Light emitting device and light emitting device package having the same

Patent metadata

Field	Value
Publication number	US-9373756-B2
Application number	US-201314139452-A
Country	US
Kind code	B2
Filing date	Dec 23, 2013
Priority date	Aug 31, 2009
Publication date	Jun 21, 2016
Grant date	Jun 21, 2016

Abstract

Disclosed are a light emitting device. The light emitting device includes first and second light emitting cells on a conductive support member and having a hole. The first and second light emitting cells includes first and second semiconductor layers, and an active layer. First and second conducive layers are between the first light emitting cell and the conductive support member, and a third and fourth conductive layers are between the second light emitting cell and the conductive support member. First insulating layer is between the second and fourth conductive layers and the conductive support member. Second insulating layer is disposed in the hole. The second conductive layer is electrically connected to the first light emitting cells through the hole and the third conductive layer.

First claim

What is claimed is:

1. A light emitting device comprising:
a plurality of light emitting cells including a first light emitting cell and a second light emitting cell spaced apart from each other, each of the first light emitting cell and the second light emitting cell including a first semiconductor layer, a second semiconductor layer under the first semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer;
a conductive support member under the first light emitting cell and light emitting cell second light emitting cell;
a first conductive layer between the first light emitting cell and the conductive support member;
a second conductive layer between the first conductive layer and the conductive support member;
a third conductive layer between the second light emitting cell and the conductive support member;
a fourth conductive layer between the third conductive layer and the conductive support member;
a first insulating layer between the second conductive layer and the fourth conductive layer, between the second conductive layer and the conductive support member, and between the fourth conductive layer and the conductive support member;
a first hole disposed in the active layer and the second semiconductor layer of the first light emitting cell;
a second hole disposed in the active layer and the second semiconductor layer of the second light emitting cell; and
a second insulating layer disposed in the first hole and the second hole,
wherein the second conductive layer includes a first portion disposed in the first hole and is electrically connected to the first semiconductor layer of the first light emitting cell by the first portion and the third conductive layer.

2. The light emitting device as claimed in claim 1 , further comprising a fifth conductive layer under a lower surface of the first conductive layer of the first light emitting cell.

3. The light emitting device as claimed in claim 2 , wherein the fifth conductive layer is connected to the first conductive layer of the first light emitting cell.

4. The light emitting device as claimed in claim 3 , wherein a first portion of the fifth conductive layer is extended outwardly from a lower portion of the first light emitting cell.

5. The light emitting device as claimed in claim 4 , wherein a first portion of the conductive support member extends under the first portion of the fifth conductive layer.

6. The light emitting device as claimed in claim 4 , further comprising a first electrode disposed on the first portion of the fifth conductive layer.

7. The light emitting device as claimed in claim 1 , further comprising a third insulating layer surrounding side surfaces of the first and second light emitting cells.

8. The light emitting device as claimed in claim 7 , wherein a portion of the third insulating layer is disposed on a top surface of each of the first light emitting cell and the second light emitting cell.

9. The light emitting device as claimed in claim 1 , further comprising a roughness disposed on the first semiconductor layer of each of the first light emitting cell and the second light emitting cell.

10. The light emitting device as claimed in claim 1 , wherein the first semiconductor layer has an n-type dopant and the second semiconductor layer has a p-type dopant.

11. The light emitting device as claimed in claim 1 , wherein the second conductive layer includes a second portion extending under a lower surface of the third conductive layer.

12. The light emitting device as claimed in claim 1 , wherein the conductive support member includes a top surface having a width wider than a sum of widths of the plurality of light emitting cells,
wherein an entire top surface of the conductive support member is formed in a flat surface.

13. The light emitting device as claimed in claim 1 , wherein the plurality of light emitting cells further including a third light emitting cell adjacent to one of the first light emitting cell and the second light emitting cell, wherein the third light emitting cell including the first semiconductor layer, the second semiconductor layer under the first semiconductor layer, and the active layer between the first semiconductor layer and the second semiconductor layer.

14. The light emitting device as claimed in claim 13 , wherein the conductive support member is connected to the first semiconductor layer of the third light emitting cell.

15. The light emitting device as claimed in claim 13 , further comprising a sixth conductive layer between the third light emitting cell and the conductive support member, and
wherein the sixth conductive layer extends to an inner portion of the first semiconductor layer of the third light emitting cell.

16. The light emitting device as claimed in claim 1 , wherein a lower surface of the second semiconductor layer of each of the first light emitting cell and the second light emitting cell is located at a higher position than that of the first conductive layer and the third conductive layer.

17. The light emitting device as claimed in claim 1 , wherein the second conductive layer extends to an inner portion of the first semiconductor layer of the first light emitting cell.

18. The light emitting device as claimed in claim 1 , wherein the fourth conductive layer extends to an inner portion of the first semiconductor layer of the second light emitting cell.

Assignees

• Lg Innotek Co Ltd

Inventors

• Lee Sang Youl
• Bae Jung Hyeok
• Moon Ji Hyung
• Song Jun O

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H10H29/14

  comprising multiple light-emitting semiconductor components · CPC title

• H10H20/018

  Bonding of wafers · CPC title

• H10H20/8312

  extending at least partially through the bodies · CPC title