Resistive heating device for fabrication of nanostructures

Patent metadata

Field	Value
Publication number	US-9370047-B2
Application number	US-201314054676-A
Country	US
Kind code	B2
Filing date	Oct 15, 2013
Priority date	Aug 27, 2009
Publication date	Jun 14, 2016
Grant date	Jun 14, 2016

Abstract

Apparatuses and techniques relating to a resistive heating device are provided.

First claim

The invention claimed is:

1. A heating device, comprising:
a nanostructure including:
a substrate;
at least one electrically-conductive elongated structure disposed on the substrate, the at least one electrically-conductive elongated structure including at least one resistive portion having a conductivity lower than that of remaining portions of the at least one electrically-conductive elongated structure; and
at least one heat-conductive column directly disposed on the at least one resistive portion of the at least one electrically-conductive elongated structure.

2. The heating device of claim 1 , further comprising:
an insulating layer disposed on the substrate so as to cover at least a portion of a surface of the at least one electrically-conductive elongated structure.

3. The heating device of claim 1 , wherein the remaining portions of the at least one electrically-conductive elongated structure comprise carbon nano-tube (CNT), graphene, or combinations thereof.

4. The heating device of claim 1 , wherein the resistive portion of the at least one electrically-conductive elongated structure comprises metal carbide.

5. The heating device of claim 1 , wherein the at least one heat-conductive column comprises a material selected from the group consisting of alumina, other metal oxides, metal carbides, and combinations thereof.

6. The heating device of claim 1 , wherein the substrate comprises at least one elastomeric material.

7. The heating device of claim 1 , wherein the at least one heat-conductive column extends longitudinally non-parallel relative to the at least one electrically-conductive elongated structure on which the at least one heat-conductive column is disposed.

8. The heating device of claim 1 , wherein the resistive portion of the at least one electrically-conductive elongated structure comprises a metal carbide selected from the group consisting of titanium carbide, molybdenum carbide, and combinations thereof.

9. The heating device of claim 1 , wherein the heating device is configured as a generally cylindrical heat roller that includes the at least one heat-conductive column formed on lateral outer circumference portions of the generally cylindrical heating device.

10. The heating device of claim 1 , wherein the at least one heat-conductive column extends generally perpendicular relative to the at least one electrically-conductive elongated structure on which the at least one heat-conductive column is formed.

11. The heating device of claim 1 , wherein the at least one resistive portion in the at least one electrically-conductive elongated structure has a transverse cross-sectional shape and size that is substantially identical to that of the at least one electrically-conductive elongated structure in which it is formed, the at least one resistive portion being entirely contained within outer dimensions of the at least one electrically-conductive elongated structure extending on either side thereof.

12. The heating device of claim 1 , wherein the at least one heat-conductive column is formed of a material having a higher thermal conductivity and a lower electrical conductivity than that of the resistive portion on which it is formed.

13. The heating device of claim 1 , wherein the at least one resistive portion has a side-length measuring from about 50 nm to about 500 nm.

14. The heating device of claim 1 , wherein the at least one heat-conductive column has a width measuring from about 50 nm to about 500 nm.

15. A nanostructure heating device, comprising:
a substrate;
at least one electrically-conductive elongated structure disposed on the substrate, the at least one electrically-conductive elongated structure including at least one resistive portion having a conductivity lower than that of remaining portions of the at least one electrically-conductive elongated structure; and
at least one heat-conductive column directly disposed on the at least one resistive portion of the at least one electrically-conductive elongated structure, the at least one heat-conductive column extending longitudinally non-parallel relative to the at least one electrically-conductive elongated structure on which the at least one heat-conductive column is disposed.

16. The device of claim 15 , wherein the at least one resistive portion is disposed in the at least one electrically-conductive elongated structure.

17. The device of claim 15 , wherein the resistive portion of the at least one electrically-conductive elongated structure comprises a metal carbide.

18. The device of claim 15 , wherein the substrate comprises at least one elastomeric material.

19. The device of claim 15 , wherein the at least one heat-conductive column comprises a material selected from the group consisting of alumina, other metal oxides, metal carbides, and combinations thereof.

20. A nanostructure heating device, comprising:
a substrate;
at least one electrically-conductive elongated structure disposed on the substrate, the at least one electrically-conductive elongated structure including at least one resistive portion disposed therein, the at least one resistive portion comprising a metal carbide and having a conductivity lower than that of remaining portions of the at least one electrically-conductive elongated structure, the remaining portions of the at least one electrically-conductive elongated structure comprising carbon nano-tube (CNT), graphene, or combinations thereof; and
at least one heat-conductive column directly disposed on the at least one resistive portion of the at least one electrically-conductive elongated structure, the at least one heat-conductive column extending longitudinally non-parallel relative to the at least one electrically-conductive elongated structure on which the at least one heat-conductive column is disposed.

21. The heating device of claim 1 , wherein the at least one resistive portion is located between the substrate and the at least one heat-conductive column.

22. The heating device of claim 1 , wherein each at least one elongated structure is configured to be controlled independently.

Assignees

• Univ Korea Res & Bus Found

Inventors

• Lee Kwangyeol

Classifications

• Y10T29/49087

  with envelope or housing · CPC title

• Y10T29/49083

  Heater type · CPC title

• Y10T29/49085

  Thermally variable · CPC title

• H05B3/145 Primary

  Carbon only, e.g. carbon black, graphite · CPC title

• H05B3/03 Primary

  Electrodes · CPC title