Bonding composition

Patent metadata

Field	Value
Publication number	US-9365592-B2
Application number	US-201314434901-A
Country	US
Kind code	B2
Filing date	Oct 3, 2013
Priority date	Oct 12, 2012
Publication date	Jun 14, 2016
Grant date	Jun 14, 2016

Abstract

To provide a bonding composition where high joint strength can be obtained due to joining at a comparatively low temperature and under a pressureless condition, and, that is also equipped with thermal resistance that is difficult to cause a reduction of joint strength due to decomposition, deterioration and/or the like of a resin component at the time of an increase of an operating temperature, and to provide a bonding composition particularly containing metallic particles. A bonding composition containing inorganic metallic particles and organic components including unsaturated hydrocarbon and amine with 4 to 7 of carbon number

First claim

What is claimed is:

1. A bonding composition, comprising:
inorganic metallic particles and
organic components including unsaturated carboxylic acid and amine having a carbon number of 4 to 7 and a boiling point of 300° C. or less.

2. The bonding composition according to claim 1 , wherein the unsaturated carboxylic acid is ricinoleic acid.

3. The bonding composition according to claim 1 , wherein the organic components are attached to at least a part of a surface of each of the inorganic metallic particles.

4. The bonding composition according to claim 1 , wherein the inorganic metallic particles have a particle size of 1 nm to 200 nm.

5. The bonding composition according to claim 1 , wherein the inorganic metallic particles have a particle size of 2 nm to 100 nm.

6. The bonding composition according to claim 1 , wherein the inorganic metallic particles are selected from the group consisting of gold, silver, copper, nickel, bismuth, tin, ruthenium, rhodium, palladium, osmium, iridium and platinum.

7. The bonding composition according to claim 1 , wherein the amine is selected from the group consisting of butylamine, pentylamine, hexylamine, cyclopentylamine, cyclohexylamine, allylamine, aniline, dipropylamine, dibutylamine, piperidine, hexamethyleneimine, tripropylamine, dimethyl propanediamine, cyclohexyldimethylamine, and pridine.

8. The bonding composition according to claim 1 ,
wherein the organic components further comprises a carboxyl acid, and
wherein the carboxyl acid is selected from the group consisting of formic acid, oxalic acid, acetic acid, hexane acid, acrylic acid, octylic acid and oleic acid.

9. The bonding composition according to claim 1 , wherein the content of the organic components is 0.5% to 50% by mass.

10. The bonding composition according to claim 1 , wherein the content of the organic components is 2% to 15% by mass.

11. The bonding composition according to claim 1 , wherein the organic components further comprises an unsaturated hydrocarbon, and
wherein the unsaturated hydrocarbon is selected from the group consisting of ethylene, acethylene, benzene, acetone, 1-hexene, 1-octene, 4-vinylcyclohexene, cyclohexanone, terpene-series alcohol, allyl alcohol, oleyl alcohol, 2-palmitoleic acid, petroselinic acid, oleic acid, elaidic acid, tianshic acid, linoleic acid, linolelaidic acid, linolenic acid, arachidonic acid, acrylic acid, methacrylic acid, gallic acid and salicylic acid.

12. The bonding composition according to claim 1 , further comprises an optional component, wherein the optional component is selected from the group consisting of a binder, a resin component, an organic solvent, a surfactant, a thickener and a surface tension regulator.

13. The bonding composition according to claim 1 , wherein the bonding composition has a viscosity of 0.01 Pa·s to 5,000 Pa·s.

14. The bonding composition according to claim 4 , wherein the bonding composition has a viscosity of 1 Pa·s to 100 Pa·s.

Assignees

• Bando Chemical Ind

Inventors

• Watanabe Tomofumi
• Shimoyama Kenji

Classifications

• H10W72/30

  Die-attach connectors · CPC title

• B22F1/107

  containing organic material comprising solvents, e.g. for slip casting · CPC title

• B22F1/102

  Metallic powder coated with organic material · CPC title

• B22F1/056

  Submicron particles having a size above 100 nm up to 300 nm · CPC title

• B22F1/054

  Nanosized particles · CPC title