Electronic component and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-9384900-B2
Application number	US-201414185977-A
Country	US
Kind code	B2
Filing date	Feb 21, 2014
Priority date	Aug 26, 2011
Publication date	Jul 5, 2016
Grant date	Jul 5, 2016

Abstract

An electronic component includes a metal case with an opening at one end, a metal foil placed in an internal space of the metal case, a packing made of an elastic material and fit into the opening of the metal case, the packing having a through-bore, a cap made of a foamed material and provided at an outer side of the packing, a conductive tab inserted in the through-bore of the packing and connected at one end to the metal foil in the internal space of the metal case, and a lead with a first end connected to another end of the conductive tab and a second end projecting externally from the metal case.

First claim

The invention claimed is:

1. An electronic component comprising:
a metal case with an opening at one end;
a metal foil placed in an internal space of the metal case;
a packing made of an elastic material and fit into the opening of the metal case, the packing having a through-bore,
a cap made of a foamed material and provided at an outer side of the packing, wherein the cap is provided outside the metal case and has a thickness and a density that prevent external scattering of whiskers and that absorb or discharge a gas produced from a capacitor element inside the metal case;
a conductive tab inserted in the through-bore of the packing and connected at one end to the metal foil in the internal space of the metal case; and
a lead with a first end connected to another end of the conductive tab and a second end projecting externally from the metal case.

2. The electronic component according to claim 1 , wherein the cap is made of a sponge-like non-conductive material.

3. The electronic component according to claim 2 , wherein the cap contains activated carbon.

4. The electronic component according to claim 3 , wherein the lead is welded to the conductive tab.

5. The electronic component according to claim 4 , wherein the first end of the lead is welded to said other end of the conductive tab, and a welded part between the conductive tab and the lead is positioned so as not to be exposed outside the cap.

6. The electronic component according to claim 4 , wherein the first end of the lead is welded to said other end of the conductive tab, and a welded part between the conductive tab and the lead is positioned inside the through-bore of the packing.

7. The electronic component according to claim 4 , wherein the first end of the lead is welded to said other end of the conductive tab, and a welded part between the conductive tab and the lead is positioned at or near a boundary between the packing and the cap.

8. The electronic component according to claim 1 , wherein the cap and the packing are integrally caulked by a peripheral rim of the metal case and secured to the opening of the metal case.

9. A manufacturing method of an electronic component, comprising:
connecting a conductive tab welded to a lead to a metal foil to fabricate an element having the lead;
inserting the lead of the element into a through-bore of an elastic packing;
placing the element and the packing in a metal case from an opening provided at one end of the metal case; and
sealing the metal case at the opening with the packing and a cap, the cap being made of a foamed material and provided on an outer side of the packing, such that the lead extends to the external of the metal case, wherein the cap is provided outside the metal case and has a thickness and a density that prevent external scattering of whiskers and that absorb or discharge a pas produced from a capacitor element inside the metal case.

10. The method according to claim 9 , further comprising:
crimping a peripheral rim of the metal case to integrally caulk the packing and the cap.

Assignees

• Fujitsu Ltd

Inventors

• Nakashima Tomokazu
• Itoh Masayuki

Classifications

• H01G9/0029

  Processes of manufacture · CPC title

• H01G9/10 Primary

  Sealing, e.g. of lead-in wires · CPC title

• H01G9/008

  Terminals · CPC title

• Y10T29/417

  Cross-Sectional Technologies · mapped topic