Packaged device

Patent metadata

Field	Value
Publication number	US-9372202-B2
Application number	US-201213618643-A
Country	US
Kind code	B2
Filing date	Sep 14, 2012
Priority date	Sep 18, 2008
Publication date	Jun 21, 2016
Grant date	Jun 21, 2016

Abstract

A packaged device of one embodiment includes a device layer section, and first and second packaging members. The device layer section is one where a movable microdevice including a movable part and a terminal part is formed. The first packaging member is joined to the device layer section, and includes a wiring region provided at a position corresponding to the terminal part and a conductive plug extending through the wiring region. The second packaging member is joined to a side of the device layer section opposite the first packaging member.

First claim

What is claimed is:

1. A packaged device comprising:
a device layer section in which a movable microdevice including a movable part and a terminal part is formed;
a first packaging member joined to the device layer section, and including a wiring region provided at a position corresponding to the terminal part and a conductive plug extending through the wiring region, the first packaging member including a conductive non-wiring region electrically isolated from the wiring region, the conductive non-wiring region adapted to act as a ground; and
a second packaging member joined to a side of the device layer section opposite the first packaging member, and
an insulating film provided on a surface of the first packaging member, and including a first opening at a position corresponding to the wiring region; a first electrode pad electrically coupled to the wiring region at the first opening;
wherein the insulating film includes a second opening at a position corresponding to the conductive non-wiring region, and
wherein a second electrode pad is electrically coupled to the conductive non-wiring region at the second opening.

2. The packaged device according to claim 1 , wherein the second electrode pad is provided in the second opening in an in-plane direction of the first packaging member.

3. The packaged device according to claim 1 , wherein the first packaging member includes a recess facing the movable part of the movable microdevice.

4. The packaged device according to claim 1 , wherein the second packaging member includes a recess facing the movable part of the movable microdevice.

Assignees

• Inoue Hiroaki
• Katsuki Takashi
• Nakazawa Fumihiko
• Drnc Holdings Inc

Inventors

• Inoue Hiroaki
• Katsuki Takashi
• Nakazawa Fumihiko

Classifications

• G01P15/125 Primary

  by capacitive pick-up · CPC title

• G01P1/023

  for acceleration measuring devices · CPC title

• G01P15/0802

  Details · CPC title

• Y10T29/49128

  Assembling formed circuit to base · CPC title

• B81C1/00301

  Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias · CPC title