Semiconductor device
US-2024290673-A1 · Aug 29, 2024 · US
US9368255B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9368255-B2 |
| Application number | US-201514677685-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 2, 2015 |
| Priority date | Apr 29, 2013 |
| Publication date | Jun 14, 2016 |
| Grant date | Jun 14, 2016 |
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A conductive particle comprising a polyhedral shape in which two neighboring sides among a plurality of sides form an intersection line, and two sides meeting on the intersection line form an angle.
Opening claim text (preview).
What is claimed is: 1. A conductive particle comprising a polyhedral shape in which two neighboring sides among a plurality of sides form an intersection line, and the two neighboring sides meeting on the intersection line form an angle, wherein the conductive particle comprises a sharp edged shell covering a plastic polymer core, and wherein the sharp edged shell comprises a metal film or a plated-on conductive plastic polymer that has a conductivity to electrically connect members adjacent to each other. 2. The conductive particle of claim 1 , wherein surfaces showing the polyhedral shape of the conductive particle are exposed to the outside. 3. The conductive particles of claim 2 , wherein a cross-section of the conductive particle comprises sides of a polygon. 4. The conductive particle of claim 1 , wherein the conductive particle is shaped as one of a tetrahedron, and a hexahedron.
Subject matter not provided for in other groups of this subclass · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
Compression bonding, e.g. thermocompression bonding · CPC title
Compression bonding, e.g. thermocompression bonding · CPC title
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