

• B23K2103/18

  Dissimilar materials · CPC title

• A61N1/3754

  Feedthroughs · CPC title

• A61N1/3605

  Implantable neurostimulators for stimulating central or peripheral nerve system · CPC title

• B23K2103/52

  Ceramics · CPC title