Electronic device package and fabricating method thereof
US-2024347575-A1 · Oct 17, 2024 · US
Method for forming image sensing device
US9379153B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9379153-B2 |
| Application number | US-76546010-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 22, 2010 |
| Priority date | Apr 22, 2010 |
| Publication date | Jun 28, 2016 |
| Grant date | Jun 28, 2016 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A method for forming an image sensing device is disclosed, including providing a molding apparatus, disposing a lens in the molding apparatus, injecting an injection material into a chamber of the molding apparatus to form a shell which is connected to the lens, opening the chamber of the molding apparatus to remove the lens and the shell connected to the lens, and assembling the shell with an image sensing element.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for forming an image sensing device, comprising: providing a molding apparatus; disposing a lens in the molding apparatus; injecting an injection material into a chamber of the molding apparatus to form a shell which is connected to the lens; and assembling the shell with an image sensing element, wherein the lens is formed before injecting the injection material into the chamber; and wherein the injection material is doped with a plurality of metal particles. 2. A method for forming an image sensing device, comprising providing a molding apparatus; disposing a lens in the molding apparatus; injecting an injection material into a chamber of the molding apparatus to form a shell which is connected to the lens; and assembling the shell with an image sensing element, wherein the lens is formed before injecting the injection material into the chamber; forming a metal layer on the lens before injecting the injection material into the chamber of the molding apparatus. 3. A method for forming an image sensing device, comprising: providing a molding apparatus; disposing a lens in the molding apparatus; injecting an injection material into a chamber of the molding apparatus to form a shell which is connected to the lens; assembling the shell with an image sensing element, wherein the lens is formed before injecting the injection material into the chamber; and forming a recess in the shell; wherein the image sensing element is formed by the steps of: providing a substrate; forming a photoelectric element array on the substrate; forming a micro lens array on the photoelectric element array; forming a covering substrate over the substrate and the photoelectric element array; forming a spacer for supporting the covering substrate; and forming a plurality of solder balls under the substrate. 4. The method for forming an image sensing device as claimed in claim 3 , wherein assembling the shell with the image sensing element comprises fitting the covering substrate of the image sensing element into the recess of the shell. 5. A method for forming an image sensing device, comprising: providing a molding apparatus; disposing a lens in the molding apparatus; injecting an injection material into a chamber of the molding apparatus to form a shell which is connected to the lens; assembling the shell with an image sensing element, wherein the lens is formed before injecting the injection material into the chamber; wherein providing the molding apparatus further comprising: providing a bottom mold; forming a top mold over the bottom mold; forming a base between the top mold and the bottom mold, wherein the bottom mold comprises a first protruding portion and a second protruding portion on the first protruding portion. 6. The method for forming an image sensing device as claimed in claim 5 , further comprising disposing a height adjusting element on the second protruding portion before injecting the injection material into the chamber of the molding apparatus. 7. The method for forming an image sensing device as claimed in claim 5 , further comprising adjusting height of the first protruding portion of the molding apparatus before injecting the injection material into the chamber of the molding apparatus.
Assignees
Inventors
Classifications
Manufacture or treatment of image sensors covered by group H10F39/12 · CPC title
- H10F39/804Primary
Containers or encapsulations · CPC title
Electricity · mapped topic
Electricity · mapped topic
- H01L27/14618Primary
Electricity · mapped topic
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9379153B2 cover?
- A method for forming an image sensing device is disclosed, including providing a molding apparatus, disposing a lens in the molding apparatus, injecting an injection material into a chamber of the molding apparatus to form a shell which is connected to the lens, opening the chamber of the molding apparatus to remove the lens and the shell connected to the lens, and assembling the shell with an …
- Who is the assignee on this patent?
- Deng Jau-Jan, Chen Wei-Ping, Chiu Jui-Yi, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification H10F39/804. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jun 28 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).