Electromagnetic interference suppressor

US9380736B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9380736-B2
Application numberUS-201214126912-A
CountryUS
Kind codeB2
Filing dateJun 14, 2012
Priority dateJun 17, 2011
Publication dateJun 28, 2016
Grant dateJun 28, 2016

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

According to the present invention, there are provided an electromagnetic interference suppression material capable of exhibiting a good low-pass filter characteristic in an extensive frequency band ranging from a low frequency to a high frequency, and an electromagnetic interference suppression sheet using the electromagnetic interference suppression material. When laminating a conductive layer having a surface electrical resistance of 100 to 5000Ω/□ in which 5 to 25% by volume of a conductive carbon is mixed, and a magnetic layer having a magnetic permeability with an actual number portion of 3 to 45 in which a magnetic material is mixed, to each other, it is possible to obtain an electromagnetic interference suppression sheet suitable for high-density packaging of electronic equipments which is excellent in low-pass filter characteristic in a near electromagnetic field.

First claim

Opening claim text (preview).

The invention claimed is: 1. An electromagnetic interference suppressor consisting of: a conductive layer comprising a conductive filler and a resin, and a magnetic layer comprising soft magnetic particles and a resin, the conductive layer and the magnetic layer being laminated to each other, in which the conductive layer has a surface electrical resistance of 100 to 5000 Ω/□, wherein the conductive filler is a conductive carbon, and a content of the conductive filler in the conductive layer is 5 to 25% by volume, and wherein a transmission loss of the electromagnetic interference suppressor having a thickness of not more than 100 μm in a measurement using a microstripline fitted thereto is not more than 3 dB as measured at 500 MHz and not less than 10 dB as measured at 3 GHz. 2. The electromagnetic interference suppressor according to claim 1 , wherein an actual number portion of a complex magnetic permeability of the magnetic layer as measured at 100 MHz is 3 to 45. 3. The electromagnetic interference suppressor according to claim 1 , wherein the soft magnetic particles are formed of at least one material selected from the group consisting of carbonyl iron, magnetite, spinel ferrite and Sendust. 4. The electromagnetic interference suppressor according to claim 1 , wherein the conductive layer having a thickness of 20 to 100 μm and the magnetic layer having a thickness of 50 to 200 μm are laminated to each other.

Assignees

Inventors

Classifications

  • Composite [nonstructural laminate] of inorganic material having metal-compound-containing layer and having defined magnetic layer · CPC title

  • H05K9/0088Primary

    comprising a plurality of shielding layers; combining different shielding material structure · CPC title

  • Absolute thicknesses specified · CPC title

  • Polymer of monoethylenically unsaturated hydrocarbon · CPC title

  • Of metal · CPC title

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Frequently asked questions

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What does patent US9380736B2 cover?
According to the present invention, there are provided an electromagnetic interference suppression material capable of exhibiting a good low-pass filter characteristic in an extensive frequency band ranging from a low frequency to a high frequency, and an electromagnetic interference suppression sheet using the electromagnetic interference suppression material. When laminating a conductive laye…
Who is the assignee on this patent?
Yamamoto Kazumi, Toda Kogyo Corp
What technology area does this patent fall under?
Primary CPC classification H05K9/0088. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 28 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).