Embedded multilayer ceramic electronic component and printed circuit board having embedded multilayer ceramic electronic component

Patent metadata

Field	Value
Publication number	US-9370102-B2
Application number	US-201313770887-A
Country	US
Kind code	B2
Filing date	Feb 19, 2013
Priority date	Dec 28, 2012
Publication date	Jun 14, 2016
Grant date	Jun 14, 2016

Abstract

There is provided an embedded multilayer ceramic electronic component including: a ceramic body including dielectric layers, having first and second lateral surfaces opposing one another, and having a thickness equal to or less than 250 μm; a first internal electrode and a second internal electrode disposed to face one another with the dielectric layer interposed therebetween; a first external electrode formed on the first lateral surface of the ceramic body and electrically connected to the first internal electrode and a second external electrode formed on the second lateral surface and electrically connected to the second internal electrode; and metal layers formed on the first external electrode and the second external electrode, respectively, and including copper (Cu), wherein when a thickness of the metal layers is tp, tp≧5 μm may be satisfied.

First claim

What is claimed is:

1. An embedded multilayer ceramic electronic component comprising:
a ceramic body including dielectric layers, having first and second main surfaces opposing one another, first and second lateral surfaces opposing one another, and first and second end surfaces opposing one another, and having a thickness equal to or less than 250 μm;
a first internal electrode and a second internal electrode disposed to face one another with the dielectric layer interposed therebetween and alternately exposed to the first lateral surface and the second lateral surface, respectively;
a first external electrode formed on the first lateral surface of the ceramic body and electrically connected to the first internal electrode and a second external electrode formed on the second lateral surface and electrically connected to the second internal electrode; and
metal layers being copper plating layers, and disposed on the first external electrode and the second external electrode, respectively,
wherein the ceramic body includes an active layer including the first internal electrodes and the second internal electrodes and a cover layer formed on an upper or lower surface of the active layer, and when a thickness of the metal layers is tp, tp≧5 μm is satisfied, and
wherein when surface roughness of the metal layers is Ra 2 and the thickness of the metal layers is tp, 200 nm≦Ra 2 ≦tp is satisfied.

2. The embedded multilayer ceramic electronic component of claim 1 , wherein when a thickness of the ceramic body is a distance between the first main surface and the second main surface, a width of the ceramic body is a distance between the first lateral surface on which the first external electrode is formed and the second lateral surface on which the second external electrode is formed, and a length of the ceramic body is a distance between the first end surface and the second end surface, the width of the ceramic body is shorter than or equal to the length of the ceramic body.

3. The embedded multilayer ceramic electronic component of claim 2 , wherein when the length of the ceramic body is L and the width thereof is W, 0.5 L≦W≦L is satisfied.

4. The embedded multilayer ceramic electronic component of claim 1 , wherein when surface roughness of the ceramic body is Ra 1 and a thickness of the cover layer is tc, 120 nm≦Ra 1 ≦tc is satisfied.

5. The embedded multilayer ceramic electronic component of claim 1 , wherein the first and second external electrodes extend to the first and second main surfaces of the ceramic body, and a width of the first and second external electrodes formed on the first and second main surfaces is equal to or greater than 200 μm, respectively.

6. The embedded multilayer ceramic electronic component of claim 5 , wherein a distance between the first and second external electrodes formed on the first and second main surfaces is equal to or greater than 100 μm.

7. The embedded multilayer ceramic electronic component of claim 1 , wherein the thickness tc of the cover layer ranges from 1 μm to 30 μm.

8. The embedded multilayer ceramic electronic component of claim 1 , wherein the metal layers are formed through plating.

9. A printed circuit board (PCB) having an embedded multilayer ceramic electronic component, the printed circuit board comprising:
an insulating substrate; and
an embedded multilayer ceramic electronic component including a ceramic body including dielectric layers, having first and second main surfaces opposing one another, first and second lateral surfaces opposing one another, and first and second end surfaces opposing one another, and having a thickness equal to or less than 250 μm, a first internal electrode and a second internal electrode disposed to face one another with the dielectric layer interposed therebetween and alternately exposed to the first lateral surface and the second lateral surface, respectively, a first external electrode formed on the first lateral surface of the ceramic body and electrically connected to the first internal electrode and a second external electrode formed on the second lateral surface and electrically connected to the second internal electrode, and metal layers being copper plating layers, and disposed on the first external electrode and the second external electrode, respectively, wherein the ceramic body includes an active layer including the first internal electrodes and the second internal electrodes and a cover layer formed on an upper or lower surface of the active layer, and when a thickness of the metal layers is tp, tp≧5 μm is satisfied, and
wherein when surface roughness of the metal layers is Ra 2 and the thickness of the metal layers is tp, 200 nm≦Ra 2 ≦tp is satisfied.

10. The printed circuit board of claim 9 , wherein when a thickness of the ceramic body is a distance between the first main surface and the second main surface, a width of the ceramic body is a distance between the first lateral surface on which the first external electrode is formed and the second lateral surface on which the second external electrode is formed, and a length of the ceramic body is a distance between the first end surface and the second end surface, the width of the ceramic body is shorter than or equal to the length of the ceramic body.

11. The printed circuit board of claim 10 , wherein when the length of the ceramic body is L and the width thereof is W, 0.5 L≦W≦L is satisfied.

12. The printed circuit board of claim 9 , wherein when surface roughness of the ceramic body is Ra 1 and a thickness of the cover layer is tc, 120 nm≦Ra 1 ≦tc is satisfied.

13. The printed circuit board of claim 9 , wherein the first and second external electrodes extend to the first and second main surfaces of the ceramic body, and a width of the first and second external electrodes formed on the first and second main surfaces is equal to or greater than 200 μm, respectively.

14. The printed circuit board of claim 13 , wherein a distance between the first and second external electrodes formed on the first and second main surfaces is equal to or greater than 100 μm.

15. The printed circuit board of claim 9 , wherein the thickness tc of the cover layer ranges from 1 μm to 30 μm.

16. The printed circuit board of claim 9 , wherein the metal layers are formed through plating.

Assignees

• Samsung Electro Mech

Inventors

• Lee Jin Woo
• Chae Eun Hyuk
• Lee Byoung Hwa

Classifications

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H05K1/162 Primary

  incorporating printed capacitors · CPC title

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/2325

  characterised by the material of the terminals · CPC title

• H05K2201/10015

  Non-printed capacitor · CPC title