Thermal interface material handling for thermal control of an electronic component under test

Patent metadata

Field	Value
Publication number	US-9377486-B2
Application number	US-201414229808-A
Country	US
Kind code	B2
Filing date	Mar 28, 2014
Priority date	Mar 28, 2014
Publication date	Jun 28, 2016
Grant date	Jun 28, 2016

Abstract

Thermal interface material handing is described for thermal control of an electronic component under test. In one example, a thermal control unit is adapted to control the temperature of at least a portion of an electronic component during testing. A pedestal between the thermal control unit and the electronic component conducts heat from the electronic component to the thermal head. A conduit extends through a portion of the pedestal, to permit the flow of a liquid thermal interface material from an external source to a space between the pedestal and the electronic component. The liquid thermal interface material improves heat conduction between the electronic component and the pedestal. An elastomeric seal between the electronic device and the pedestal constrains the thermal interface fluid within the space between the electronic component and the pedestal.

First claim

What is claimed is:

1. A system comprising:
a thermal control unit adapted to control the temperature of at least a portion of an electronic component during testing, the electronic component comprising a die attached to a substrate and a filler on the substrate around the perimeter of the die;
a pedestal between the thermal control unit and the electronic component, the pedestal being attached to the thermal control unit for thermal conduction to conduct heat from the electronic component to the thermal control unit, the pedestal defining a trench to carry an elastomeric seal and a cavity near the trench and surrounding the die, the pedestal applying a mechanical load against the electronic component during testing;
a liquid thermal interface material from an external source in a space between the pedestal and the electronic component, the liquid thermal interface material to improve heat conduction between the electronic component and the pedestal; and
the elastomeric seal in the trench and extending between the electronic component and the pedestal to form a seal against the filler and around the cavity and to constrain the thermal interface fluid within the cavity and the space between the electronic component and the pedestal during testing, the elastomeric seal also absorbing some of the mechanical load between the pedestal and the electronic component during testing.

2. The system of claim 1 , wherein the pedestal includes a surface adapted to make thermal contact with the electronic component, the surface including a plurality of grooves therein.

3. The system of claim 2 , wherein the plurality of grooves are in a crossing pattern.

4. The system of claim 1 , wherein the pedestal includes a surface adapted to make thermal contact with the electronic component, the surface being polished to be substantially flat.

5. The system of claim 1 , wherein the elastomeric seal extends around the periphery of the die.

6. The system of claim 1 , wherein the elastomeric seal extends from the pedestal to the substrate.

7. The system of claim 1 , wherein the filler comprises a fillet around the outer edge of the die.

8. The system of claim 1 , wherein the elastomeric seal has a beveled edge to seal against the electronic component.

9. The system of claim 1 , further comprising a first pump to pump air into the space between the electronic component and the pedestal and a second pump to remove the liquid thermal interface material from the space.

10. The system of claim 9 , wherein the first pump is coupled to a conduit in the pedestal near a center of the electronic component and the second pump is coupled to the periphery of the electronic component.

11. The system of claim 9 , wherein the first pump is coupled to the periphery of the electronic component and the second pump is coupled to a conduit in the pedestal near a center of the electronic component.

12. A silicon device test apparatus comprising:
a thermal head having a thermal control unit adapted to control the temperature of at least a portion of an electronic component during testing, the electronic component having a die mounted to a substrate and a filler on the substrate around the perimeter of the die;
a pedestal of the thermal head between the thermal control unit and the die, the pedestal being attached to the thermal control unit for thermal conduction to conduct heat from the die to the thermal head, the pedestal defining a trench to carry an elastomeric seal and a cavity near the trench and surrounding the die, the pedestal applying a mechanical load against the electronic component during testing;
a liquid thermal interface material from an external source in a space between the pedestal and the die, the liquid thermal interface material to improve heat conduction between the die and the pedestal during a test of the die;
a removal conduit extending through a portion of the pedestal and coupled to a pump to remove the liquid thermal interface material from the space after the test of the die;
the elastomeric seal in the trench and extending between the substrate and the pedestal to form a seal against the filler and around the cavity and to constrain the thermal interface fluid within cavity and the space between the electronic component and the pedestal the elastomeric seal being fastened to the pedestal and pressed against the substrate by the pedestal to seal against the substrate during testing, the elastomeric seal also absorbing some of the mechanical load between the pedestal and the electronic component during testing;
a test bed to connect to the die through the substrate; and
a controller to drive the test of the die through the test bed.

13. The test apparatus of claim 12 , wherein the filler comprises a fillet along the perimeter of the die and wherein the elastomeric seal contacts the fillet.

14. The test apparatus of claim 12 , further comprising a second pump coupled to a pressure conduit to pump air into the space between the electronic component to remove the liquid thermal interface material from the space, the pressure conduit having an outlet near a center of the electronic component and the removal conduit being coupled to the periphery of the electronic component.

15. The system of claim 1 , wherein the thermal control unit comprises heaters and a liquid cooling system to control the temperature of the electronic component.

16. The system of claim 1 , further comprising a conduit extending through a portion of the pedestal to permit the flow of the thermal interface material from the external source into the space between the pedestal and the electronic component.

Assignees

• Song David Won-Jun
• Schroeder Christopher Roy
• Walczyk Joseph
• Kress Lothar
• Young Todd Michael
• Bennett Robert Levi
• Krishnamoorthy Arun
• Diglio Paul Jonathan
• Fulton Charles Clifton
• Chigullapalli Sruti
• Intel Corp

Inventors

• Song David Won-Jun
• Schroeder Christopher Roy
• Walczyk Joseph
• Kress Lothar
• Young Todd Michael
• Bennett Robert Levi
• Krishnamoorthy Arun
• Diglio Paul Jonathan
• Fulton Charles Clifton
• Chigullapalli Sruti

Classifications

• G01R31/2601

  Apparatus or methods therefor (G01R31/2607, G01R31/2642 take precedence) · CPC title

• G01R1/04 Primary

  Housings; Supporting members; Arrangements of terminals · CPC title

• G01R31/2874 Primary

  related to temperature · CPC title

• G01R1/07307

  with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card · CPC title