Handheld device assembly

Patent metadata

Field	Value
Publication number	US-9386704-B2
Application number	US-201414203245-A
Country	US
Kind code	B2
Filing date	Mar 10, 2014
Priority date	Sep 8, 2009
Publication date	Jul 5, 2016
Grant date	Jul 5, 2016

Abstract

This is directed to several handheld device components to be placed in a handheld device, as well as methods or systems for mounting or retaining components within the device. In particular, this is directed to a rigid shield used in an SMT process and securing connected flex connectors by adhering the flexes together. This is also directed to using foam in combination with a hard material to create an acoustic seal, or several layers of foam to create an acoustic and mechanical seal. This is also directed to selectively folding a sheet of material placed around a battery cell.

First claim

The invention claimed is:

1. An electronic device comprising:
a housing;
a display positioned within the housing;
a window positioned over the display;
a flex within the housing and positioned below the window and comprising a fold defining an upper fold section and a lower fold section;
a first component, sensitive to interference, mounted on the lower fold section and oriented toward the window;
a support shield coupled the flex opposite the first portion, the support shield providing rigid support to the flex below the first component; and
a second component configured to emit electromagnetic energy and mounted on the lower fold section, separated from the first component, and oriented toward a back surface of the housing; wherein
the support shield is positioned between the first component and the second component so as to shield the first component from the electromagnetic energy generated by the first component.

2. The electronic device of claim 1 , wherein the support shield is constructed from austenitic steel.

3. The electronic device of claim 1 , wherein the first component is mounted on the flex via an SMT process.

4. The electronic device of claim 1 , wherein the second component is mounted on the flex via an SMT process.

5. The electronic device of claim 1 , wherein the support shield is permanently coupled to the flex.

6. The electronic device of claim 1 , wherein the support shield is removably coupled to the flex.

7. The electronic device of claim 1 , wherein the second component comprises a communications module.

8. The electronic device of claim 1 , further comprising a third component mounted opposite the second component.

9. The electronic device of claim 8 , wherein the flex is arranged such that the support shield separates the first component from both the second component and the third component.

10. An electronic device comprising:
a housing defining a perimeter region surrounding a display;
a flex within the housing positioned within the perimeter region, the flex folded along a fold axis so as to define an upper fold section positioned proximate to a front portion of the housing and a lower fold section positioned proximate to a back portion of the housing;
a coupling layer positioned on a first portion of a first surface of the flex within the upper fold section;
a first component electrically and mechanically coupled to the coupling layer;
a plate coupled to a second surface of the flex that is opposite the first portion, the plate providing rigid support to the first component via the flex; and
a second component configured to generate an RF signal and mounted on a second portion of the first surface of the flex within the lower fold section, the second component separated from the first component;
wherein the metal plate is positioned between the first component and the second component and provides an electromagnetic shield between the first component from the second component.

11. The electronic device of claim 10 , wherein:
the plate is formed from metal; and
the coupling layer comprises a layer of solder.

12. The electronic device of claim 11 , wherein:
the first component is coupled to the coupling layer an SMT process; and
the second component is mounted on the flex via an SMT process.

13. The electronic device of claim 11 , further comprising a first connector coupled to the flex.

14. The electronic device of claim 13 , wherein the first connector is adapted to receive a second connector coupled to a second flex.

15. The electronic device of claim 14 , wherein:
the first connector is formed from the first flex; and
the second connector is formed from the second flex.

16. A method comprising:
coupling a first component to a first surface of a flex;
coupling a support shield a second surface to the flex opposite the first surface to provide structural support to the first component;
coupling a second component to the first surface of the flex; and
folding the flex such that the support shield is positioned between the first component and the second component;
disposing the flex within a housing of an electronic device such that the first component is proximate to a back surface of the housing and the second component is proximate a front surface of the electronic device, wherein:
the second component is configured to generate an RF emission; and
the support shield is configured to shield the first component from the RF emission.

17. The method of claim 16 , wherein the support shield is constructed from austenitic steel.

18. The method of claim 16 , further comprising coupling the first component to the first portion of the first surface of the flex and coupling the second component to the second portion of the first surface of the flex using an SMT process.

19. The method of claim 16 , further comprising permanently coupling the support shield to the flex.

Assignees

• Apple Inc

Inventors

• Rothkopf Fletcher
• Lynch Stephen B
• Lin Wey-Jiun
• Yeates Kyle

Classifications

• H01M50/247

  specially adapted for portable devices, e.g. mobile phones, computers, hand tools or pacemakers · CPC title

• H05K1/189 Primary

  characterised by the use of flexible or folded printed circuits · CPC title

• H05K9/0022 Primary

  of components mounted on printed circuit boards [PCB] (shields integrated within PCB H05K1/0218; shields integrated within component packages H10W42/20) · CPC title

• Y10T29/49826

  Assembling or joining · CPC title

• H01M2/1094

  Electricity · mapped topic