Substrate processing apparatus and substrate processing method using processing solution

Patent metadata

Field	Value
Publication number	US-9378988-B2
Application number	US-201213539626-A
Country	US
Kind code	B2
Filing date	Jul 2, 2012
Priority date	Jul 20, 2011
Publication date	Jun 28, 2016
Grant date	Jun 28, 2016

Abstract

Nozzle arms for holding discharge heads are caused by a pivotal driving part to move between a processing position above a substrate and a standby position outside a processing cup surrounding a substrate. When the nozzle arms having cleaned a substrate is placed at the standby position, a cleaning solution is ejected from a shower nozzle toward the nozzle arms arranged obliquely downward of the shower nozzle. The three nozzle arms are caused to move up and down such that the nozzle arms cut across a jet of a cleaning solution discharged obliquely downward, thereby cleaning the three nozzle arms in order. Then, a nitrogen gas is ejected from a drying gas nozzle and sprayed on the nozzle arms to remove the cleaning solution attached to the nozzle arms, thereby drying the nozzle arms.

First claim

What is claimed is:

1. A substrate processing method that supplies a processing solution to a substrate, comprising the steps of
(a) causing a plurality of nozzle arms to pivot such that a discharge head arranged at the tip end thereof moves between a processing position and a standby position, the discharge head discharging a processing solution to a substrate held on a substrate holding element in a substantially horizontal position while being caused to rotate by the substrate holding element, the processing position being above a substrate held on said substrate holding element, the standby position being outside a cup surrounding said substrate holding element, said plurality of nozzle arms being arranged in parallel to each other in a horizontal direction, and
(b) cleaning at least part of said plurality of nozzle arms that are to face a substrate held on said substrate holding element when said discharge head has moved to said processing position, wherein
in said step (b), while a cleaning solution is ejected obliquely downward from a shower nozzle when said discharge head is at said standby position, said plurality of nozzle arms are caused to move up and down such that said plurality of nozzle arms cut across a jet of the cleaning solution discharged from said shower nozzle, and thereby, the cleaning solution is sprayed on all of said plurality of nozzle arms in order.

2. The substrate processing method according to claim 1 , wherein said shower nozzle ejects a cleaning solution in a direction away from said substrate holding element.

3. The substrate processing method according to claim 1 , further comprising the step of
(c) ejecting a drying gas to be sprayed on at least part of said plurality of nozzle arms having received a cleaning solution ejected from said shower nozzle to dry this part of said plurality of nozzle arms.

4. The substrate processing method according to claim 3 , wherein in said step (c), a drying gas is sprayed first on the tip end of said plurality of nozzle arms when said discharge head is at said standby position.

Assignees

• Osada Naoyuki
• Sugimoto Kentaro
• Screen Holdings Co Ltd

Inventors

• Osada Naoyuki
• Sugimoto Kentaro

Classifications

• H10P72/0408

  for drying · CPC title

• H10P72/0406

  for cleaning followed by drying, rinsing, stripping, blasting or the like · CPC title

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• B08B3/041

  Cleaning travelling work · CPC title

• B08B3/022

  Cleaning travelling work (B08B3/042 takes precedence) · CPC title