MEMS device comprising an under bump metallization

Patent metadata

Field	Value
Publication number	US-9369066-B2
Application number	US-201113983947-A
Country	US
Kind code	B2
Filing date	Feb 10, 2011
Priority date	Feb 10, 2011
Publication date	Jun 14, 2016
Grant date	Jun 14, 2016

Abstract

The present invention concerns a MEMS device comprising an under bump metallization ( 4 )—UBM—to contact the device via flip-chip bonding with a substrate. The UBM ( 4 ) is placed on the surface of the MEMS device and close to the corners of the surface. Further, the shape of the UBM ( 4 ) is adapted to the shape of the corners.

First claim

The invention claimed is:

1. A MEMS device, comprising:
a surface having an under-bump metallization (UBM) to contact the MEMS device with a substrate via flip-chip bonding, the surface having a corner;
an active part on the surface; and
wherein the UBM is placed on the surface of the MEMS device at a location that is close to the corner of the surface, the UBM including an inner edge that follows the shape of the active part at a constant distance from the active part, and
wherein a shape of the UBM is adapted to the shape of the corner and the shape of the active part.

2. The MEMS device according to claim 1 , wherein the shape of the UBM is approximately triangular.

3. The MEMS device according to claim 2 , wherein the triangular shape includes rounded corners.

4. The MEMS device according to claim 2 , wherein the triangular shape is that of an isosceles triangle.

5. The MEMS device according to claim 2 , wherein one side of the UBM is concave.

6. The MEMS device according to claim 1 , wherein the device comprises four UBMs, one of the four UBMs is placed in a corresponding one of the corners of the surface of the device.

7. The MEMS device according to claim 1 , wherein the MEMS device is a MEMS microphone chip.

8. The MEMS device according to claim 1 , wherein the UBM is part of a UBM pad located on the surface, the UBM pad further comprising at least one of an underlying metal layer and a conducting layer below the UBM, wherein the UBM pad is placed close to the corners of the MEMS device, and wherein the shape of the UBM pad is adapted to the shape of the corners.

9. The MEMS device according to claim 8 , wherein the conducting layer comprises highly doped polysilicon.

10. The MEMS device according to claim 8 , wherein the UBM pad is approximately triangularly shaped.

11. The MEMS device according to claim 10 , wherein one side of the UBM pad is concave.

12. The MEMS device according to claim 8 , wherein the device comprises four UBM pads and one of the UBM pads is placed in each corner of the device.

13. The MEMS device according to claim 1 , wherein the device comprises four UBMs, one of the four UBMs is placed in a corresponding one of the corners of the surface of the device, the shape of each of the four UBMs is approximately triangular with rounded corners.

14. The MEMS device according to claim 13 , wherein the MEMS device is a MEMS microphone chip.

15. The MEMS device according to claim 1 , further including a UBM pad located on the surface adjacent to the corner and having approximately the same shape as the corner, the UBM pad including the UBM and at least one of an underlying metal layer and a conducting layer below the UBM, the UBM pad having an approximately triangular shape.

16. The MEMS device according to claim 15 , wherein the MEMS device is a MEMS microphone, and the active part being a part of an active part of the MEMS microphone.

17. A MEMS device, comprising:
a surface having an under-bump metallization (UBM) to contact the MEMS device with a substrate via flip-chip bonding, the surface having a corner, the UBM having an approximate triangular shape; and
an active part on the surface and having a generally circular periphery;
wherein the UBM is located between the corner of the surface and the generally circular periphery of the active part, one corner point of the approximate triangular shape of the UBM being adjacent to the corner of the surface and one side edge of the approximate triangular shape of the UBM being adjacent to the generally circular periphery of the active part.

18. The MEMS device according to claim 17 , wherein the MEMS device is a MEMS microphone chip and the active part includes a membrane.

19. The MEMS device according to claim 17 , wherein the surface comprises four UBMs and four corners, one of the four UBMs is placed in a corresponding one of the four corners of the surface of the device, each of the four UBMs having an approximate triangular shape.

20. The MEMS device according to claim 17 , wherein the UBM generally follows the shape of the corner of the surface and the shape of the active part.

21. The MEMS device according to claim 17 , wherein the one side edge of UBM is curved.

22. The MEMS device according to claim 21 , wherein the one side edge of UBM follows the shape of the active part at a constant distance from the active part.

Assignees

• Johansen Leif Steen
• Ravnkilde Jan Tue
• Epcos Ag

Inventors

• Johansen Leif Steen
• Ravnkilde Jan Tue

Classifications

• B81B2201/0257

  Microphones or microspeakers · CPC title

• B81C2203/019

  characterised by the material or arrangement of seals between parts · CPC title

• H02N1/00 Primary

  Electrostatic generators or motors using a solid moving electrostatic charge carrier · CPC title

• B81B7/007 Primary

  Interconnections between the MEMS and external electrical signals · CPC title