Connector

US9379499B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9379499-B2
Application numberUS-201514794149-A
CountryUS
Kind codeB2
Filing dateJul 8, 2015
Priority dateAug 22, 2014
Publication dateJun 28, 2016
Grant dateJun 28, 2016

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A connector comprising: a first insulator substrate; a first contact configured by arranging a plurality of contact pins including contact pins for differential signals as an array, on a top surface of the first insulator substrate; a second insulator substrate; a second contact configured by arranging a plurality of contact pins including contact pins for differential signals as an array in the same direction as the array direction of the first contact, on an undersurface of the second insulator substrate; and a metal plate sandwiched by an undersurface of the first insulator substrate and a top surface of the second insulator substrate; and one or more holes are formed in an area on the metal plate, the area being sandwiched by the contact pins for differential signals of the first and second contacts facing each other.

First claim

Opening claim text (preview).

What is claimed is: 1. A connector comprising: a first insulator substrate; a first contact configured by arranging a plurality of contact pins including contact pins for differential signals as an array, on a top surface of the first insulator substrate; a second insulator substrate; a second contact configured by arranging a plurality of contact pins including contact pins for differential signals as an array in the same direction as the array direction of the first contact, on an undersurface of the second insulator substrate; and a metal plate sandwiched by an undersurface of the first insulator substrate and a top surface of the second insulator substrate; wherein the contact pins for differential signals of the first contact and the contact pins for differential signals of the second contact are arrayed in the same order so as to face each other; and one or more holes in an arbitrary shape and with a size smaller than a circle having a diameter corresponding to one-fourth of the wavelength of the differential signals are formed in an area on the metal plate, the area being sandwiched by the contact pins for differential signals of the first and second contacts facing each other. 2. The connector according to claim 1 , wherein positions in the first and second contacts that come into contact with contacts of a counterpart connector when the connector is engaged with the counterpart connector are assumed as first contact points and second contact points, respectively; and the holes are formed in an area other than an area sandwiched by the first contact points and the second contact points.

Assignees

Inventors

Classifications

  • Four or more poles · CPC title

  • with resilient means for engaging mating connector · CPC title

  • containing contact members forming a right angle · CPC title

  • H01R24/60Primary

    Contacts spaced along planar side wall transverse to longitudinal axis of engagement · CPC title

Patent family

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External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9379499B2 cover?
A connector comprising: a first insulator substrate; a first contact configured by arranging a plurality of contact pins including contact pins for differential signals as an array, on a top surface of the first insulator substrate; a second insulator substrate; a second contact configured by arranging a plurality of contact pins including contact pins for differential signals as an array in th…
Who is the assignee on this patent?
Hosiden Corp
What technology area does this patent fall under?
Primary CPC classification H01R24/60. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 28 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).