Substrate processing apparatus
US-2024269862-A1 · Aug 15, 2024 · US
Substrate holding mechanism, substrate transporting device, and semiconductor manufacturing apparatus
US9378997B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9378997-B2 |
| Application number | US-201514670749-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 27, 2015 |
| Priority date | Mar 31, 2014 |
| Publication date | Jun 28, 2016 |
| Grant date | Jun 28, 2016 |
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Abstract
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A substrate holding mechanism includes a substrate holding claw for holding the substrate. The substrate holding claw includes a slant face for sliding the substrate thereon. Height of the slant face is increased from the inside of a space for holding the substrate toward the outside of the space. A crossing angle formed by a direction in which a machining mark is formed on the slant face and a direction in which the substrate is slid is not less than 0 degree and not more than 45 degrees at least in a partial region of the slant face.
First claim
Opening claim text (preview).
What is claimed is: 1. A substrate holding mechanism comprising: a substrate holding claw for holding the substrate, wherein the substrate holding claw includes a slant face for sliding the substrate thereon, height of the slant face being increased from the inside of a space for holding the substrate toward the outside of the space, wherein a machining mark including at least one of a linear mark and substantially parallel marks is formed on the slant face, and wherein a crossing angle of a direction in which the at least one of the linear mark and the substantially parallel marks is formed and a direction in which the substrate is slid is not less than 0 degree and not more than 45 degrees at least in a partial region of the slant face. 2. The substrate holding mechanism according to claim 1 , wherein the crossing angle is not more than 30 degrees. 3. The substrate holding mechanism according to claim 1 , wherein the crossing angle is 0 degree. 4. The substrate holding mechanism according to claim 1 , wherein the at least one of the linear mark and the substantially parallel marks is formed substantially in parallel to a direction in which the slant face is slanted. 5. A substrate turnover device comprising: a substrate holding mechanism including a substrate holding claw for holding the substrate, wherein the substrate holding claw includes a slant face for sliding the substrate thereon, height of the slant face being increased from the inside of a space for holding the substrate toward the outside of the space, wherein a machining mark including at least one of a linear mark and substantially parallel marks is formed on the slant face, and wherein a crossing angle of a direction in which the at least one of the linear mark and the substantially parallel marks is formed and a direction in which the substrate is slid is not less than 0 degree and not more than 45 degrees at least in a partial region of the slant face. 6. A substrate transporting device comprising: a substrate holding mechanism including a substrate holding claw for holding the substrate, wherein the substrate holding claw includes a slant face for sliding the substrate thereon, height of the slant face being increased from the inside of a space for holding the substrate toward the outside of the space, wherein a machining mark including at least one of a linear mark and substantially parallel marks is formed on the slant face, and wherein a crossing angle of a direction in which the at least one of the linear mark and the substantially parallel marks is formed and a direction in which the substrate is slid is not less than 0 degree and not more than 45 degrees at least in a partial region of the slant face. 7. A semiconductor manufacturing apparatus comprising: a substrate holding mechanism including a substrate holding claw for holding the substrate, wherein the substrate holding claw includes a slant face for sliding the substrate thereon, height of the slant face being increased from the inside of a space for holding the substrate toward the outside of the space, wherein a machining mark including at least one of a linear mark and substantially parallel marks is formed on the slant face, and wherein a crossing angle of a direction in which the at least one of the linear mark and the substantially parallel marks is formed and a direction in which the substrate is slid is not less than 0 degree and not more than 45 degrees at least in a partial region of the slant face. 8. A substrate holding mechanism comprising: a substrate holding claw for holding the substrate, wherein the substrate holding claw includes a slant face for sliding the substrate thereon, height of the slant face being increased from the inside of a space for holding the substrate toward the outside of the space, wherein a machining mark including at least one of a linear mark and substantially parallel marks is formed on the slant face, and wherein a crossing angle of a direction in which the at least one of the linear mark and the substantially parallel marks is formed and a direction in which the substrate is slid is not less than 0 degree and not more than 45 degrees at least in a partial region of the slant face, and wherein the at least one of the linear mark and the substantially parallel marks is formed substantially in parallel to a direction in which the slant face is slanted.
Assignees
Inventors
Classifications
characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title
- H10P72/7602Primary
the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title
Electricity · mapped topic
- H01L21/68707Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9378997B2 cover?
- A substrate holding mechanism includes a substrate holding claw for holding the substrate. The substrate holding claw includes a slant face for sliding the substrate thereon. Height of the slant face is increased from the inside of a space for holding the substrate toward the outside of the space. A crossing angle formed by a direction in which a machining mark is formed on the slant face and a…
- Who is the assignee on this patent?
- Ebara Corp
- What technology area does this patent fall under?
- Primary CPC classification H10P72/7602. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jun 28 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).