Pressure-sensitive adhesive dispersion comprising polymers with ureido groups or with ureido-analogous groups and prepared by stage polymerization

US9365745B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9365745-B2
Application numberUS-201213443044-A
CountryUS
Kind codeB2
Filing dateApr 10, 2012
Priority dateApr 15, 2011
Publication dateJun 14, 2016
Grant dateJun 14, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A description is given of a pressure-sensitive adhesive dispersion comprising a water-dispersed polymer P1 formed by emulsion polymerization. The polymer P1 is formed from a monomer mixture comprising (a) at least 40% by weight of C4 to C20 alkyl (meth)acrylates which when polymerized as homopolymers have a glass transition temperature of −30° C. or less, (b) at least 0.05% by weight of (meth)acrylate monomers having a substituent of the formula where X is CH 2 , O, NH or NR and R is a C1 to C4 alkyl group, (c) at least 0.1% by weight of acid monomers. The polymer P1 is prepared by polymerization in at least 2 stages, the glass transition temperature of a polymer from monomers of the first stage being lower by at least 20° C. than the glass transition temperature of a polymer from monomers of a later, second stage.

First claim

Opening claim text (preview).

The invention claimed is: 1. A pressure-sensitive adhesive dispersion, comprising: a water-dispersed polymer P1 formed by emulsion polymerization from a monomer mixture, wherein the monomer mixture comprises (a) 60 to 95% by weight of a C4 to C8 alkyl (meth)acrylate which, when polymerized as a homopolymer, has a glass transition temperature of −30° C. or less, (b) 0.5 to 5% by weight of 2-(2-oxoimidazolidin-1-yl)ethyl methacrylate, and (c) 0.5 to 4% by weight of an acid monomer selected from the group consisting of acrylic acid, methacrylic acid and combinations thereof, and (d) 1 to 40% by weight of one or more further monomers selected from the group consisting of a C1 to C20 alkyl (meth)acrylate, a C1 to C20 hydroxyalkyl (meth)acrylate, a vinyl ester of a carboxylic acid comprising up to 20 C atoms, a vinylaromatic having up to 20 C atoms, an ethylenically unsaturated nitrile, a vinyl halide, a vinyl ester of an alcohol comprising 1 to 10 C atoms, an aliphatic hydrocarbon having 2 to 8 C atoms and one or two double bonds, and a mixture thereof, monomer amounts being based in each case on a sum of all monomers, wherein the polymer P1 is prepared by a process comprising a first polymerizing stage and a second polymerizing stage, wherein the entire amount of the 2-(2-oxoimidazolidin-1-yl)ethyl methacrylate in the monomer mixture is polymerized during the first polymerization stage, and a glass transition temperature of a polymer from monomers of the first polymerizing stage is at least 20° C. lower than a glass transition temperature of a polymer from monomers of the second polymerizing stage. 2. The pressure-sensitive adhesive dispersion according to claim 1 , wherein (a) is at least one selected from the group consisting of n-butyl acrylate, n-hexyl acrylate, octyl acrylate, and 2-ethylhexyl acrylate. 3. The pressure-sensitive adhesive dispersion according to claim 1 , wherein the one or more further monomers (d) is present in an amount of 2% to 30% by weight. 4. The pressure-sensitive adhesive dispersion according to claim 1 , wherein the pressure-sensitive adhesive dispersion comprises an additive selected from the group consisting of a filler, a dye, a flow control assistant, a thickener, a defoamer, a plasticizer, a pigment, a wetting agent, a UV protectant, and a tackifier. 5. The pressure-sensitive adhesive dispersion according to claim 1 , wherein the glass transition temperature of a polymer from monomers of the first polymerizing stage is less than or equal to −30° C. and the glass transition temperature of a polymer from monomers of the second polymerizing stage is more than −10° C. 6. The pressure-sensitive adhesive dispersion according to claim 1 , wherein the glass transition temperature of a polymer from monomers of the first polymerizing stage is less than or equal to −40° C. and the glass transition temperature of a polymer from monomers of the second polymerizing stage is more than 0° C. 7. An adhesive tape, comprising a carrier layer, wherein the adhesive tape is coated on one or both sides with at least one of the pressure-sensitive adhesive dispersion according to claim 1 . 8. The adhesive tape according to claim 7 , wherein an applied weight of the pressure-sensitive adhesive dispersion, based on solids content, is at least 30 g/m 2 . 9. The adhesive tape according to claim 7 , wherein the carrier layer is selected from the group consisting of polyethylene, oriented polypropylene, polyethylene terephthalate, PE foam, and polyurethane foam, the adhesive tape further comprises a detachable protective layer lining a layer of adhesive, or both. 10. A method for producing a self-adhesive article, the method comprising: producing the self-adhesive article with the pressure-sensitive adhesive dispersion according to claim 1 . 11. A method for fixing a component for an electronics article or in a construction application, the method comprising: fixing the component with the pressure-sensitive adhesive dispersion according to claim 1 . 12. The method according to claim 11 , wherein the component is suitable for automobile construction. 13. A method for fixing a component for an electronics article or in a construction application, the method comprising: fixing the component with the adhesive tape according to claim 7 . 14. The method according to claim 13 , wherein the component is suitable for automobile construction. 15. The pressure-sensitive adhesive dispersion according to claim 1 , wherein the 2-(2-oxoimidazolidin-1-yl)ethyl methacrylate (b) is present in an amount of 1 to 5% by weight in the polymer P1. 16. The pressure-sensitive adhesive dispersion according to claim 1 , wherein the monomer (d) is at least one selected from the group consisting of styrene, vinyl acetate, and 2-hydroxypropyl acrylate. 17. The pressure-sensitive adhesive dispersion according to claim 1 , wherein the second polymerizing stage is carried out with at least one co-monomer (d) selected from the group consisting of styrene, ethyl acrylate, methyl acrylate and methyl methacrylate to form a particle. 18. The pressure-sensitive adhesive dispersion according to claim 1 , wherein the second polymerizing stage is carried out with a monomer mixture consisting of one or more monomers selected from the group consisting of ethyl acrylate, methyl methacrylate, methacrylic acid and styrene. 19. The pressure-sensitive adhesive dispersion according to claim 1 , wherein the 2-(2-oxoimidazolidin-1-yl)ethyl methacrylate (b) is present in an amount of from 0.5% by weight to 2% by weight based on the total weight of the monomer mixture. 20. The pressure-sensitive adhesive dispersion according to claim 19 , wherein the 2-(2-oxoimidazolidin-1-yl)ethyl methacrylate (b) is present in an amount of from 1 to 2% by weight based on the total weight of the monomer mixture. 21. The pressure-sensitive adhesive dispersion according to claim 1 , wherein the monomer mixture consists of n-butyl acrylate, 2-(2-oxoimidazolidin-1-yl)ethyl methacrylate, methyl methacrylate, hydroxypropyl acrylate, acrylic acid, styrene and ethyl acrylate. 22. The pressure-sensitive adhesive dispersion according to claim 1 , wherein the first polymerizing stage is carried out by polymerizing a monomer mixture consisting of n-butyl acrylate, 2-(2-oxoimidazolidin-1-yl)ethyl methacrylate, methyl methacrylate, hydroxypropyl acrylate, acrylic acid and styrene. 23. The pressure-sensitive adhesive dispersion according to claim 1 , wherein during the first stage polymerization a first monomer mixture consisting of (a) n-butyl acrylate, (b) 2-(2-oxoimidazolidin-1-yl)ethyl methacrylate, (c) acrylic acid and (d) methyl methacrylate, hydroxypropyl acrylate, and styrene is polymerized to form a first polymer; during the second stage polymerization ethyl acrylate is polymerized in the presence of the first polymer; and the polymer P1 consists of (a) 75-90% by weight of n-butyl acrylate, (b) 1 to 2% by weight of 2-(2-oxoimidazolidin-1-yl)ethyl methacrylate, (c) 0.5 to 2% by weight of acrylic acid and (d) 2 to 20% by weight of monomers selected from the group consisting of methyl methacrylate, ethyl acrylate and hydroxypropyl acrylate, wherein % by weight is based on the total weight of the polymerized monomers in the polymer P1.

Assignees

Inventors

Classifications

  • C09J4/00Primary

    Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond {; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16} · CPC title

  • of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen · CPC title

  • including nitrogen containing polymer [e.g., polyacrylonitrile, polymethacrylonitrile, etc.] · CPC title

  • Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers · CPC title

  • Three or more layers · CPC title

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What does patent US9365745B2 cover?
A description is given of a pressure-sensitive adhesive dispersion comprising a water-dispersed polymer P1 formed by emulsion polymerization. The polymer P1 is formed from a monomer mixture comprising (a) at least 40% by weight of C4 to C20 alkyl (meth)acrylates which when polymerized as homopolymers have a glass transition temperature of −30° C. or less, (b) at least 0.05% by weight of (meth)a…
Who is the assignee on this patent?
Gerst Matthias, Wulff Dirk, Christ Thomas, and 1 more
What technology area does this patent fall under?
Primary CPC classification C09J4/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jun 14 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).