Imprinted micro-wire rib structure

Patent metadata

Field	Value
Publication number	US-9374894-B2
Application number	US-201414476005-A
Country	US
Kind code	B2
Filing date	Sep 3, 2014
Priority date	Mar 5, 2013
Publication date	Jun 21, 2016
Grant date	Jun 21, 2016

Abstract

A micro-wire rib structure includes a substrate and a cured layer formed on or over the substrate, the cured layer having a cured-layer surface. A micro-channel is imprinted in the cured layer, the micro-channel having a micro-channel depth, a micro-channel bottom, first and second micro-channel sides, and one or more ribs having opposing rib sides and a rib top defining a rib height less than the micro-channel depth. Each rib is located between the first and second micro-channel sides and extends from the micro-channel bottom toward the cured-layer surface. A cured electrical conductor forming a micro-wire is formed in the micro-channel. The micro-wire extends continuously from the first micro-channel side, over the micro-channel bottom, the rib side(s) and rib top(s) to the second micro-channel side forming a continuous electrical conductor from the first micro-channel side to the second micro-channel side.

First claim

The invention claimed is:

1. A micro-wire rib structure, comprising:
a substrate;
a cured layer formed on or over the substrate, the cured layer haying a cured-layer surface;
a micro-channel imprinted in the cured layer, the micro-channel having a micro-channel depth, a micro-channel bottom, first and second micro-channel sides, and one or more ribs having opposing rib sides and a rib top defining a rib height less than the micro-channel depth, each rib located between the first and second micro-channel sides and extending from the micro-channel bottom toward the cured-layer surface;
a cured electrical conductor forming a micro-wire in the micro-channel, the micro-wire extending continuously from the first micro-channel side, over the micro-channel bottom, the rib side(s) and rib top(s), to the second micro-channel side forming a continuous electrical conductor from the first micro-channel side to the second micro-channel side.

2. The micro-wire rib structure of claim 1 , wherein the cured electrical conductor includes sintered conductive nano-particles.

3. The micro-wire rib structure of claim 1 , wherein the micro-channel includes first and second ribs, the first rib having a first height and the second rib having a second height different from the first height.

4. The micro-wire rib structure of claim 1 , wherein the rib has a rib width and the micro-channel has a micro-channel width and the rib width is less than or equal to 20% of the micro-channel width.

5. The micro-wire rib structure of claim 1 , wherein the micro-channel includes first and second ribs, the first rib having a first width and the second rib having a second width different from the first width.

6. The micro-wire rib structure of claim 1 , wherein the rib height s greater than or equal to one half of the micro-channel depth.

7. The micro-wire rib structure of claim 1 , wherein themicro-channel has a micro-channel width greater than or equal to 20 microns.

8. The micro-wire rib structure of claim 1 , wherein the micro-channel has a micro-channel width greater than or equal to 10 microns.

9. The micro-wire rib structure of claim 1 , wherein the micro-channel has a micro-channel width greater than or equal to 5 microns.

10. The micro-wire rib structure of claim 1 , wherein the distance between the first micro-channel side and the nearest rib side is less than 20 microns.

11. The micro-wire rib structure of claim 1 , wherein the distance between the first micro-channel side and the nearest rib side is less than 10 microns.

12. The micro-wire rib structure of claim 1 , wherein the distance between the first micro-channel side and the nearest rib side is less than 5 microns.

13. The micro-wire rib structure of claim 1 , further including an electrode and a connection pad formed over the substrate, and wherein the micro-wire electrically connects the electrode and the connection pad.

14. The micro-wire rib structure of claim 13 , wherein the micro-wire is a bus.

15. The micro-wire rib structure of claim 13 , further including a plurality of electrodes and micro-wires and a corresponding plurality of connection pads formed over the substrate, a micro-wire connecting each of the electrodes to a corresponding connection pad.

16. The micro-wire rib structure of claim 15 , wherein each micro-wire is separated from an adjacent micro-wire by a distance less than or equal to 50 microns.

17. The micro-wire rib structure of claim 15 , wherein each micro-channel has a width and each micro-wire is separated from an adjacent micro-wire by a distance less than or equal to the width of the micro-channel.

18. The micro-wire rib structure of claim 15 , wherein the substrate is transparent and has a display area and a separate peripheral area and wherein the electrodes are located at least partly in the display area and the micro-wires are located in the peripheral area, and wherein the peripheral area has a lower transparency than the display area.

19. The micro-wire rib structure of claim 15 , wherein the peripheral area has a transparency less than or equal to 80%.

Assignees

• Eastman Kodak Co

Inventors

• Cok Ronald Steven
• Burberry Mitchell Stewart

Classifications

• H05K1/092 Primary

  Dispersed materials, e.g. conductive pastes or inks · CPC title

• H05K1/111

  Pads for surface mounting, e.g. lay-out · CPC title

• H05K2201/0108

  Transparent · CPC title

• G02B5/201 Primary

  in the form of arrays · CPC title

• B29K2995/0021

  Multi-coloured · CPC title