Heat dissipation device having lateral-spreading heat dissipating and shunting heat conductive structure

Patent metadata

Field	Value
Publication number	US-9383146-B2
Application number	US-201213554075-A
Country	US
Kind code	B2
Filing date	Jul 20, 2012
Priority date	Jul 20, 2012
Publication date	Jul 5, 2016
Grant date	Jul 5, 2016

Abstract

A heat dissipation device having lateral-spreading heat dissipating and shunting heat conductive structure, in which the central area of heat conductive interface of the heat dissipation device where a heat generating unit being disposed is installed with a close-loop shunting heat conductive structure, so the heat at the central area of the heat generating unit can be conducted to a distal heat dissipating segment for being dissipated to the exterior, thereby through working with the heat dissipation operation of the heat dissipation structure at the periphery of the heat generating unit and led to the distal heat dissipating segment, the temperature distribution at the central area and the peripheral area of the heat generating unit can be more even.

First claim

The invention claimed is:

1. A heat dissipation device comprising:
a lateral-spreading heat dissipating structure ( 102 ) having a base structure, said base structure having a top surface and a bottom surface;
a closed-loop shunting heat conductive structure ( 103 ) having a first end and a second end;
a distal heat dissipating segment ( 104 ) configured to dissipate heat to an exterior of the heat dissipation device, said distal heat dissipating segment ( 104 ) connected to at least one end of the lateral-spreading heat dissipating structure ( 102 ); and
a heat generating unit ( 101 ), said heat generating unit connected to the top surface or the bottom surface of the base structure,
wherein the first end of the closed-loop shunting heat conductive structure ( 103 ) is connected on the opposite surface of the base structure than the heat generating unit ( 101 ) and the second end of the closed-loop shunting heat conductive structure ( 103 ) is connected to the distal heat dissipating segment ( 104 ) so that heat generated from the heat generating unit ( 101 ) is conductable through the closed-loop shunting heat conductive structure ( 103 ) and through the lateral-spreading heat dissipating structure ( 102 ) to the distal heat dissipating segment ( 104 ) to be dissipated to the exterior of the heat dissipation device, and
wherein the lateral-spreading heat dissipating structure ( 102 ) comprises a different heat-conductive material than the closed-loop shunting heat conductive structure ( 103 ).

2. The heat dissipation device according to claim 1 , wherein the heat dissipation device comprises a heat conductive material selected from the group consisting of aluminum, copper, a metal alloy, and ceramic material.

3. The heat dissipation device according to claim 1 , wherein the heat generating unit is provided at a center of the base structure, and
wherein the first end of the closed-loop shunting heat conductive structure is connected to a central area at the center of the base structure of the lateral-spreading heat dissipating structure.

4. The heat dissipation device according to claim 1 , wherein the heat generating unit comprises at least one of a lamp configured to emit light and generate heat as a result of the emission of light, an electrically-charged heating member, or a heat conductive material configured to receive heat from a source external to the heat dissipation device, wherein the heat generating unit is installed at a center area on the bottom surface of the base structure, wherein said lateral-spreading heat dissipating structure extends radially and outwardly from the center area of the base structure and said distal heat dissipating segment extends upwardly from the base structure so that heat is conductable to the distal heat dissipating segment to dissipate the heat to the exterior.

5. The heat dissipation device according to claim 1 , wherein the closed-loop shunting heat conductive structure comprises a heat conductive material, and said closed-loop shunting heat conductive structure being combined or welded with the base structure of the heat dissipation device proximate to the heat generating unit and at a combining location with the distal heat dissipating segment.

6. The heat dissipation device according to claim 1 , wherein the base structure of the lateral-spreading heat dissipating structure has a first end and a second end, wherein the heat generating unit is provided proximate the first end of the base structure at the bottom surface of the base structure, and the first end of the closed-loop shunting heat conductive structure is connected to the first end of the base structure and the distal heat dissipating segment is connected to the second end of the base structure.

7. The heat dissipation device according to claim 6 , wherein the distal heat dissipating segment extends upwardly away from either the top surface or the bottom surface of the base structure.

8. The heat dissipation device according to claim 1 , wherein the distal heat dissipating segment extends upwardly away from either the top surface or the bottom surface of the base structure, wherein the heat generating unit is provided at a center of the lateral-spreading heat dissipating structure, wherein the first end of the closed-loop shunting heat conductive structure is connected to the base structure at the center of the lateral-spreading heating dissipating structure and the second end of the closed-loop shunting heat conductive structure is connected to the upwardly extending distal heat dissipating segment in a way such that a temperature difference at the center of the lateral-spreading heat dissipating structure and a distal location of the distal heat dissipating segment is reduced.

9. The heat dissipation device according to claim 1 , wherein the heat dissipation device is formed as a U-shaped plate shaped, a circular cup-like shaped, a polygonal cup-like shaped, or formed in a fork-like cup-shaped structure.

10. The heat dissipation device according to claim 1 , further comprising at least a second heat generating unit, wherein the heat generating unit and the at least one second heat generating unit are annularly arranged on the base structure around a center of the base structure of the lateral-spreading heat dissipating structure, wherein the distal heat dissipating segment extends upwardly away from either the top surface or the bottom surface of the base structure, wherein the first end of the closed-loop shunting heat conductive structure is connected to the base structure proximate to the center of the base structure and the second end of the closed-loop shunting heat conductive structure is connected to a distal end of the upwardly extending distal heat dissipating segment in a way such that a temperature difference at the center of the lateral-spreading heat dissipating structure and the distal location of the distal heat dissipating segment is reduced.

11. The heat dissipation device according to claim 10 , further comprising a central airflow aperture at a center of the base structure, wherein the heat generating unit and the at least one second heat generating unit are annularly arranged on the base structure around a periphery of the central airflow aperture.

12. The heat dissipation device according to claim 11 , wherein the central airflow aperture is formed as a single aperture or plural aperture structure.

13. The heat dissipation device according to claim 12 , wherein the plural aperture structure includes plural individual apertures or net-like apertures or grid-like apertures.

14. The heat dissipation device according to claim 10 , wherein the base structure further comprises at least two airflow aperture formed at an outer periphery of the base structure.

15. The heat dissipation device according to claim 1 , wherein the heat dissipation device has a U-shaped structure, wherein at least one of the closed-loop shunting heat conductive structure and the distal heat dissipating segment comprises at least one airflow aperture, and wherein a top edge of the distal heat dissipating segment is formed with a multiple-surface or annular or tooth-like crown or fork-like structure.

16. The heat dissipation device according to claim 1 , wherein the heat dissipation device has a U-shaped structure, wherein at least one of the closed-loop shunting heat conductive structure and the distal heat dissipating segment comprise a radial grid heat dissipation space.

17. The heat dissipation device according to claim 1 , wherein the heat dissipation device has a tubular structure, where

Assignees

• Yang Tai-Her

Inventors

• Yang Tai-Her

Classifications

• H10W40/22 Primary

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title

• F21V29/74

  with fins or blades · CPC title

• F28F3/06 Primary

  the means being attachable to the element · CPC title

• F21K9/00

  Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers · CPC title