Silicon dot formation by self-assembly method and selective silicon growth for flash memory

US9385136B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9385136-B2
Application numberUS-201514745568-A
CountryUS
Kind codeB2
Filing dateJun 22, 2015
Priority dateAug 23, 2013
Publication dateJul 5, 2016
Grant dateJul 5, 2016

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Abstract

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Some embodiments of the present disclosure relate to a method that achieves a substantially uniform pattern of discrete storage elements within a memory cell. A copolymer solution having first and second polymer species is spin-coated onto a surface of a substrate and subjected to self-assembly into a phase-separated material having a regular pattern of micro-domains of the second polymer species within a polymer matrix having the first polymer species. The second polymer species is then removed resulting with a pattern of holes within the polymer matrix. An etch is then performed through the holes utilizing the polymer matrix as a hard-mask to form a substantially identical pattern of holes in a dielectric layer disposed over a seed layer disposed over the substrate surface. Epitaxial deposition onto the seed layer then utilized to grow a substantially uniform pattern of discrete storage elements within the dielectric layer.

First claim

Opening claim text (preview).

What is claimed is: 1. A memory device, comprising: a semiconductor substrate; a first dielectric layer disposed over the semiconductor substrate; a plurality of quantum dots disposed onto and in direct contact with the first dielectric layer, wherein the plurality of quantum dots have substantially cylindrical shapes; a second dielectric layer that is arranged vertically over the plurality of quantum dots, and that abuts an upper surface of the first dielectric layer; and…

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What does patent US9385136B2 cover?
Some embodiments of the present disclosure relate to a method that achieves a substantially uniform pattern of discrete storage elements within a memory cell. A copolymer solution having first and second polymer species is spin-coated onto a surface of a substrate and subjected to self-assembly into a phase-separated material having a regular pattern of micro-domains of the second polymer speci…
Who is the assignee on this patent?
Taiwan Semiconductor Mfg Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10D30/0411. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jul 05 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).