Semiconductor module and driving device for switching element

Patent metadata

Field	Value
Publication number	US-9373570-B2
Application number	US-201414267513-A
Country	US
Kind code	B2
Filing date	May 1, 2014
Priority date	May 23, 2013
Publication date	Jun 21, 2016
Grant date	Jun 21, 2016

Abstract

A semiconductor module includes: a semiconductor element; first and second main current passages for energizing the semiconductor element, the first and second main current passages being opposed to each other in such a manner that a first energization direction of the first main current passage is opposite to a second energization direction of the second main current passage, or an angle between the first energization direction and the second energization direction is an obtuse angle; and a coil unit sandwiched between the first and second main current passages. The coil unit includes a coil, which generates an induced electromotive force when a magnetic flux interlinks with the coil, the magnetic flux being generated when current flows through the first and second main current passages.

First claim

What is claimed is:

1. A semiconductor module comprising:
a semiconductor element having a switching element with a control terminal;
first and second main current passages for energizing the semiconductor element, the first and second main current passages being opposed to each other in such a manner that a first energization direction of the first main current passage is opposite to a second energization direction of the second main current passage, or an angle between the first energization direction and the second energization direction is an obtuse angle; and
a coil unit sandwiched between the first and second main current passages,
wherein the coil unit includes a coil, which generates an induced voltage when a magnetic flux interlinks with the coil, the magnetic flux being generated when current flows through the first and second main current passages, and
wherein the induced voltage is overlapped on an applied voltage of the control terminal of the switching element.

2. The semiconductor module according to claim 1 ,
wherein the first main current passage includes a first concavity, and the second main current passage includes a second concavity,
wherein the first concavity provides an arrangement space of the coil unit, and the second concavity provides an arrangement space of the coil unit, and
wherein the coil unit is sandwiched between the first concavity and the second concavity, which are opposed to each other.

3. The semiconductor module according to claim 1 , further comprising:
an insulator arranged between the coil unit and each main current passage.

4. The semiconductor module according to claim 1 ,
wherein the coil has a length between both winding ends of the coil,
wherein the length of the coil is equal to or smaller than a passage width of each main current passage, and
wherein the coil unit is arranged within the passage width of each main current passage.

5. The semiconductor module according to claim 1 ,
wherein the semiconductor element is arranged between the first main current passage and the second main current passage, which are opposed to each other.

6. The semiconductor module according to claim 1 ,
wherein the first main current passage has a facing surface and an exposure surface, which is different from the facing surface,
wherein the second main current passage has a facing surface and an exposure surface, which is different from the facing surface,
wherein the facing surface of the first main current passage is opposed to the facing surface of the second main current passage,
wherein the coil unit is sandwiched between the facing surface of the first main current passage and the facing surface of the second main current passage, and
wherein the exposure surface of the first main current passage is exposed from the semiconductor module in order to cool the semiconductor element, and the exposure surface of the second main current passage is exposed from the semiconductor module in order to cool the semiconductor element.

7. The semiconductor module according to claim 1 ,
wherein the coil unit is a winding coil unit, which includes the coil and a core, and
wherein the core is inserted into the coil.

8. A driving device for driving a switching element comprising:
a semiconductor element in a semiconductor module, which is the switching element having a gate as a control terminal, a drain or a collector, and a source or an emitter,
wherein the semiconductor element is energized by first and second main current passages,
wherein the first and second main current passages are opposed to each other in such a manner that a first energization direction of the first main current passage is opposite to a second energization direction of the second main current passage, or an angle between the first energization direction and the second energization direction is an obtuse angle,
wherein a coil unit is sandwiched between the first and second main current passages,
wherein the coil unit includes a coil, which generates an induced voltage when a magnetic flux interlinks with the coil, the magnetic flux being generated when current flows through the first and second main current passages,
wherein the gate, the drain or the collector and the source or the emitter are electrically connected to each other so as to be coupled in a mutual induction manner, and
wherein the induced voltage generated at the coil unit is overlapped on an applied voltage of the gate of the switching element.

9. The driving device according to claim 8 , further comprising:
a Zener diode for clamping the induced voltage.

Assignees

• Denso Corp

Inventors

• Kawahara Hideki
• Imazawa Takanori

Classifications

• H10W90/763

  between laterally-adjacent chips · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/07636

  Soldering or alloying · CPC title

• H10W72/07336

  Soldering or alloying · CPC title