Thermosetting furan resin composition and furan resin laminated body using the same

US9376543B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9376543-B2
Application numberUS-201314387756-A
CountryUS
Kind codeB2
Filing dateMar 21, 2013
Priority dateMar 26, 2012
Publication dateJun 28, 2016
Grant dateJun 28, 2016

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  1. Title

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Abstract

Official abstract text for this publication.

A thermosetting furan resin composition comprising furan based resin (A), curing catalyst (B), and additive (C) that is a normal salt including a strong acid and a strong base is offered. The abovementioned additive (C) preferably has a solubility in water of 30 g/100 g H2O at 20° C. Furthermore, the abovementioned additive (C) is at least one selected from the group consisting of sodium chloride, potassium chloride, lithium chloride, sodium bromide, potassium bromide, lithium bromide, sodium sulfate, potassium sulfate, lithium sulfate, sodium nitrate, potassium nitrate, and lithium nitrate, or a mixture thereof. The content of the abovementioned additive (C) is 0.2-10 parts by weight based on the aforementioned furan based resin (A) being 100 parts by weight.

First claim

Opening claim text (preview).

The invention claimed is: 1. A thermosetting furan resin composition comprising: a furan based resin (A), a curing catalyst (B), and an additive (C) that is a normal salt comprising a strong acid and a strong base, wherein the additive (C) is at least one selected from the group consisting of sodium chloride, potassium chloride, lithium chloride, sodium bromide, potassium bromide, lithium bromide, sodium sulfate, potassium sulfate, lithium sulfate, sodium nitrate, potassium nitrate, and lithium nitrate, or a mixture thereof, and wherein the content of the additive (C) is 0.5-5 parts by weight based on the furan based resin (A) being 100 parts by weight. 2. The thermosetting furan resin composition according to claim 1 , wherein the aforementioned additive (C) at 20° C. has a solubility in water of 30 g/100 g H2O or greater. 3. The thermosetting furan resin composition according to claim 1 , wherein the water content of the aforementioned thermosetting furan resin composition is 15 wt % or less. 4. The thermosetting furan resin composition according to claim 1 , wherein the aforementioned furan based resin (A) has a viscosity of 100-5000 mPa·s at 25° C. 5. The thermosetting furan resin composition according to claim 1 , wherein the aforementioned furan based resin (A) has a water content of 10 wt % or less, and total content of residual furfuryl alcohol and furfural is 1 wt % or less. 6. The thermosetting furan resin composition according to claim 1 , wherein the aforementioned curing catalyst (B) comprises a thermal reaction-type latent acid curing catalyst (B2) alone, or comprises a mixture of a manifest curing catalyst (B1) and the thermal reaction-type latent acid curing catalyst (B2). 7. The thermosetting furan resin composition according to claim 6 , wherein the aforementioned thermal reaction-type latent acid curing catalyst (B2) is of at least one type selected from the group consisting of inorganic ammonium salts, primary amine salts, secondary amine salts, and tertiary amine salts. 8. The thermosetting furan resin composition according to claim 7 , wherein the aforementioned thermal reaction-type latent acid curing catalyst (B2) is of at least one type selected from the group consisting of ammonium halides, ammonium sulfate, ammonium nitrate, methylammonium halides, dimethylammonium halides, ethylammonium halides, and diethylammonium halides. 9. The thermosetting furan resin composition according to claim 1 , further comprising 5-100 parts by weight of inorganic filler based on the aforementioned furan based resin (A) being 100 parts by weight. 10. The thermosetting furan resin composition according to claim 9 , wherein the aforementioned inorganic filler has a pH of 10 or lower. 11. The thermosetting furan resin composition according to claim 9 , wherein the aforementioned inorganic filler has been subjected to an organosilane surface treatment. 12. The thermosetting furan resin composition according to claim 1 , further comprising a defoaming agent. 13. A furan resin laminated body comprising: a fibrous substrate, and a cured body being cured after the fibrous substrate has been impregnated with the thermosetting furan resin composition according to claim 1 . 14. The thermosetting furan resin composition according to claim 1 , wherein the furan based resin (A) has a water content of 10 wt % or less, a total content of residual furfuryl alcohol and furfural of 1 wt % or less, and a viscosity of 100-5000 mPa·s at 25° C., and wherein the water content of the thermosetting furan resin composition is 15 wt % or less.

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Classifications

  • with silicon-containing compounds · CPC title

  • Sulfates · CPC title

  • Halogen-containing compounds · CPC title

  • Compositions of condensation polymers of aldehydes or ketones (with polyalcohols C08L59/00; with polynitriles C08L77/00); Compositions of derivatives of such polymers · CPC title

  • Oxides; Hydroxides {(graphene oxides C08K3/042)} · CPC title

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What does patent US9376543B2 cover?
A thermosetting furan resin composition comprising furan based resin (A), curing catalyst (B), and additive (C) that is a normal salt including a strong acid and a strong base is offered. The abovementioned additive (C) preferably has a solubility in water of 30 g/100 g H2O at 20° C. Furthermore, the abovementioned additive (C) is at least one selected from the group consisting of sodium chlori…
Who is the assignee on this patent?
Sekisui Chemical Co Ltd
What technology area does this patent fall under?
Primary CPC classification C08K3/30. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jun 28 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).