Electroluminescent device and method of manufacturing thereof

Patent metadata

Field	Value
Publication number	US-9373809-B2
Application number	US-201213479896-A
Country	US
Kind code	B2
Filing date	May 24, 2012
Priority date	May 27, 2011
Publication date	Jun 21, 2016
Grant date	Jun 21, 2016

Abstract

A highly reliable light-emitting device is provided. A light-emitting device in which problems due to a metal mask are prevented is provided. A light-emitting devi in which a problem due to the resistance of an upper electrode layer of a light-emitting element is prevented is provided. An electrode layer is provided over a substrate in advance, and an EL layer and an upper electrode layer are formed in the same pattern without use of a metal mask so as to overlap with the electrode layer. After that, the electrode layer is electrically connected to the upper electrode layer. As a connection method, a laser light irradiation method, a method in which physical pressure is applied, a method in which heating is performed under the state where physical pressure is applied, or the like is used.

First claim

The invention claimed is:

1. A method of manufacturing a light-emitting device comprising:
forming a connection electrode layer on an insulating surface by a printing method, the connection electrode layer comprising a plurality of conductive particles forming a plurality of discrete islands, wherein the plurality of conductive particles form a plurality of peaks and valleys and have an uneven upper surface;
forming a layer containing a light-emitting organic compound over the connection electrode layer;
forming an electrode layer over the layer containing the light-emitting organic compound; and
providing a region in which the electrode layer and the connection electrode layer overlap each other and are electrically connected to each other,
wherein the plurality of conductive particles are metal particles.

2. The method of manufacturing a light-emitting device according to claim 1 , wherein the region is provided with ultrasonic vibration and heat.

3. The method of manufacturing a light-emitting device according to claim 2 ,
wherein a probe provides the region with the ultrasonic vibration and the heat.

4. The method of manufacturing a light-emitting device according to claim 1 , wherein the region comprises a material of the connection electrode layer and the electrode layer.

5. A method of manufacturing a light-emitting device comprising:
forming a first electrode layer on an insulating surface;
forming a connection electrode layer on the insulating surface by a printing method so as to be electrically insulated from the first electrode layer, the connection electrode layer comprising a plurality of conductive particles forming a plurality of discrete islands, wherein the plurality of conductive particles form a plurality of peaks and valleys and have an uneven upper surface;
forming a layer containing a light-emitting organic compound over the first electrode layer and the connection electrode layer;
forming a second electrode layer over the layer containing the light-emitting organic compound; and
providing a region in which the second electrode layer and the connection electrode layer overlap each other and are electrically connected to each other,
wherein the plurality of conductive particles are metal particles.

6. The method of manufacturing a light-emitting device according to claim 5 , further comprising: after the connection electrode layer is electrically connected to the second electrode layer,
applying voltage between the first electrode layer and the second electrode layer to detect a portion with a light-emission defect; and
irradiating the portion with the light-emission defect with laser light to insulate the portion with the light-emission defect.

7. The method of manufacturing a light-emitting device according to claim 5 , wherein the region is provided with ultrasonic vibration and heat.

8. The method of manufacturing a light-emitting device according to claim 7 ,
wherein a probe provides the region with the ultrasonic vibration and the heat.

9. The method of manufacturing a light-emitting device according to claim 5 , wherein the region comprises a material of the connection electrode layer and the second electrode layer.

10. The method of manufacturing a light-emitting device according to claim 5 , wherein the connection electrode layer and the first electrode layer overlap each other.

11. A light-emitting device comprising:
a first substrate;
a first electrode layer and a connection electrode layer over the first substrate, the connection electrode layer comprising a plurality of conductive particles forming a plurality of discrete islands, wherein the plurality of conductive particles form a plurality of peaks and valleys and have an uneven upper surface;
a layer containing a light-emitting organic compound over the first electrode layer and the connection electrode layer;
a second electrode layer over the layer containing the light-emitting organic compound; and
a second substrate over the second electrode layer,
wherein the plurality of conductive particles are metal particles, and

wherein the connection electrode layer is electrically connected to the second electrode layer through a region that is over the connection electrode layer.

12. The light-emitting device according to claim 11 ,
wherein the second electrode layer has a light-transmitting property with respect to light emitted from the layer containing the light-emitting organic compound.

13. The light-emitting device according to claim 11 ,
wherein at least one of the first electrode layer and the second electrode layer has a light-transmitting property with respect to light emitted from the layer containing the light-emitting organic compound.

14. The light-emitting device according to claim 11 , further comprising:
a lens array over the second substrate,
wherein the region is irradiated with laser light.

15. The light-emitting device according to claim 11 , wherein the region comprises a material of the connection electrode layer and the second electrode layer.

16. The light-emitting device according to claim 11 , wherein the connection electrode layer and the first electrode layer overlap each other.

17. The light-emitting device according to claim 11 , further comprising:
a separation layer having an insulating property,
wherein a first light-emitting element comprises the first electrode layer, the connection electrode layer, the layer, and the second electrode layer,
wherein a second light-emitting element comprises:
a third electrode layer and a second connection electrode layer over the first substrate, the second connection electrode layer comprising a plurality of conductive particles, wherein the plurality of conductive particles form a plurality of peaks and valleys;
a second layer containing a light-emitting organic compound over the third electrode layer and the second connection electrode layer; and
a fourth electrode layer over the second layer containing the light-emitting organic compound,
wherein the second connection electrode layer is electrically connected to the fourth electrode layer through a region that is over the second connection electrode layer, and
wherein the second electrode layer and the layer of the first light-emitting element is insulated from the fourth electrode layer and the second layer of the second light-emitting element by using the separation layer.

Assignees

• Adachi Hiroki
• Momma Yohei
• Semiconductor Energy Lab

Inventors

• Adachi Hiroki
• Momma Yohei

Classifications

• H10K59/80522

  combined with auxiliary electrodes · CPC title

• H10K59/80516

  combined with auxiliary electrodes, e.g. ITO layer combined with metal lines · CPC title

• H10K50/814

  combined with auxiliary electrodes, e.g. ITO layer combined with metal lines · CPC title

• H10K71/60 Primary

  Forming conductive regions or layers, e.g. electrodes · CPC title

• H01L51/0023

  Electricity · mapped topic