Injection moulded circuit carrier having an integrated circuit board

Patent metadata

Field	Value
Publication number	US-9374891-B2
Application number	US-201214410280-A
Country	US
Kind code	B2
Filing date	Jun 20, 2012
Priority date	Jun 20, 2012
Publication date	Jun 21, 2016
Grant date	Jun 21, 2016

Abstract

An electronic unit has a circuit board that is integrated into an injection molded circuit carrier. A hearing aid is provided with such an electronic unit. In order to reduce the complexity and size of an electronic unit with an injection molded circuit carrier and a circuit board, the circuit board is integrated into the injection molded circuit carrier by introducing the circuit board into the plastic mold such that the surface of a first side of the circuit board lies within the plastic mold and the surface of a second side of the circuit board is substantially flush with the surface of the plastic mold. At least one conductive track of the circuit board is electrically conductively connected to at least one conductive track of the injection molded circuit carrier.

First claim

The invention claimed is:

1. An integrated electronic unit, comprising:
a solid plastic molded part forming an injection-molded circuit carrier, said plastic molded part having electrically conductive tracks on a surface thereof;
a circuit board having a first side, a second side, and at least one conductive track, said circuit board being integrated into said plastic molded part with a surface of said first side of said circuit board lying within said plastic molded part and a surface of said second side of said circuit board being flush with the surface of said plastic molded part;
wherein the surface of said second side of said circuit board lies in a common plane with said surface of said plastic molded part; and
wherein said at least one conductive track of said circuit board is connected electrically conductively to at least one conductive track of said injection-molded circuit carrier.

2. The electronic unit according to claim 1 , wherein said conductive track of said circuit board and said conductive track of said injection-molded circuit carrier are connected by way of one or both of a soldered connection or a connection via electrically conductive adhesive.

3. The electronic unit according to claim 1 , wherein said circuit board is fixed to said plastic molded part by way of a chemical or mechanical fixing means.

4. The electronic unit according to claim 1 , which comprises an electronic component attached directly to said plastic molded part and connected electrically conductively to a conductive track of said injection-molded circuit carrier.

5. The electronic unit according to claim 1 , which comprises at least one surface-mounted component attached on said circuit board and connected electrically conductively to a conductive track of said circuit board.

6. The electronic unit according to claim 5 , wherein said at least one surface-mounted component is an integrated circuit.

7. The electronic unit according to claim 6 , wherein said circuit board is formed with the integrated circuit being an amplifier.

8. The electronic unit according to claim 1 , which comprises at least one microphone attached directly to said plastic molded part and connected electrically conductively to a conductive track of said injection-molded circuit carrier.

9. The electronic unit according to claim 1 , which comprises at least one loudspeaker attached directly to said plastic molded part and connected electrically conductively to a conductive track of said injection-molded circuit carrier.

10. A hearing aid, comprising an electronic unit according to claim 1 .

11. The hearing aid according to claim 10 , which comprises a hearing aid housing, and wherein said plastic molded part of said injection-molded circuit carrier forms a part of said hearing aid housing.

Assignees

• Bartulec Roman
• Kral Holger
• Naumann Frank
• Sivantos Pte Ltd

Inventors

• Bartulec Roman
• Kral Holger
• Naumann Frank

Classifications

• H05K2201/048

  Second PCB mounted on first PCB by inserting in window or holes of the first PCB · CPC title

• H05K1/142

  Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit · CPC title

• H05K2201/09118

  Moulded substrate · CPC title

• H05K2201/10083

  Electromechanical or electro-acoustic component, e.g. microphone · CPC title

• H05K2201/0999

  Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing · CPC title