Wafer-level lens systems and methods for manufacturing the same

Patent metadata

Field	Value
Publication number	US-9366848-B2
Application number	US-201414323846-A
Country	US
Kind code	B2
Filing date	Jul 3, 2014
Priority date	Jul 3, 2014
Publication date	Jun 14, 2016
Grant date	Jun 14, 2016

Abstract

A wafer-level lens system includes one or more wafer-level lenses, each of the one or more wafer-level lenses having a substrate with opposing first and second surfaces, a first lens element of a first material and disposed on the first surface, and a second lens element of a second material and disposed on the second surface, wherein, for at least one of the one or more wafer-level lenses, the first material is different from the second material. Another wafer-level lens system includes three wafer-level lenses optically coupled in series with each other, each of the three wafer-level lenses having a substrate with opposing first and second surfaces, a first lens element disposed on the first surface and having an aspheric surface facing away from the first surface, and a second lens element disposed on the second surface and having an aspheric surface facing away from the second surface.

First claim

What is claimed is:

1. A wafer-level lens system for imaging a scene onto an image plane, comprising:
three wafer-level lenses optically coupled in series with each other, each of the wafer-level lenses including:
a substrate, having opposing first and second surfaces,
a first lens element of a first material and disposed on the first surface, and
a second lens element of a second material and disposed on the second surface;

wherein, for at least one of the wafer-level lenses, the first material is different from the second material, and wherein the wafer-level lens system has F-number less than 2.5.

2. The wafer-level lens system of claim 1 , wherein, for at least one of the wafer-level lenses, the first material has index of refraction different from that of the second material.

3. The wafer-level lens system of claim 2 , wherein, for at least one of the wafer-level lenses, the first material has Abbe number different from that of the second material.

4. The wafer-level lens system of claim 1 , for each of the three wafer-level lenses, each of the first and second lens element having an aspheric surface facing away from the substrate.

5. The wafer-level lens system of claim 1 , the wafer-level lenses comprising a first wafer-level lens located furthest from the image plane, the first lens element and the second lens element of the first wafer-level lens composed of different materials.

6. The wafer-level lens system of claim 1 , the wafer-level lenses being composed of reflow compatible materials.

7. The wafer-level lens system of claim 6 , the wafer-level lenses being composed of materials that have substantially unchanged optical properties after being heated to at least 250 degrees Celsius for at least 10 seconds.

8. A wafer-level lens system for imaging a scene onto an image plane, comprising:
three wafer-level lenses optically coupled in series with each other, each of the three wafer-level lenses including:
a substrate, having opposing first and second surfaces,
a first lens element disposed on the first surface and having an aspheric surface facing away from the first surface, and
a second lens element disposed on the second surface and having an aspheric surface facing away from the second surface;

wherein the three wafer-level lenses include a first wafer-level lens furthest from the image plane, a second wafer-level lens located between the first wafer-level lens and the image plane, and a third wafer-level lens located closest to the image plane, the first lens element and the second lens element of the first wafer-level lens being composed of different materials, the wafer-level lens system having effective focal length EFFL, the first lens element of the first wafer-level lens has focal length F1, and 0.85<EFFL/F1<1.15.

9. The wafer-level lens system of claim 8 , the first lens element of the first wafer-level lens having Abbe number greater than 55, the second lens element of the first wafer-level lens having Abbe number less than 35, and the first lens element of the second wafer-level lens having Abbe number less than 35.

10. The wafer-level lens system of claim 8 , the three wafer-level lenses being composed of reflow compatible materials.

11. The wafer-level lens system of claim 10 , the three wafer-level lenses being composed of materials that have substantially unchanged optical properties after being heated to at least 250 degrees Celsius for at least 10 seconds.

12. The wafer-level lens system of claim 8 having total track length TTL such that 0.65<EFFL/TTL<0.75.

13. A wafer-level lens system for imaging a scene onto an image plane, comprising:
three wafer-level lenses optically coupled in series with each other, each of the three wafer-level lenses including:
a substrate, having opposing first and second surfaces,
a first lens element disposed on the first surface and having an aspheric surface facing away from the first surface, and
a second lens element disposed on the second surface and having an aspheric surface facing away from the second surface;

wherein the three wafer-level lenses include a first wafer-level lens furthest from the image plane, a second wafer-level lens located between the first wafer-level lens and the image plane, and a third wafer-level lens located closest to the image plane, the first lens element and the second lens element of the first wafer-level lens being composed of different materials, the wafer-level lens system having effective focal length EFFL, the second lens element of the first wafer-level lens having focal length F2, the first lens element of the second wafer-level lens having focal length F3, and −0.95<EFFL*(F2+F3)/(F2*F3)<−0.75.

14. The wafer-level lens system of claim 13 , the first lens element of the first wafer-level lens having Abbe number greater than 55, the second lens element of the first wafer-level lens having Abbe number less than 35, and the first lens element of the second wafer-level lens having Abbe number less than 35.

15. The wafer-level lens system of claim 13 , the three wafer-level lenses being composed of reflow compatible materials.

16. The wafer-level lens system of claim 15 , the three wafer-level lenses being composed of materials that have substantially unchanged optical properties after being heated to at least 250 degrees Celsius for at least 10 seconds.

17. The wafer-level lens system of claim 13 having total track length TTL such that 0.65<EFFL/TTL<0.75.

18. A wafer-level lens system for imaging a scene onto an image plane, comprising:
three wafer-level lenses optically coupled in series with each other, each of the three wafer-level lenses including:
a substrate, having opposing first and second surfaces,
a first lens element disposed on the first surface and having an aspheric surface facing away from the first surface, and
a second lens element disposed on the second surface and having an aspheric surface facing away from the second surface;

wherein the three wafer-level lenses include a first wafer-level lens furthest from the image plane, a second wafer-level lens located between the first wafer-level lens and the image plane, and a third wafer-level lens located closest to the image plane, the first lens element and the second lens element of the first wafer-level lens being composed of different materials, the wafer-level lens system having effective focal length EFFL, the first lens element of the second wafer-level lens having focal length F4, the second lens element of the third wafer-level lens having focal length F5, and 1.9<EFFL*(F4+F5)/(F4*F5)<2.2.

19. The wafer-level lens system of claim 18 , the first lens element of the first wafer-level lens having Abbe number greater than 55, the second lens element of the first wafer-level lens having Abbe number less than 35, and the first lens element of the second wafer-level lens having Abbe number less than 35.

20. The wafer-level lens system of claim 18 , the three wafer-level lenses being composed of reflow compatible materials.

21. The wafer-level lens system of claim 20 , the three wafer-level lenses being composed of materials that have substantially unchanged optical properties after being heated to at least 250 degrees Celsius for at least 10 seconds.

22. The wafer-level lens system of claim 18 having total track length TTL such that 0.65<EFFL/TTL<0.75.

23. A wafer-level method for manufacturing a wafer-level lens system, comprising:
forming a first lens wafer by:

Assignees

• Omnivision Tech Inc

Inventors

• Yin Chuen-Yi
• Deng Jau-Jan

Classifications

• G02B13/0085 Primary

  employing wafer level optics · CPC title

• G02B13/0035

  having three lenses · CPC title

• G02B9/12

  having three components only · CPC title

• B29D11/00307

  Producing lens wafers · CPC title

• G02B13/006

  at least one element being a compound optical element, e.g. cemented elements · CPC title