Circuit assembly and corresponding methods

Patent metadata

Field	Value
Publication number	US-9363892-B2
Application number	US-201313946351-A
Country	US
Kind code	B2
Filing date	Jul 19, 2013
Priority date	Jul 19, 2013
Publication date	Jun 7, 2016
Grant date	Jun 7, 2016

Abstract

A circuit assembly ( 1800 ) includes a first circuit substrate ( 1200 ) defining a first major face ( 1201 ) and a second circuit substrate ( 1500 ) defining a second major face ( 1502 ). A plurality of electrical components ( 1203,1204,1205 ) can be disposed on one or more of the first major face or the second major face. One or more substrate bridging members ( 1301,1302,1303,1304 ) are disposed between the first circuit substrate and the second circuit substrate. Each substrate bridging member can define a unitary structure having a first end bonded to the first major face and a second end bonded to the second major face to bridge the first circuit substrate and the second circuit substrate.

First claim

What is claimed is:

1. A circuit assembly, comprising:
a first circuit substrate defining a first major face;
a second circuit substrate defining a second major face;
an electrical component coupled to the second circuit substrate; and
at least one substrate bridging member disposed interior to a perimeter of the circuit assembly,
the at least one substrate bridging member defining a unitary structure having a first end coupled to the first major face; a second end coupled to the second major face, and a bridge wall extending between the first end and the second end, to bridge the first circuit substrate and the second circuit substrate, the first end extending substantially orthogonal to the bridge wall, the second end extending substantially orthogonal to the bridge wall.

2. The circuit assembly of claim 1 , wherein the at least one substrate bridging member is configured to electrically shield the electrical component.

3. The circuit assembly of claim 1 , wherein at least one substrate bridging member is composed entirely of metal.

4. The circuit assembly of claim 1 , wherein the first end is soldered to the first major face and the second end is soldered to the second major face.

5. The circuit assembly of claim 4 , wherein the first end is soldered by a reflow process, and the second end is soldered by a resistive heat process.

6. The circuit assembly of claim 1 , wherein a portion of the bridge wall of the at least one substrate bridging member is non-linear.

7. The circuit assembly of claim 1 , wherein the at least one substrate bridging member has a thickness in a range of about 0.15 millimeters to 0.2 millimeters.

8. The circuit assembly of claim 1 , wherein the at least one substrate bridging member includes a plurality of substrate bridging members configured to surround the electrical component, a portion of the first circuit substrate including a ground plane, wherein the ground plane and the plurality of substrate bridging members are configured to electrically shield the electrical component.

9. The circuit assembly of claim 1 , wherein the at least one substrate bridging member includes a plurality of substrate bridging members arranged in a honeycomb structure.

10. The circuit assembly of claim 1 , wherein the at least one substrate bridging member includes a plurality of substrate bridging members disposed across the first major face and the second major face to orient the first circuit substrate substantially parallel to the second circuit substrate.

11. The circuit assembly of claim 1 , wherein a portion of the first circuit substrate defines a recess, a portion of the electrical component extending into the recess.

12. The circuit assembly of claim 1 , wherein the first circuit substrate includes an outer curved portion that curves to an edge of the first circuit substrate, the second circuit substrate being coupled to the outer curved portion at the edge of the first circuit substrate.

13. The circuit assembly of claim 12 , wherein the first circuit substrate includes a linear portion disposed adjacent to the outer curved portion, the linear portion being coupled to the first end of the at least one substrate bridging member.

14. The circuit assembly of claim 1 , further comprising:
a circuit element disposed along the bridge wall of the at least one substrate bridging member.

15. The circuit assembly of claim 14 , wherein the circuit element includes a push button switch, or an electrical connector.

16. A circuit assembly, comprising:
a first circuit substrate defining a first major face;
a second circuit substrate defining a second major face;
an electrical component coupled to the second circuit substrate; and
at least one substrate bridging member disposed between the first major face and the second major face,
the first circuit substrate including a solder pad aligned with a resistive element, the solder pad configured to heat when current is applied to the resistive element,
the at least one substrate bridging member having a first end coupled to the solder pad, a second end coupled to the second major face, and a bridge wall extending between the first end and the second end, to bridge the first circuit substrate and the second circuit substrate, the first end extending substantially orthogonal to the bridge wall, the second end extending substantially orthogonal to the bridge wall.

17. The circuit assembly of claim 16 , wherein the solder pad and the resistive element are integral to the first circuit substrate.

18. A circuit assembly, comprising:
a first substrate defining a first side of the circuit assembly;
a second substrate defining a second side of the circuit assembly;
an electrical component disposed on the second substrate interior to the circuit assembly; and
a plurality of substrate bridging members disposed between the first side and the second side, each of the plurality of substrate bridging members including a first end coupled to the first side, a second end coupled to the second side, and a bridge wall extending between the first end and the second end, the first end extending substantially orthogonal to the bridge wall in a first direction away from the bridge wall, the second end extending substantially orthogonal to the bridge wall in a second direction away from the bridge wall, the second direction being opposite to the first direction.

19. The circuit assembly of claim 18 , further comprising:
a display, operable with the circuit assembly, attached to one of the first substrate or the second substrate exterior to the circuit assembly; and
a battery, operable with the circuit assembly, attached to another of the first substrate or the second substrate on a side of the circuit assembly opposite the display.

20. The circuit assembly of claim 18 , wherein the first substrate defines an aperture, and the aperture receives a portion of the electrical component.

Assignees

• Google Technology Holdings LLC

Inventors

• Steuer Paul R
• Barabolak Mark A
• Cauwels Patrick J
• Sutherland Timothy J

Classifications

• H05K1/111

  Pads for surface mounting, e.g. lay-out · CPC title

• H05K1/023

  using auxiliary mounted passive components or auxiliary substances (printed passive components H05K1/16) · CPC title

• H05K9/0022

  of components mounted on printed circuit boards [PCB] (shields integrated within PCB H05K1/0218; shields integrated within component packages H10W42/20) · CPC title

• H05K2201/2036

  Permanent spacer or stand-off in a printed circuit or printed circuit assembly · CPC title

• H05K2201/10969

  Metallic case or integral heatsink of component electrically connected to a pad on PCB · CPC title