Crystalline multilayer structure and semiconductor device
US-2015279927-A1 · Oct 1, 2015 · US
US9379190B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9379190-B2 |
| Application number | US-201414577986-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 19, 2014 |
| Priority date | May 8, 2014 |
| Publication date | Jun 28, 2016 |
| Grant date | Jun 28, 2016 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
Provided is a crystalline multilayer structure which has good electrical properties and is useful for semiconductor devices. A crystalline multilayer structure includes a base substrate and a crystalline oxide semiconductor thin film disposed directly on the base substrate or with another layer therebetween and including a corundum-structured oxide semiconductor as a major component. The oxide semiconductor contains indium and/or gallium as a major component. The crystalline oxide semiconductor thin film contains germanium, silicon, titanium, zirconium, vanadium, or niobium.
Opening claim text (preview).
The embodiments of the invention in which an exclusive property or privilege is claimed are defined as follows: 1. A crystalline multilayer structure comprising: a base substrate; and a crystalline oxide semiconductor thin film disposed directly on the base substrate or with another layer therebetween and comprising a corundum-structured oxide semiconductor as a major component, wherein the oxide semiconductor contains one or both of indium or gallium as a major component, and wherein the crystalline oxide semiconductor thin film contains germanium and is substantially free of carbon. 2. The crystalline multilayer structure of claim 1 , wherein the crystalline oxide semiconductor thin film contains germanium. 3. The crystalline multilayer structure of claim 1 , wherein a concentration of germanium in the crystalline oxide semiconductor thin film is 1×10 16 /cm 3 to 1×10 22 /cm 3 . 4. The crystalline multilayer structure of claim 1 , wherein a concentration of germanium in the crystalline oxide semiconductor thin film is 1×10 17 /cm 3 or less. 5. The crystalline multilayer structure of claim 1 , wherein a concentration of germanium in the crystalline oxide semiconductor thin film is 1×10 20 /cm 3 or more. 6. The crystalline multilayer structure of claim 1 , wherein the oxide semiconductor is α-phase In X Al Y Ga Z O 3 in which 0≦X≦2, 0≦Y≦2, 0≦Z≦2, X+Y+Z=1.5 to 2.5, and 0<X or 0<Z. 7. A semiconductor device comprising the crystalline multilayer structure of claim 1 . 8. A semiconductor device comprising the crystalline multilayer structure of claim 1 and an electrode. 9. A semiconductor device comprising: a semiconductor layer comprising a crystalline oxide semiconductor thin film containing a corundum-structured oxide semiconductor as a major component; and an electrode, wherein the oxide semiconductor contains one or both of indium or gallium as a major component, and wherein the crystalline oxide semiconductor thin film contains germanium and is substantially free of carbon. 10. The semiconductor device of claim 7 , wherein the semiconductor device is a vertical device. 11. The semiconductor device of claim 7 , wherein the semiconductor device is a power device. 12. The semiconductor device of claim 7 , wherein the semiconductor device is a Schottky barrier diode (SBD), a metal semiconductor field-effect transistor (MESFET), a high-electron-mobility transistor (HEMT), a metal oxide semiconductor field-effect transistor (MOSFET), a static induction transistor (SIT), a junction field-effect transistor (JFET), an insulated gate bipolar transistor (IGBT), or a light-emitting diode (LED). 13. The semiconductor device of claim 7 , wherein the semiconductor device is a Schottky barrier diode (SBD), a metal oxide semiconductor field-effect transistor (MOSFET), a metal semiconductor field-effect transistor (MESFET), a high-electron-mobility transistor (HEMT), or a static induction transistor (SIT).
Oxides · CPC title
Transition metal elements; Rare earth elements · CPC title
Doping during depositing · CPC title
being oxide semiconductor materials (Group IIB-VIA semiconductor materials H10P14/3424) · CPC title
Crystal orientations · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.