Temperature-controlled container systems for use within a refrigeration device

Patent metadata

Field	Value
Publication number	US-9366483-B2
Application number	US-201314091831-A
Country	US
Kind code	B2
Filing date	Nov 27, 2013
Priority date	Nov 27, 2013
Publication date	Jun 14, 2016
Grant date	Jun 14, 2016

Abstract

In some embodiments, a temperature-controlled container for use within a refrigeration device includes: one or more sections of insulation material substantially defining one or more walls of a temperature-controlled container, the temperature-controlled container including an internal region; a thermally-insulated partition dividing the internal region to form a storage region and a phase change material region internal to the container, the thermally-insulated partition including a conduit between the storage region and the phase change material region; a thermal control device within the conduit; an aperture within a section of the insulation material substantially defining the container, the aperture between the phase change material region internal to the container and an external surface of the container; and a unidirectional thermal conductor positioned within the aperture, the unidirectional thermal conductor configured to transmit heat in a direction from the phase change material region to the external surface of the container.

First claim

What is claimed is:

1. A temperature-control addition to a refrigeration device, comprising:
a thermal storage unit including a container of a size and shape to fit within a freezer section of a refrigeration device, the container including an aperture with an edge dimension larger than a cross-section of a refrigeration coil of the refrigeration device;
a thermal diode unit of a size and shape to fit within a refrigeration section of the refrigeration device, the thermal diode unit including a top edge configured to be positioned adjacent to a vent aperture of the refrigeration device; and
a control unit including a temperature sensor, a controller responsive to the temperature sensor, and a fan of a size and shape to fit within the refrigeration section of the refrigeration device, the fan responsive to the controller.

2. The temperature-control addition to a refrigeration device of claim 1 , wherein the thermal diode unit comprises:
at least one inner wall configured to be substantially vertical during use of the thermal diode unit;
at least one outer wall of a size and shape to align with the at least one inner wall, with a gap formed between the at least one inner wall and the at least one outer wall, the outer wall including an outer surface configured to be positioned within the refrigeration section of the refrigeration device;
a mesh structure affixed to a surface of the at least one inner wall adjacent to the gap;
a liquid within the gap;
one or more seals between the at least one inner wall and the at least one outer wall, forming a gas-impermeable interior region of the thermal diode unit surrounding the gap; and
a gas pressure within the gas-impermeable interior region that is not identical to atmospheric pressure surrounding the thermal diode unit.

3. The temperature-control addition to a refrigeration device of claim 1 , comprising:
a transmission device.

4. A temperature-control addition to a refrigeration device, comprising:
a temperature-controlled container including one or more sections of insulation material substantially defining one or more walls of the temperature-controlled container, a thermally-insulated partition dividing the internal region into at least a first storage region and a second storage region, a first conduit attached to the first storage region, a second conduit attached to a second storage region, the first conduit and the second conduit both of a size and shape to be positioned within a ventilation conduit of a refrigeration device;
a first thermal diode unit of a size and shape to fit within the first storage region of the temperature-controlled container, the first thermal diode unit including a thermal transfer component in thermal contact with a top edge of the first thermal diode unit, the thermal transfer component configured to be positioned within the first conduit of the temperature-controlled container;
a second thermal diode unit of a size and shape to fit within the second storage region of the temperature-controlled container, the second thermal diode unit including a thermal transfer component in thermal contact with a top edge of the second thermal diode unit, the thermal transfer component configured to be positioned within the second conduit of the temperature-controlled container;
a first control unit including a temperature sensor, a controller responsive to the temperature sensor, and a fan responsive to the controller attached to the first storage region of the temperature-controlled container; and
a second control unit including a temperature sensor, a controller responsive to the temperature sensor, and a fan responsive to the controller attached to the second storage region of the temperature-controlled container.

5. The temperature-controlled container of claim 4 , wherein the first thermal diode unit comprises:
at least one inner wall configured to be substantially vertical during use of the first thermal diode unit;
at least one outer wall of a size and shape to align with the at least one inner wall, with a gap formed between the at least one inner wall and the at least one outer wall;
a mesh structure affixed to a surface of the at least one inner wall adjacent to the gap;
a liquid within the gap;
one or more seals between the at least one inner wall and the at least one outer wall, forming a gas-impermeable interior region of the first thermal diode unit surrounding the gap; and
a gas pressure within the gas-impermeable interior region that is not identical to atmospheric pressure surrounding the thermal diode unit.

6. The temperature-control addition to a refrigeration device of claim 4 , further comprising:
an attachment unit, including a thermally conductive attachment configured to attach to a refrigeration coil of the refrigeration device and a plurality of thermally transmissive projections affixed to the thermally conductive attachment; and
a thermal storage unit including a liquid-impermeable container of a size and shape to fit within a freezer section of a refrigeration device, the container including a plurality of apertures configured to receive the plurality of thermally transmissive projections affixed to the thermally conductive attachment.

7. A temperature-control addition to a refrigeration device, comprising:
a thermal storage unit including a container of a size and shape to fit within a freezer section of a refrigeration device, the container including an aperture with an edge dimension larger than a cross-section of a refrigeration coil of the refrigeration device;
a control unit including a temperature sensor and a controller responsive to the temperature sensor; and
a thermal diode unit including a top edge configured to be positioned adjacent to the thermal storage unit, the thermal diode unit of a size and shape to fit within the refrigeration device, the thermal diode unit including at least one inner wall configured to be substantially vertical during use of the thermal diode unit, at least one outer wall of a size and shape to align with the at least one inner wall, with a gap formed between the at least one inner wall and the at least one outer wall, a liquid within the gap, one or more seals between the at least one inner wall and the at least one outer wall, forming a gas-impermeable interior region of the thermal diode unit surrounding the gap, and a gas pressure within the gas-impermeable interior region that is not identical to atmospheric pressure surrounding the thermal diode unit.

8. A temperature-control addition to a refrigeration device, comprising:
a temperature-controlled container including one or more sections of insulation material substantially defining one or more walls of the temperature-controlled container, a thermally-insulated partition dividing the internal region into at least a first storage region and a second storage region;
a first thermal diode unit of a size and shape to fit within the first storage region of the temperature-controlled container, the first thermal diode unit including a thermal transfer component in thermal contact with a top edge of the first thermal diode unit;
a second thermal diode unit of a size and shape to fit within the second storage region of the temperature-controlled container, the second thermal diode unit including a thermal transfer component in thermal contact with a top edge of the second thermal diode unit;
a first control unit including a first temperature sensor, a controller responsive to the first temperature sensor; and
a second control unit including a second temperature sensor, a controller responsive to the second temperature sensor.

Assignees

• Tokitae Llc
• Tokitac LLC

Inventors

• Eckhoff Philip A
• Fowler Lawrence Morgan
• Gates William
• Hu Jennifer Ezu
• Ishikawa Muriel Y
• Myhrvold Nathan P
• Peterson Nels R
• Tegreene Clarence T
• Vecchione Maurizio
• Wood Jr Lowell L
• Wood Victoria Y H

Classifications

• F28D15/02 Primary

  in which the medium condenses and evaporates, e.g. heat pipes {(heat pipes used in solar heat collectors F24S10/95; in radiators F28D1/0226; in nuclear reactors G21C15/257)} · CPC title

• F28D15/04

  with tubes having a capillary structure · CPC title

• F25B2600/07

  Remote controls · CPC title

• F25B23/006

  boiling cooling systems · CPC title

• F25B21/02

  using Peltier effect; using Nernst-Ettinghausen effect · CPC title