Integrated laser material processing cell

Patent metadata

Field	Value
Publication number	US-9381603-B2
Application number	US-201314100855-A
Country	US
Kind code	B2
Filing date	Dec 9, 2013
Priority date	Oct 12, 2006
Publication date	Jul 5, 2016
Grant date	Jul 5, 2016

Abstract

An integrated laser material processing cell allowing laser-assisted machining to be used in conjunction with directed material deposition in a single setup, achieving greater geometric accuracy and better surface finish than currently possible in existing laser freeform fabrication techniques. The integration of these two processes takes advantage of their common use of laser beam heat to process materials. The cell involves a multi-axis laser-assisted milling machine having a work spindle, a laser emitter, and means for positioning the emitter with respect to the spindle so as to direct a laser beam onto a localized area of a work piece in proximity to a cutting tool mounted in the spindle. A powder delivery nozzle mounted on the machine and positioned adjacent to the emitter delivers powder to a deposition zone in the path of the beam, such that material deposition and laser-assisted milling may be performed substantially simultaneously in a single workspace.

First claim

What is claimed is:

1. A process for integrating machining with directed material deposition, comprising:
positioning a primary laser emitter within a workspace;
positioning a powder delivery nozzle within said workspace and adjacent said primary laser emitter;
delivering powder material through said nozzle onto a substrate within said workspace;
melting said material into a solidified layer with heat from a laser beam emitted from said primary laser emitter;
positioning a cutting tool within said workspace, over said substrate and adjacent said solidified layer;
heating said solidified layer adjacent said cutting tool to a temperature that facilitates material removal with said cutting tool; and
cutting material from said solidified layer with said cutting tool;
wherein said melting and cutting are performed substantially simultaneously.

2. The process of claim 1 , wherein said heating incorporates heat retained by said solidified layer during said melting.

3. The process of claim 1 , wherein said heating is carried out by laser beam heating.

4. The process of claim 1 , further comprising supporting the primary laser emitter and the cutting tool on a single gantry.

5. The process of claim 4 , wherein said powder delivery nozzle is mounted to said primary laser emitter.

6. The process of claim 1 , wherein said powder delivery nozzle is supported by the gantry.

7. A process for integrating machining with directed material deposition, comprising:
supporting a substrate on a cell support within a workspace;
positioning a primary laser emitter on a cell support within said workspace;
positioning a powder delivery nozzle on the cell support within said workspace and adjacent said primary laser emitter;
positioning a cutting tool on the cell support within said workspace;
delivering powder material through said nozzle onto a substrate within said workspace;
melting said material into a solidified layer with heat from a laser beam emitted from said primary laser emitter;
positioning the cutting tool over said substrate and adjacent said solidified layer; and
cutting material from said solidified layer with said cutting tool;
wherein said melting and cutting are performed when said substrate is supported on the cell support.

8. The process of claim 7 , further comprising heating said solidified layer adjacent said cutting tool to a temperature that facilitates material removal with said cutting tool.

9. The process of claim 8 , wherein said heating incorporates heat retained by said solidified layer during said melting.

10. The process of claim 9 , wherein said heating is carried out by laser beam heating.

11. The process of claim 7 , further comprising supporting the primary laser emitter and the cutting tool on independent z-axes linear stages on the cell support.

12. The process of claim 11 , wherein said powder delivery nozzle is mounted to said primary laser emitter.

13. The process of claim 11 , wherein the primary laser emitter is further supported on a rotary stage.

14. A work cell for integrating machining with directed material deposition, comprising:
a cell support having a fixture to support a substrate within a workspace, the cell support further configured to support, within the workspace, a primary laser emitter, a powder deliver nozzle, and a cutting tool;
the powder delivery nozzle disposed adjacent said primary laser emitter and configured to deliver powder material onto the substrate when the substrate is supported on the fixture;
the primary laser emitter configured emit a laser beam to melt said material into a solidified layer;
the cutting tool disposed over the substrate when the substrate is supported on the fixture, the cutting tool configured to cutting material from said solidified layer with said cutting tool;
wherein said melting and cutting are performed when said substrate is supported on the fixture.

15. The work cell of claim 14 , further comprising a gantry configured to support the primary laser emitter and the cutting tool.

16. The work cell of claim 15 , further comprising independent z-axis linear stages on the gantry configured to support the primary laser emitter and the cutting tool.

17. The work cell of claim 16 , further comprising a secondary laser emitter configured to emit a laser beam to heat said solidified layer while said cutting tool cuts material from said solidified layer.

Assignees

• Purdue Research Foundation

Inventors

• Shin Yung C

Classifications

• B23K26/00

  Working by laser beam, e.g. welding, cutting or boring · CPC title

• B23K26/147

  Features outside the nozzle for feeding the fluid stream towards the workpiece · CPC title

• B23K35/0244

  Powders, particles or spheres; Preforms made therefrom · CPC title

• B23K26/0093

  combined with mechanical machining or metal-working covered by other subclasses than B23K · CPC title

• B23K26/34 Primary

  Laser welding for purposes other than joining · CPC title