Gas sensor and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9372165-B2
Application number	US-201213593771-A
Country	US
Kind code	B2
Filing date	Aug 24, 2012
Priority date	Oct 13, 2011
Publication date	Jun 21, 2016
Grant date	Jun 21, 2016

Abstract

Disclosed are a gas sensor, and a method of manufacturing and using the same. The method includes: forming a detection material on a heater; coating an encapsulant on the detection material; and heating the heater to remove the encapsulant from the detection material when the gas sensor is operated.

First claim

What is claimed is:

1. A gas sensor comprising:
a heater;
a detection material disposed on the heater; and
an encapsulant disposed on the detection material and sealing the detection material from a detected gas,
wherein the heater is operable to heat the encapsulant, and
wherein the detection material includes SnO 2 and contacts a top surface of the heater.

2. A method of manufacturing and using a gas sensor, the method comprising:
forming a detection material on a heater;
coating an encapsulant on the detection material; and
heating the heater to remove the encapsulant from the detection material when the gas sensor is operated.

3. The method of claim 2 , wherein in the forming of the detection material, the detection material is formed on the heater through screen printing.

4. The method of claim 2 , wherein in the coating of the encapsulant, the encapsulant is coated on the detection material through any one process of pressing, thermocompression binding, spin coating, drop coating, dip coating and spray coating.

5. The method of claim 2 , wherein in the coating of the encapsulant, the encapsulant is heated by an external heat source or the heater to be coated on the detection material.

6. The method of claim 5 , wherein the encapsulant is heated to a temperature in a range from 150 to 170° C.

7. The method of claim 2 , wherein in the removing of the encapsulant, when the gas sensor is operated, the encapsulant is removed from the detection material by heating the heater to a thermal decomposition temperature of the encapsulant or higher.

8. The method of claim 2 , wherein the gas sensor is a first gas sensor that includes the heater, the detection material, and the encapsulant, the method further comprising:
detecting an abnormal operation of the first gas sensor; and
heating a heater of a second gas sensor and removing an encapsulant of the second gas sensor, when the abnormal operation of the first gas sensor is detected.

9. A gas sensor comprising:
a heater;
a detection material disposed on the heater; and
an encapsulant disposed on the detection material and sealing the detection material from a detected gas,
wherein the heater is operable to heat the encapsulant, and
wherein the encapsulant directly contacts the heater.

Assignees

• Lee Hyung Kun
• Yang Woo Seok
• Choi Nak Jin
• Moon Seung Eon
• Kim Jong Dae
• Korea Electronics Telecomm

Inventors

• Lee Hyung Kun
• Yang Woo Seok
• Choi Nak Jin
• Moon Seung Eon
• Kim Jong Dae

Classifications

• B82Y15/00 Primary

  Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors · CPC title

• G01N27/127

  comprising nanoparticles · CPC title

• G01N27/18 Primary

  caused by changes in the thermal conductivity of a surrounding material to be tested (G01N27/20 takes precedence) · CPC title

• G01N27/126 Primary

  comprising organic polymers · CPC title