Light-emitting device and production method for synthetic resin globe for said light-emitting device

Patent metadata

Field	Value
Publication number	US-9383074-B2
Application number	US-201213703788-A
Country	US
Kind code	B2
Filing date	Mar 16, 2012
Priority date	Mar 16, 2011
Publication date	Jul 5, 2016
Grant date	Jul 5, 2016

Abstract

A synthetic resin globe for a light-emitting device is produced by molding an intermediate product with an injection molding die, softening the intermediate product in a heating apparatus, expanding it with compressed air in a die to form a globe shape, transferring a concavo-convex shape formed in a core of the injection molding die to form a concavo-convex shape on an inner wall of the intermediate product, so that the concavo-convex shape can be easily formed into a desired shape in a lower part of an inner wall of the globe.

First claim

The invention claimed is:

1. A light-emitting device comprising:
a base;
a semiconductor light-emitting element mounted on the base;
a globe covering the base and the semiconductor light-emitting element;
a reflection plate, above the semiconductor light emitting element and covered by the globe, positioned to direct light generated by the semiconductor light-emitting element to a lower position of the globe lower than the reflection plate, and not to reflect the light generated by the semiconductor light-emitting element to an upper position of the globe higher than the reflection plate; and
a concavo-convex part located on the globe only at the lower position of the globe lower than the reflection plate, wherein
the reflection plate comprises a first reflection plate and a second reflection plate,
the first reflection plate is positioned directly above the semiconductor light-emitting element,
the second reflection plate is provided separately from the first reflection plate and positioned above the first reflection plate, and
the first reflection plate has a window part as an opening in the reflection plate, and a light emitted from the semiconductor light-emitting element goes to the second reflection plate through the first reflection plate via the window part.

2. The light-emitting device according to claim 1 , comprising a plurality of said semiconductor light emitting element, wherein
the first reflection plate is arranged corresponding to each of the semiconductor light-emitting elements.

3. The light-emitting device according to claim 1 , further comprising a heat sink which includes a portion positioned under the base and a portion positioned under the globe.

4. The light-emitting device according to claim 1 , wherein
a height of the concavo-convex part is 0.1 mm or less from the inner wall of the globe.

5. The light-emitting device according to claim 1 , wherein
the concavo-convex part comprises a first concavo-convex part and a second concavo-convex part provided on the first concavo-convex part.

6. The light-emitting device according to claim 5 , comprising a plurality of the first and second concavo-convex parts, wherein
the second concavo-convex parts are provided on the first concavo-convex parts, respectively.

7. The light-emitting device according to claim 5 , wherein
the first concavo-convex part and the second concavo-convex part each have a spherical shape.

8. The light-emitting device according to claim 7 , wherein
a height of the second concavo-convex part is 0.15 mm or less from a surface of the first concavo-convex part.

9. The light-emitting device according to claim 3 , wherein:
the globe includes an insertion part inserted in the heat sink and having an outer wall with a stepped part; and
a thickness of the stepped part is smaller than a thickness of the globe.

10. The light-emitting device according to claim 9 , wherein
the stepped part is provided between a light passage part of the globe and the insertion part.

11. The light-emitting device according to claim 9 , wherein
a thickness of a lower part of the stepped part is smaller than ⅔ of a thickness of an upper part of the stepped part.

12. The light-emitting device according to claim 9 , wherein
a thickness of a lower part of the stepped part is 0.4 mm or more.

13. The light-emitting device according to claim 1 , wherein
a side surface part of the globe corresponding to a position of the semiconductor light-emitting element expands outward,
a part of the globe positioned above the semiconductor light-emitting element has a spherical shape, and
a shape of the globe is front-back and left-side symmetrical.

14. The light emitting device according to claim 1 , wherein the concavo-convex part includes a semispherical shape or a Fresnel lens shape.

15. The light emitting device according to claim 1 , wherein the concavo-convex part is on an inner wall of the globe.

16. A light-emitting device comprising:
a base;
a semiconductor light-emitting element mounted on the base;
a globe covering the base and the semiconductor light-emitting element;
a reflection plate, above the semiconductor light emitting element and covered by the globe, which reflects light generated from the semiconductor light-emitting element; and
a concavo-convex part located on the globe only at a lower position of the globe lower than the reflection plate,
wherein a thickness of the globe at a higher position than the reflection plate is thinner than a combined thickness of the concavo-convex part and the globe at the lower position,
the reflection plate comprises a first reflection plate and a second reflection plate,
the first reflection plate is positioned directly above the semiconductor light-emitting element,
the second reflection plate is provided separately from the first reflection plate and positioned above the first reflection plate, and
the first reflection plate has a window part as an opening in the reflection plate, and a light emitted from the semiconductor light-emitting element goes to the second reflection plate through the first reflection plate via the window part.

17. The light emitting device according to claim 16 , wherein the concavo-convex part is on an inner wall of the globe.

18. The light-emitting device according to claim 1 , wherein the second reflection plate is positioned nearer a center of the globe than the first reflection plate.

19. The light-emitting device according to claim 1 , wherein the first reflection plate reflects the light to a lower direction while the second reflection plate reflects the light to a lateral direction.

20. The light-emitting device according to claim 1 , wherein a surface shape of the first reflection plate for reflecting the light is different from a surface shape of the second reflection plate for reflecting the light.

Assignees

• Kadoriku Shinji
• Murase Ryoma
• Panasonic Ip Man Co Ltd

Inventors

• Kadoriku Shinji
• Murase Ryoma

Classifications

• B29C49/0691

  using sheet like material, e.g. sheet blow-moulding from joined sheets · CPC title

• B29L2031/747

  Lightning equipment · CPC title

• F21V29/004

  Mechanical Engineering · mapped topic

• B29C49/06

  Injection blow-moulding · CPC title

• B29C2793/009

  after shaping · CPC title