Light emitting device with light reflecting member having protrusion over bonding ball of wire

Patent metadata

Field	Value
Publication number	US-9373767-B2
Application number	US-201414492513-A
Country	US
Kind code	B2
Filing date	Sep 22, 2014
Priority date	Sep 30, 2013
Publication date	Jun 21, 2016
Grant date	Jun 21, 2016

Abstract

A light emitting device of the invention includes a substrate having a metal on a surface thereof; a light emitting element installed on the surface of the substrate; a wire that connects the light emitting element and the metal; and a light reflecting member that covers the metal, the wire having a first bonding ball that is disposed on a surface of the metal, and an extension that extends above the first bonding ball, and the light reflecting member having a protrusion over the first bonding ball.

First claim

What is claimed is:

1. A light emitting device, comprising:
a substrate having a metal on a surface thereof;
a light emitting element installed on the surface of the substrate;
a wire connecting the light emitting element and the metal; and
a light reflecting member covering the metal,
the wire having a first bonding ball that is disposed on a surface of the metal, and an extension that extends above the first bonding ball, and
the light reflecting member having a shape that creeps up toward the extension to define a protrusion over the first bonding ball.

2. The light emitting device according to claim 1 , wherein
the extension extends in the vertical direction with respect to the surface of the metal.

3. The light emitting device according to claim 1 , wherein
the light reflecting member covers at least part of a side face of the light emitting element.

4. The light emitting device according to claim 1 , wherein
the light reflecting member gradually changes the height toward the protrusion.

5. The light emitting device according to claim 1 , wherein
the substrate has a wall that surrounds the light emitting element, and the light reflecting member covers at least part of the wall.

6. The light emitting device according to claim 1 , further including
a translucent member being disposed so as to cover at least the light emitting element or the light reflecting member.

7. The light emitting device according to claim 6 , wherein
the translucent member includes a fluorescent material.

8. The light emitting device according to claim 1 , wherein
the light emitting element is face-up-mounted on the surface of the substrate, and the wire electrically connects an electrode constituting the light emitting element with the metal.

9. The light emitting device according to claim 1 , wherein
the light reflecting member covers an entire side faces of the light emitting element, and exposes a whole upper face of the light emitting element therefrom.

10. The light emitting device according to claim 1 , wherein
the wire being such that a highest part is disposed between the light emitting element and the first bonding ball, and above the metal where the light emitting elements are not installed.

11. The light emitting device according to claim 1 , wherein
the wire being such that a highest part is disposed at a position closer to the first bonding ball than to the light emitting element.

12. The light emitting device according to claim 1 , wherein
the light reflecting member having the shape that peaks at the extension.

Assignees

• Nichia Corp

Inventors

• Okura Shinya

Classifications

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/07553

  changes in shapes · CPC title