Glass based multichip package

Patent metadata

Field	Value
Publication number	US-9371982-B2
Application number	US-201314136556-A
Country	US
Kind code	B2
Filing date	Dec 20, 2013
Priority date	Aug 15, 2013
Publication date	Jun 21, 2016
Grant date	Jun 21, 2016

Abstract

In implementations, a glass-based multichip package includes a photodefinable glass-based substrate, at least one electronic component disposed on the photodefinable glass-based substrate, and a portion of the photodefinable glass-based substrate that has been exposed to ultraviolet light, where the portion of the photodefinable glass-based substrate includes ceramic. Additionally, the sensor package may include additional electronic components, a glass touch panel, and/or a printed circuit board. In implementations, fabricating the sensor package device includes receiving a photodefinable glass-based substrate, etching the photodefinable glass-based substrate, and forming a ceramic portion of the photodefinable glass-based substrate.

First claim

What is claimed is:

1. A glass-based multichip package, comprising:
a photodefinable glass-based substrate, where a portion of the photodefinable glass-based substrate includes a light isolation component that is converted to ceramic;
at least one electronic component directly disposed on the photodefinable glass-based substrate;
at least one interconnect including a solder ball directly coupled to the photodefinable glass-based substrate and a printed circuit board, and wherein the electronic component comprises a sensor, the sensor including a light sensor coupled to the photodefinable glass-based substrate and coupled proximate to a lens formed in the photodefinable glass-based substrate, and where light passes through the lens to the light sensor.

2. The glass-based multichip package in claim 1 , where the photodefinable glass-based substrate comprises an optically transparent glass-based substrate.

3. The glass-based multichip package in claim 1 , where the photodefinable glass-based substrate comprises a thermally stable glass-based substrate.

4. The glass-based multichip package in claim 1 , where the electronic component comprises an integrated circuit chip.

5. The glass-based multichip package in claim 1 , where the electronic component comprises a light source.

6. The glass-based multichip package in claim 1 , further comprising at least one through-glass via.

7. An electronic device, comprising:
a printed circuit board; and
a glass-based multichip package coupled to the printed circuit board, the glass-based multichip package comprising:
a photodefinable glass-based substrate, where a portion of the photodefinable glass-based substrate includes a light isolation component that is converted to ceramic;
at least one electronic component directly disposed on the photodefinable glass-based substrate; and
at least one interconnect including a solder ball coupled to the photodefinable glass-based substrate and the printed circuit board and a printed circuit board, and wherein the electronic component comprises a sensor, the sensor including a light sensor coupled to the photodefinable glass-based substrate and coupled proximate to a lens formed in the photodefinable glass-based substrate, and where light passes through the lens to the light sensor.

8. The electronic device in claim 7 , where the photodefinable glass-based substrate comprises an optically transparent glass-based substrate.

9. The electronic device in claim 7 , where the photodefinable glass-based substrate comprises a thermally stable glass-based substrate.

10. The electronic device in claim 7 , where the electronic component comprises an integrated circuit chip.

11. The electronic device in claim 7 , where the electronic component comprises a light source.

12. The electronic device in claim 7 , further comprising at least one through-glass via.

Assignees

• Maxim Integrated Products

Inventors

• Zhou Tiao

Classifications

• H10W70/682

  comprising holes having chips therein · CPC title

• H10W70/681

  comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage · CPC title

• H10W72/874

  On different surfaces · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/073

  of die-attach connectors · CPC title