Circuit device

Patent metadata

Field	Value
Publication number	US-9363894-B2
Application number	US-201113878721-A
Country	US
Kind code	B2
Filing date	Sep 15, 2011
Priority date	Sep 24, 2010
Publication date	Jun 7, 2016
Grant date	Jun 7, 2016

Abstract

A compact circuit device wherein a semiconductor element that performs high current switching is embedded is provided. The hybrid integrated circuit device ( 10 ) is provided with: a circuit board ( 12 ); a plurality of ceramic substrates ( 22 A- 22 G) disposed on the top surface of the circuit board ( 12 ); circuit elements such as transistors mounted on the top surface of the ceramic substrates ( 22 A- 22 G); and a lead ( 29 ) or the like that is connected to the circuit elements and is exposed to the outside. Furthermore, in the present embodiment, leads ( 28, 30, 31 A- 31 C) are disposed superimposed in the vicinity of the center of the circuit board ( 12 ), and a circuit element such as an IGBT is disposed and electrically connected approaching the region at which the leads are superimposed. The alternating current transformed by the IGBT is output externally via the leads ( 31 A, etc.).

First claim

The invention claimed is:

1. A circuit device, comprising:
a circuit board having a periphery region that is configured to accept a case material that forms a frame-shape, the circuit board having a central region that is distal from the periphery region;
a semiconductor element disposed on an upper surface of the circuit board;
a first lead electrically connected to the semiconductor element, on the upper surface of the circuit board;
a second lead electrically connected to the semiconductor element, at least a part of the second lead being superimposed on the first lead, wherein the first lead and the second lead are disposed in the central region of the circuit board; and
one or more third leads electrically connected to the semiconductor element, at least one third lead of the one or more third leads having an “L” shape with a first portion of the “L” shape being superimposed on both the first lead and the second lead in the central region, and a long side of the “L” shape extending continuously and laterally in a first direction from the central region to the periphery region and in the first direction through the frame-shape of the case material.

2. The circuit device according to claim 1 , wherein the case material is assembled onto the upper surface of the circuit board and forms the frame-shape, the case material having a portion that extends into the central region and underlies the first lead, the second lead, and the first portion of the at least one third lead, and wherein the first and second leads and the first portion of the at least one third lead are incorporated in the portion of the case material wherein the portion of the case material is disposed on the upper surface of the circuit board.

3. The circuit device according to claim 1 , wherein the first lead, the second lead, and the third lead are insulated from one another by a resin material constituting the case material.

4. The circuit device according to claim 1 , wherein the first lead and the circuit board are insulated from each other by a resin material constituting the case material.

5. The circuit device according to claim 1 , wherein an inverter circuit is assembled onto the upper surface of the circuit board, the first lead and the second lead are leads to which direct-current power is supplied from the outside, and the third lead is a lead from which alternating-current power converted by the inverter circuit is outputted to the outside.

6. The circuit device according to claim 1 , wherein the circuit board is a substrate made of a metal, and the semiconductor element is mounted on an upper surface of a ceramic substrate fixed to the upper surface of the circuit board.

7. The circuit device according to claim 1 wherein one of the first or second leads does not extend past the periphery region of the circuit board.

8. The circuit device according to claim 1 wherein the semiconductor element is not connected to another lead having a portion that is on the circuit board and external to the case material including the portion of the case material.

9. The circuit device according to claim 1 further including a mounting hole formed through the at least one third lead near an end of the long side thereof.

10. The circuit device according to claim 1 further including the frame-shaped case material disposed on the periphery region of the circuit board and forming the frame-shape, the frame shape of the frame-shaped case material having a sidewall; and
a fourth lead disposed on the sidewall of the frame shape of the case material, the fourth lead connected to the semiconductor element.

11. The circuit device according to claim 1 wherein the first, second, and third leads are incorporated into the case material prior to attaching the case material to the circuit board.

Assignees

• Shibasaki Takashi
• Saito Hidefumi
• Makino Takahisa
• Shimizu Masanori
• Sasaki Daisuke
• Semiconductor Components Ind

Inventors

• Shibasaki Takashi
• Saito Hidefumi
• Makino Takahisa
• Shimizu Masanori
• Sasaki Daisuke

Classifications

• H10W90/759

  between a chip and a laterally-adjacent discrete passive device · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W76/47

  Solid or gel fillings · CPC title