Sacrificial pre-metal dielectric for self-aligned contact scheme

Patent metadata

Field	Value
Publication number	US-9379210-B2
Application number	US-201514883457-A
Country	US
Kind code	B2
Filing date	Oct 14, 2015
Priority date	Sep 8, 2014
Publication date	Jun 28, 2016
Grant date	Jun 28, 2016

Abstract

Various embodiments herein relate to formation of contact etch stop layers in the context of forming gates and contacts. In certain embodiments, a novel process flow is used, which may involve the deposition and removal of a sacrificial pre-metal dielectric material before a particular contact etch stop layer is formed. An auxiliary contact etch stop layer may be used in addition to a primary etch stop layer that is deposited previously. In certain cases the contact etch stop layer is a metal-containing material such as a nitride or an oxide. The contact etch stop layer may be deposited through a cyclic vapor deposition in some embodiments. The process flows disclosed herein provide improved protection against over-etching gate stacks, thereby minimizing gate-to-contact leakage. Further, the disclosed process flows result in wider flexibility in terms of materials and deposition conditions used for forming various dielectric materials, thereby minimizing parasitic capacitance.

First claim

What is claimed is:

1. A method of fabricating a transistor, the method comprising:
(a) forming a plurality of dummy gate structures adjacent to a plurality of electrical contact regions for source and/or drain regions, each dummy gate structure comprising a dielectric spacer separating one of the contact regions and a dummy gate abutting the spacer;
(b) forming a sacrificial pre-metal dielectric over the plurality of dummy gate structures and adjacent electrical contact regions;
(c) removing the dummy gates while substantially preserving the spacers and the sacrificial pre-metal dielectric positioned over the electrical contact regions;
(d) forming replacement gates where the dummy gates were located;
(e) removing the sacrificial pre-metal dielectric, wherein after removing the sacrificial pre-metal dielectric, a plurality of replacement gate structures and the adjacent electrical contact regions are exposed, each of the replacement gate structures comprising a replacement gate and an associated dielectric spacer;
(f) forming a contact etch stop layer over the plurality of replacement gate structures and adjacent electrical contact regions;
(g) forming a replacement pre-metal dielectric over the contact etch stop layer; and
(h) selectively etching through the replacement pre-metal dielectric and contact etch stop layer to expose the electrical contact regions without exposing the replacement gates.

2. The method of claim 1 , wherein each of the electrical contact regions comprises either (i) an active region or (ii) a primary contact etch stop layer and an underlying active region.

3. The method of claim 1 , wherein the dummy gate comprises a silicon portion and a cap layer comprising SiN, SiCN, or SiCO.

4. The method of claim 1 , wherein forming the sacrificial pre-metal dielectric comprises depositing a pre-metal dielectric material over the dummy gate structures and adjacent contact regions, and planarizing the deposited pre-metal dielectric material.

5. The method of claim 1 , wherein the sacrificial pre-metal dielectric comprises silicon dioxide.

6. The method of claim 5 , wherein the silicon dioxide is doped or made porous.

7. The method of claim 1 , wherein forming the replacement gates comprises:
depositing a replacement gate material over the sacrificial pre-metal dielectric and in regions where the dummy gates resided; and
planarizing the deposited replacement metal gate material to remove it from regions over the sacrificial pre-metal dielectric.

Assignees

• Lam Res Corp

Inventors

• Mountsier Thomas Weller
• Van Schravendijk Bart J
• Banerji Ananda K
• Shankar Nagraj

Classifications

• H10P50/283

  by chemical means · CPC title

• H10P50/73

  using masks for insulating materials · CPC title

• H10P14/69391

  the material containing aluminium, e.g. Al2O3 · CPC title

• H10P14/6939

  characterised by the metal · CPC title

• H10P14/6339

  deposition by cyclic CVD, e.g. ALD, ALE or pulsed CVD · CPC title