Laminate, conductive pattern, electrical circuit, and method for producing laminate

Patent metadata

Field	Value
Publication number	US-9374895-B2
Application number	US-201414762783-A
Country	US
Kind code	B2
Filing date	Jan 21, 2014
Priority date	Jan 23, 2013
Publication date	Jun 21, 2016
Grant date	Jun 21, 2016

Abstract

The present invention provides a laminate in which at least a layer including a support, a primer layer, a first conductive layer, an insulating layer, and a second conductive layer are laminated, wherein the insulating layer is formed by coating at least a portion of or entirety of a surface of the first conductive layer with a resin composition and drying the resin composition; and the second conductive layer includes a second plating seed layer formed by coating a portion of or entirety of a surface of the insulating layer with a fluid containing a conductive substance, and a second plating layer formed on a surface of the second plating seed layer. This laminate has high adhesion between layers and allows the high adhesion to be maintained even upon exposure to a high-temperature and high-humidity environment.

First claim

The invention claimed is:

1. A laminate in which at least a layer (A) including a support, a primer layer (B), a first conductive layer (C), an insulating layer (D), and a second conductive layer (E) are laminated, wherein the insulating layer (D) is formed by coating at least a portion of or entirety of a surface of the first conductive layer (C) with a resin composition (d) and drying the resin composition (d); the first conductive layer (C) includes a first plating seed layer (C-1) formed by coating a portion of or entirety of a surface of the primer layer (B) with a fluid (c-1) containing a conductive substance that is a transition metal or a compound of a transition metal, and a first plating layer (C-2) formed on a surface of the first plating seed layer (C-1); and the second conductive layer (E) includes a second plating seed layer (E-1) formed by coating a portion of or entirety of a surface of the insulating layer (D) with a fluid (e-1) containing a conductive substance that is a transition metal or a compound of a transition metal, and a second plating layer (E-2) formed on a surface of the second plating seed layer (E-1).

2. The laminate according to claim 1 , wherein the insulating layer (D) contains at least one resin selected from the group consisting of a urethane resin (d1), a vinyl resin (d2), and a urethane-vinyl composite resin (d3).

3. The laminate according to claim 2 , wherein the urethane-vinyl composite resin (d3) includes a shell layer formed of a urethane resin (d3-1) and a core layer formed of a vinyl resin (d3-2).

4. The laminate according to claim 3 , wherein the urethane resin (d3-1) has 2,000 mmol/kg to 5,500 mmol/kg of an alicyclic structure.

5. The laminate according to claim 1 , wherein the primer layer (B) contains at least one resin selected from the group consisting of a urethane resin (b1), a vinyl resin (b2), and a urethane-vinyl composite resin (b3).

6. The laminate according to claim 5 , wherein the urethane-vinyl composite resin (b3) includes a shell layer formed of a urethane resin (b3-1) and a core layer formed of a vinyl resin (b3-2).

7. The laminate according to claim 6 , wherein the urethane resin (b3-1) has 2,000 mmol/kg to 5,500 mmol/kg of an alicyclic structure.

8. The laminate according to claim 1 , wherein a resin forming the primer layer (B) and the insulating layer (D) has a cross-linkable functional group.

9. The laminate according to claim 8 , wherein the cross-linkable functional group is at least one thermally cross-linkable functional group selected from the group consisting of a methylolamide group and an alkoxymethylamide group.

10. The laminate according to claim 1 , wherein the conductive substances contained in the fluid (c-1) and the fluid (e-1) are silver, and the first plating layer (C-2) and the second plating layer (E-2) are copper plating layers.

11. A conductive pattern comprising the laminate according to claim 1 .

12. An electrical circuit comprising the conductive pattern according to claim 11 .

13. A method for producing a laminate, comprising a step [1] of coating a portion of or entirety of a surface of a support with a primer for forming a primer layer (B), and coating a portion of or entirety of the coated surface with a fluid (c-1) containing a conductive substance to provide a laminate of a layer (A) including the support, the primer layer (B), and a first plating seed layer (C-1); a step [2] of plating a portion of or entirety of a surface of the first plating seed layer (C-1) to form a first conductive layer (C) in which a first plating layer (C-2) is formed on the surface of the first plating seed layer (C-1); a step [3] of coating at least a portion of or entirety of a surface of the first plating layer (C-2) with a resin composition (d) for forming an insulating layer (D) and coating a portion of or entirety of the coated surface with a fluid (e-1) containing a conductive substance to form the insulating layer (D) on a surface of the first conductive layer (C) and to form a second plating seed layer (E-1) on a surface of the insulating layer (D); and a step [4] of plating a portion of or entirety of a surface of the second plating seed layer (E-1) to form a second conductive layer (E) in which a second plating layer (E-2) is formed on the surface of the second plating seed layer (E-1).

Assignees

• Dainippon Ink & Chemicals

Inventors

• Murakawa Akira
• Shirakami Jun
• Fujikawa Wataru
• Saitou Yukie

Classifications

• C08J7/0423

  with at least one layer of inorganic material and at least one layer of a composition containing a polymer binder · CPC title

• Y10T428/12549

  Adjacent to each other · CPC title

• H05K3/246

  Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating · CPC title

• H05K1/0393

  Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title

• H05K3/386

  by the use of an organic polymeric bonding layer, e.g. adhesive · CPC title