Packaging structure and method of packaging tunable laser device, and tunable laser device

Patent metadata

Field	Value
Publication number	US-9379518-B2
Application number	US-201514666705-A
Country	US
Kind code	B2
Filing date	Mar 24, 2015
Priority date	Aug 28, 2014
Publication date	Jun 28, 2016
Grant date	Jun 28, 2016

Abstract

The present disclosure provides a packaging structure and a method of packaging an tunable laser device, and an tunable laser device. The packaging structure of the tunable laser device may include a TO tube base and a TO tube cap, wherein a first thermal sink is disposed on the TO tube base, a semiconductor laser chip is disposed on a vertical side of the first thermal sink, an aspheric lens is disposed on the TO tube cap, and the semiconductor laser chip is disposed on a central axis of the aspheric lens; and wherein the vertical side of the first thermal sink is a side of the first thermal sink perpendicular to the TO tube base. The tunable laser device according to the present disclosure may be applicable to communication over an optical fiber.

First claim

The invention claimed is:

1. A packaging structure of a tunable laser device, comprising:
a TO tube base;
a TO tube cap;
a first thermal sink disposed on the TO tube base;
a semiconductor laser chip disposed on a vertical side of the first thermal sink;
an aspheric lens disposed on the TO tube cap;
a thermoelectric cooler disposed on the TO tube base;
a temperature sensor disposed on the first thermal sink; and
a Distributed Bragg Reflector disposed in the semiconductor laser chip;
wherein the semiconductor laser chip is disposed on a central axis of the aspheric lens, the vertical side of the first thermal sink is perpendicular to the TO tube base, a horizontal side of the first thermal sink is disposed on the thermoelectric cooler, and the horizontal side of the first thermal sink is parallel to the TO tube base.

2. The packaging structure according to claim 1 , the packaging structure further comprising: a second thermal sink, wherein the semiconductor laser chip is disposed on the second thermal sink, and the second thermal sink is disposed on the vertical side of the first thermal sink.

3. The packaging structure according to claim 1 , the packaging structure further comprising: a backlight monitor disposed on the horizontal side of the first thermal sink.

4. The packaging structure according to claim 2 , wherein the temperature sensor is disposed on the second thermal sink.

5. The packaging structure according to claim 1 , the packaging structure further comprising: at least 7 pins disposed on the TO tube base.

6. A method of packaging a tunable laser device comprising a semiconductor laser chip, a first thermal sink, an aspheric lens, a TO tube base, a TO tube cap, a temperature sensor, a backlight monitor, a thermoelectric cooler, and a Distributed Bragg Reflector disposed in the semiconductor laser chip, the packaging method comprising:
soldering the semiconductor laser chip on a vertical side of the first thermal sink, the vertical side of the first thermal sink perpendicular to the TO tube base;
soldering the temperature sensor on the vertical side of the first thermal sink;
adhering the backlight monitor on a horizontal side of the first thermal sink, the horizontal side of the first thermal sink parallel to the TO tube base;
soldering the first thermal sink on the thermoelectric cooler;
soldering the thermoelectric cooler on the TO tube base;
connecting above soldered components with pins of the TO tube base;
soldering the aspheric lens on the TO tube cap; and
soldering the TO tube cap soldered with the aspheric lens on the TO tube base.

7. The packaging method according to claim 6 , wherein the tunable laser device further comprises a second thermal sink; and
soldering the temperature sensor on the vertical side of the first thermal sink comprises:
soldering the temperature sensor on the second thermal sink; and
soldering the second thermal sink on the vertical side of the first thermal sink.

8. A tunable laser device, comprising:
a packaging structure comprising a TO tube base and a TO tube cap;
a first thermal sink disposed on the TO tube base;
a semiconductor laser chip disposed on a vertical side of the first thermal sink;
an aspheric lens disposed on the TO tube cap;
a thermoelectric cooler disposed on the TO tube base;
a temperature sensor disposed on the first thermal sink; and
a Distributed Bragg Reflector disposed in the semiconductor laser chip;
wherein the semiconductor laser chip is disposed on a central axis of the aspheric lens, the vertical side of the first thermal sink is perpendicular to the TO tube base, a horizontal side of the first thermal sink is disposed on the thermoelectric cooler, and the horizontal side of the first thermal sink is parallel to the TO tube base.

9. The tunable laser device according to claim 8 , wherein the tunable laser device comprises a second thermal sink, the semiconductor laser chip is disposed on the second thermal sink, and the second thermal sink is disposed on the vertical side of the first thermal sink.

10. The tunable laser device according to claim 8 , wherein the tunable laser device comprises a backlight monitor disposed on the horizontal side of the first thermal sink.

11. The tunable laser device according to claim 9 , wherein the temperature sensor is disposed on the second thermal sink.

12. The tunable laser device according to claim 8 , wherein the tunable laser device comprises at least 7 pins disposed on the TO tube base.

Assignees

• Hisense Broadband Multimedia Technologies Co Ltd
• Hisense Usa Corp
• Hisense Int Co Ltd

Inventors

• Gao Zhenqiu

Classifications

• H01S5/02469

  Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC · CPC title

• H01S5/068

  Stabilisation of laser output parameters (H01S5/0625 takes precedence) · CPC title

• H01S5/042

  Electrical excitation {; Circuits therefor (monolithically integrated laser drive components H01S5/0261)} · CPC title

• H01S5/02415 Primary

  by using a thermo-electric cooler [TEC], e.g. Peltier element · CPC title

• H01S5/0612

  controlled by temperature · CPC title