Method for insulating singulated electronic die

Patent metadata

Field	Value
Publication number	US-9385041-B2
Application number	US-201414469478-A
Country	US
Kind code	B2
Filing date	Aug 26, 2014
Priority date	Aug 26, 2014
Publication date	Jul 5, 2016
Grant date	Jul 5, 2016

Abstract

In one embodiment, a method of forming an electronic device includes providing a wafer having plurality of die separated by spaces. The method includes plasma singulating the wafer through the spaces to form singulation lines that expose side surfaces of the plurality of die. The method includes forming an insulating layer on the exposed side surfaces. In one embodiment, the steps of singulating and forming the insulating layer are carried out with the wafer mounted to a carrier substrate that supports the wafer and singulated die during both steps.

First claim

The invention claimed is:

1. A method of forming an electronic device comprising:
providing a wafer having a plurality of die formed as part of the wafer and separated by spaces, wherein the wafer has first and second opposing major surfaces;
placing the wafer onto a carrier substrate;
singulating the wafer through the spaces to form singulation lines exposing side surfaces of the die; and
forming an insulating layer on the side surfaces,
wherein singulating the wafer and forming the insulating layer are done in one apparatus, and wherein the insulating layer is formed at least in part while singulating the wafer.

2. The method of claim 1 , wherein singulating the wafer includes plasma etching through the spaces to singulate the wafer to provide a plurality of singulated die, and wherein forming the insulating layer comprises forming the insulating layer on the side surfaces of the singulated die while the singulated die are attached to the carrier substrate.

3. The method of claim 1 , wherein forming the insulating layer comprises forming the insulating layer having a thickness sufficient to isolate the side surfaces of the singulated die.

4. The method of claim 3 , wherein the thickness is greater than about 0.1 microns.

5. The method of claim 1 , wherein forming the insulating layer comprises forming a polymer layer.

6. The method of claim 5 , wherein forming the polymer layer comprises forming a fluorinated carbon polymer layer.

7. The method of claim 1 , wherein forming the insulating layer comprises forming more than one insulating layer.

8. The method of claim 1 , wherein forming the insulating layer comprises forming a dielectric layer.

9. The method of claim 8 , wherein forming the dielectric layer comprises forming an oxide layer.

10. The method of claim 1 , wherein placing the wafer comprises placing the wafer onto a carrier tape attached to a frame.

11. A method of forming an electronic device comprising:
providing a wafer having a plurality of die formed as part of the wafer and separated from each other by spaces;
placing the wafer onto a carrier substrate;
plasma etching the wafer through the spaces to form singulation lines extending into the wafer to form a plurality of singulated die; and
forming an insulating structure on exposed sidewall surfaces of the plurality of singulated die,
wherein plasma etching the wafer and forming the insulating structure are done in one apparatus.

12. The method of claim 11 further comprising attaching a singulated die to a next level of assembly in a chip level package configuration.

13. The method of claim 12 , wherein attaching the singulated die comprises solder attaching the singulated die to the next level of assembly, and wherein the insulating structure is configured to protect the exposed sidewall surfaces from solder used in the solder attaching step.

14. The method of claim 11 , wherein forming the insulating structure comprises forming a polymer structure at least 0.1 microns thick.

15. The method of claim 11 , wherein forming the insulating structure comprises forming a dielectric structure.

16. The method of claim 11 , wherein placing the wafer onto a carrier substrate comprises placing the wafer onto a carrier tape attached to a frame.

17. A method of forming an electronic device comprising:
providing a wafer having a plurality of die formed as part of the wafer and separated from each other by spaces;
placing the wafer onto a carrier substrate;
plasma etching the wafer through the spaces to form singulation lines extending into the wafer to form a plurality of singulated die; and
forming an insulating structure on exposed sidewall surfaces of the plurality of singulated die while the wafer is attached to the carrier substrate,
wherein plasma etching the wafer and forming the insulating structure are done in one apparatus.

18. The method of claim 17 wherein placing the wafer onto the carrier substrate comprises placing the wafer onto a carrier tape attached to a frame.

19. The method of claim 17 , wherein
forming the insulating structure comprises forming more than one insulating layer;
a first insulating layer comprises a polymer; and
a second insulating layer comprises an oxide.

20. The method of claim 17 further comprising attaching a singulated die to a next level of assembly in a chip level package configuration.

Assignees

• Semiconductor Components Ind

Inventors

• Carney Francis J

Classifications

• H10W72/926

  Multiple bond pads having different sizes · CPC title

• H10P72/0446

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title

• H10P54/00 Primary

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10W72/072

  of bump connectors · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title