LED luminaire assembly

Patent metadata

Field	Value
Publication number	US-9377173-B2
Application number	US-201113092039-A
Country	US
Kind code	B2
Filing date	Apr 21, 2011
Priority date	Apr 21, 2010
Publication date	Jun 28, 2016
Grant date	Jun 28, 2016

Abstract

A light emitting diode (LED) module having a configurable LED substrate capable of receiving varying numbers and layouts of LEDs are described herein. The LED substrate includes LED coupling points for receiving the LEDs and electrical traces etched into the substrate for routing power to the LEDs. The LED module can include a multi-LED over-optic having multiple over-optics that are configured to match the number and configuration of the LEDs positioned on the substrate. The LED coupling points and over-optics can be arranged symmetrically to enable the LED module to be rotated to adjust the light output distribution and direction. The LED module can include a power connection mechanism, for example located at the center of the substrate, that also allows the LED module to be rotated. One or more of the LED modules may be mounted on a heat sink and incorporated into a light fixture.

First claim

What is claimed is:

1. An illumination device, comprising:
a substrate;
at least one electrical trace disposed directly on the substrate;
a plurality of LED coupling points formed directly on the at least one electrical trace, each LED coupling point electrically coupled to the electrical trace; and
a multi-LED over-optic comprising a base surface and a plurality of discrete over-optics, wherein the base surface comprises one or more mounting elements between at least two of the discrete over-optics, the mounting elements being in contact with the substrate,
wherein each of the plurality of discrete over-optics has a substantially concave shape defining a cavity, the cavity having a closed end defined by the discrete over-optic and an open end facing towards the substrate, the closed end of the cavity of the discrete over-optic extending from a top surface of the multi-LED over-optic in a direction away from the substrate, and wherein the open ends of two or more of the cavities are in fluid communication via an internal volume between the multi-LED over-optic and substrate.

2. The illumination device of claim 1 , further comprising a plurality of LEDs electrically coupled to one or more of the LED coupling points, wherein each of the one or more discrete over-optic is configured to be positioned over one of the LEDs.

3. The illumination device of claim 1 , wherein at least one of the LED coupling points comprises a jumper electrically coupling one of the at least one electrical trace to another of the at least one electrical trace.

4. The illumination device of claim 1 , wherein the substrate comprises a plurality of through-holes and the multi-LED over-optic comprises at least one mounting post, and wherein the mounting post is configured to be positioned through one of the through-holes and extend beyond a bottom of the one through-hole to align the substrate with the multi-LED over-optic.

5. The illumination device of claim 4 , wherein the substrate comprises four through-holes and the multi-LED over-optic comprises two mounting posts, and wherein the location of the four through-holes and two mounting posts are configured to allow the multi-LED over-optic to rotate relative to the substrate by positioning the two mounting posts in two of the four through-holes.

6. The illumination device of claim 4 , further comprising a heat sink comprising:
a mounting surface; and
a plurality of fins extending away from the mounting surface;
wherein the heat sink is removably coupled to the substrate and the multi-LED over-optic.

7. The illumination device of claim 6 , wherein the heat sink comprises a plurality of mounting holes, each mounting hole configured to receive one of the mounting posts to releasably couple and align the heat sink with the substrate and the multi-LED module.

8. The illumination device of claim 7 , wherein the heat sink further comprises a plurality of slots disposed along the mounting surface;
wherein the substrate further comprises a plurality of mounting holes;
wherein the multi-LED over-optic further comprises a plurality of mounting holes; and
wherein when the at least one mounting hole of the heat sink receives the mounting posts of the multi-LED over-optic, the mounting holes of the substrate and the mounting holes of the multi-LED over-optic are aligned and at least a portion of the aligned mounting holes are aligned with at least one of the slots of the heat sink.

9. The illumination device of claim 1 , wherein the LED coupling points are electrically coupled in series by the at least one electrical trace.

10. The illumination device of claim 1 , wherein the at least one electrical trace comprises a plurality of sets of electrical traces, each set of electrical traces being electrically coupled to a portion of the LED coupling points.

11. The illumination device of claim 1 , further comprising an electrical connector for receiving power for the LED coupling points, the electrical connector being electrically coupled to the at least one electrical trace.

12. The illumination device of claim 11 , wherein the substrate comprises an aperture disposed at the center of the substrate for receiving an electrical wire configured to couple to the electrical connector.

13. The illumination device of claim 11 , wherein the electrical connector comprises at least one electrical contact disposed on a bottom surface of the substrate for coupling to a power wire.

14. The illumination device of claim 11 , wherein the electrical connector comprises two pins extending from a bottom surface of the substrate, the two pins configured to engage two sockets of an electrical connector electrically coupled to a power source.

15. The illumination device of claim 11 , wherein the electrical connector comprises a TRS connector disposed at the center of the substrate and extending from a bottom side of the substrate, the TRS connector configured to engage a TRS socket electrically coupled to a power source.

16. The illumination device of claim 11 , wherein the electrical connector comprises at least one pair of contacts, each of the at least one pair of contacts disposed on one side of the substrate, the at least one pair of contacts configured to make electrical contact with a pair of contacts coupled to a bus bar carrying electrical power.

17. The illumination device of claim 16 , wherein the bus bar is disposed on an insulator bar positioned on a mounting surface of a heat sink, the insulator bar insulating the heat sink from the bus bar.

18. The illumination device of claim 1 , wherein the substrate is comprised in a light bar.

19. A light module, comprising:
a substrate;
a plurality of LEDs coupled to the substrate; and
a multi-LED over-optic comprising a base surface and a plurality of discrete over-optics, wherein each discrete over-optic has a substantially concave shape defining a cavity, the cavity having a closed end defined by the discrete over-optic and an open end facing towards the substrate, the closed end of the cavity of the discrete over-optic extending from the multi-LED over-optic in a direction away from the substrate, the cavity surrounded by the base surface, and wherein at least a portion of the base surface is in contact with the substrate in between at least two of the discrete over-optics, an internal volume is formed between another portion of the base surface and the substrate, wherein the cavities of the at least two discrete over-optics are in fluid communication via the internal volume, and wherein at least one of the plurality of LEDs is optically aligned with one of the cavities.

20. The light module of claim 19 , wherein the internal volume forms a recess in the multi-LED over-optic.

21. The light module of claim 19 , wherein the internal volume reduces susceptibility of the multi-LED over-optic to browning, burning out, failure, or any combination thereof.

22. The light module of claim 19 , wherein an aperture is formed in the substrate, the aperture configured to receive at least two electrical wires.

23. The light module of claim 19 , wherein the multi-LED over-optic comprises a raised cavity configured to receive at least a portion of an electrical connector.

24. A light module, comprising:
a substrate;
a plurality of LEDs coupled to the substrate;
a multi-LED over-optic comprising a plurality of discrete over-optics, wherein each discrete over-optic forms a cavity on a base surface of the mu

Assignees

• Lehman Gregg Arthur
• Carney Anthony James
• Patrick Ellis
• Chan Chun Wah
• Ladewig Christopher
• Wright Timothy Glen
• Bryant Christopher Michael
• Diegues Victor
• Cooper Technologies Co

Inventors

• Lehman Gregg Arthur
• Carney Anthony James
• Patrick Ellis
• Chan Chun Wah
• Ladewig Christopher
• Wright Timothy Glen
• Bryant Christopher Michael
• Diegues Victor

Classifications

• F21Y2105/10

  comprising a two-dimensional [2D] array of point-like light-generating elements · CPC title

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title

• F21V19/003

  Fastening of light source holders, e.g. of circuit boards or substrates holding light sources · CPC title

• H05K1/0287

  having an universal lay-out, e.g. pad or land grid patterns or mesh patterns · CPC title

• F21V17/12

  by screwing · CPC title