Thermally conductive sheet and process for producing same

Patent metadata

Field	Value
Publication number	US-9365001-B2
Application number	US-201414323423-A
Country	US
Kind code	B2
Filing date	Jul 3, 2014
Priority date	Jun 17, 2010
Publication date	Jun 14, 2016
Grant date	Jun 14, 2016

Abstract

A thermally conductive sheet has cut surfaces with low surface roughness and hence shows reduced thermal resistance at the interfaces, and high thermal conductivity in the thickness direction. Thus, the thermally conductive sheet can be interposed between any of various heat sources and a radiation member. The process for producing the thermally conductive sheet includes at least: an extrusion molding step in which a thermally conductive composition containing a polymer, an anisotropic thermally conductive filler, and a filler is extruded with an extruder to thereby mold an extrusion-molded product in which the anisotropic thermally conductive filler has been oriented along the extrusion direction; a curing step in which the extrusion-molded product is cured to obtain a cured object; and a slicing step in which the cured object is sliced into a given thickness with an ultrasonic cutter in the direction perpendicular to the extrusion direction.

First claim

The invention claimed is:

1. A thermally conductive sheet produced by the following steps:
extruding a thermally conductive composition containing a polymer, an anisotropic thermally conductive filler and another filler through an extruder, thereby extrusion molding an extrusion molded product in which the anisotropic thermally conductive filler is oriented along the extrusion direction;
curing the extrusion molded product to form a cured object; and
cutting the cured object in a direction perpendicular to the extrusion direction into a given thickness with an ultrasonic cutter,
wherein the anisotropic thermally conductive filler is prepared as carbon fibers and has an average fiber length of 100 μm or more,
the other filler is prepared as spherical alumina particles and has an average particle size in a range from 1 μm to 40 μm,
the carbon fibers are oriented in the range from 0° to 5° with respect to the thickness direction of the thermally conductive sheet,
a peripheral portion on a surface of the thermally conductive sheet has a slight stickiness that is higher than that of an inside portion on the surface of the thermally conductive sheet, the inside portion of the thermally conductive sheet being encompassed by the peripheral portion of the thermally conductive sheet,
the thermally conductive sheet has a cut surface having a surface roughness Ra of 9.9 μm of less,
the polymer is a silicone resin,
the spherical alumina particles are contained in a range from 40 to 55% by volume; and
the carbon fibers are contained in a range from 10 to 25% by volume.

2. The thermally conductive sheet according to claim 1 , wherein the other filler is contained in a range from 40.4 to 45.8% by volume, and the carbon fibers are contained in a range from 13.3 to 23.5% by volume.

3. The thermally conductive sheet according to claim 2 , wherein 10 g or more of the carbon fibers are contained relative to 50 g of the other filler.

4. The thermally conductive sheet according to claim 3 , wherein 16 g or less of the carbon fibers are contained relative to 50 g of the other filler.

5. The thermally conductive sheet according to claim 1 , wherein the silicone resin contains polyalkenyl alkylsiloxane as a first silicone resin and polyalkyl hydrogen siloxane as a second silicone resin, and
the silicone resin contains a larger amount of the first silicone resin than that of the second silicone resin, and the cured object has a compression rate of 3% or more when a predetermined load is applied by curing the extrusion molded product with a platinum catalyst.

Assignees

• Dexerials Corp

Inventors

• Usui Hiroyuki
• Aramaki Keisuke

Classifications

• H10W72/07337

  using a polymer adhesive, e.g. an adhesive based on silicone or epoxy · CPC title

• H10W72/354

  comprising polymers · CPC title

• H10W72/353

  not comprising solid metals or solid metalloids, e.g. ceramics · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W72/351

  Materials of die-attach connectors · CPC title