Production method for optical component and optical component

Patent metadata

Field	Value
Publication number	US-9372285-B2
Application number	US-201214117089-A
Country	US
Kind code	B2
Filing date	Apr 4, 2012
Priority date	May 16, 2011
Publication date	Jun 21, 2016
Grant date	Jun 21, 2016

Abstract

A method for manufacturing a light transmissive optical component, includes a first etching process of forming a depressed portion by applying etching to a silicon region of a plate-shaped member, a thermal oxidation process of forming a silicon oxide film by thermally oxidizing an inner side surface of the depressed portion, and a nitride film formation process of forming a silicon nitride film that covers the silicon oxide film. Accordingly, it is possible to realize a manufacturing method for an optical component which is capable of uniformly forming a silicon oxide film on a semi-transmissive reflecting surface which is largely inclined (or nearly vertical) with respect to a substrate surface, and an optical component produced by this method.

First claim

The invention claimed is:

1. A manufacturing method for an optical component comprising:
a first etching process of forming a depressed portion in a silicon region by applying etching to the silicon region of a plate-shaped member including the silicon region, the silicon region being composed of silicon;
a thermal oxidation process of forming a silicon oxide film by thermally oxidizing an inner side surface of the depressed portion in the silicon region; and
a nitride film formation process of forming a silicon nitride film that covers the silicon oxide film, wherein
the manufacturing method further comprises:
an unnecessary portion removal process of removing an unnecessary portion of the silicon oxide film between the thermal oxidation process and the nitride film formation process; and
before the first etching process a mask formation process of sequentially forming a first mask having a pattern along a part of the inner side surface on the silicon region, and further forming second and third masks having an opening corresponding to a planar shape of the pressed portion on the silicon region and the first mask, wherein
in the first etching process, the third mask is removed after applying dry etching to the silicon region by use of the third mask,
in the thermal oxidation process, the second mask is removed after thermally oxidizing the inner side surface of the depressed portion by use of the second mask, and
after the thermal oxidation process, the silicon region is etched by use of the first mask before the unnecessary portion removal process.

2. A manufacturing method for an optical component comprising:
a first etching process of forming a depressed portion in a silicon region by applying etching to the silicon region of a plate-shaped member including the silicon region, the silicon region being composed of silicon;
a thermal oxidation process of forming a silicon oxide film by thermally oxidizing an inner side surface of the depressed portion in the silicon region; and
a nitride film formation process of forming a silicon nitride film that covers the silicon oxide film, wherein
the manufacturing method further comprises:
an unnecessary portion removal process of removing an unnecessary portion of the silicon oxide film between the thermal oxidation process and the nitride film formation process; and
before the first etching process, a mask formation process of sequentially forming a first mask having a pattern along a part of the inner side surface on the silicon region, and further forming a second mask having an opening corresponding to a planar shape of the depressed portion on the silicon region and the first mask, wherein
in the first etching process, wet etching is applied to the silicon region by use of the second mask,
in the thermal oxidation process, the second mask is removed after thermally oxidizing the inner side surface of the depressed portion by use of the second mask, and
after the thermal oxidation process, the silicon region is etched by use of the first mask before the unnecessary portion removal process.

3. The manufacturing method for an optical component according to claim 1 , wherein the silicon nitride film is formed by use of a low pressure chemical vapor deposition method in the nitride film formation process.

4. The manufacturing method for an optical component according to claim 1 , wherein the inner side surface of the depressed portion is formed along the thickness direction of the plate-shaped member in the first etching process.

5. The manufacturing method for an optical component according to claim 1 , wherein the inner side surface of the depressed portion is formed along a direction inclined with respect to the thickness direction of the plate-shaped member by applying wet etching to the silicon region in the first etching process.

6. The manufacturing method for an optical component according to claim 2 , wherein the silicon nitride film is formed by use of a low pressure chemical vapor deposition method in the nitride film formation process.

7. The manufacturing method for an optical component according to claim 2 , wherein the inner side surface of the depressed portion is formed along the thickness direction of the plate-shaped member in the first etching process.

8. The manufacturing method for an optical component according to claim 2 , wherein the inner side surface of the depressed portion is formed along a direction inclined with respect to the thickness direction of the plate-shaped member by applying wet etching to the silicon region in the first etching process.

Assignees

• Warashina Yoshihisa
• Suzuki Tomofumi
• KASAMORI Kohei
• Hamamatsu Photonics Kk

Inventors

• Warashina Yoshihisa
• Suzuki Tomofumi
• KASAMORI Kohei

Classifications

• G01J3/4535

  Devices with moving mirror (G01J3/4532 takes precedence) · CPC title

• G01B9/02056

  Passive reduction of errors · CPC title

• G02B1/115 Primary

  Multilayers · CPC title

• G01B9/02051 Primary

  Integrated design, e.g. on-chip or monolithic · CPC title

• G02B26/06

  for controlling the phase of light (G02B26/08 takes precedence {, measuring optical phase difference G01J9/00}) · CPC title