High reflectivity mirrors and method for making same

Patent metadata

Field	Value
Publication number	US-9362459-B2
Application number	US-55302509-A
Country	US
Kind code	B2
Filing date	Sep 2, 2009
Priority date	Sep 2, 2009
Publication date	Jun 7, 2016
Grant date	Jun 7, 2016

Abstract

A composite high reflectivity mirror (CHRM) with at least one relatively smooth interior surface interface. The CHRM includes a composite portion, for example dielectric and metal layers, on a base element. At least one of the internal surfaces is polished to achieve a smooth interface. The polish can be performed on the surface of the base element, on various layers of the composite portion, or both. The resulting smooth interface(s) reflect more of the incident light in an intended direction. The CHRMs may be integrated into light emitting diode (LED) devices to increase optical output efficiency.

First claim

We claim:

1. A light emitting diode (LED), comprising:
a light emitting structure;
a current spreading layer on said light emitting structure comprising a smooth surface, wherein said current spreading layer smooth surface has a root mean square (RMS) roughness of not more than 1 nm;
a plurality of dielectric layers on said smooth surface of said current spreading layer opposite said light emitting structure, wherein an interface between two of said dielectric layers is smooth, said plurality of dielectric layers comprising first and second materials arranged in alternating layers on said current spreading layer, said second material comprising tantalum pentoxide (Ta2O5), wherein any layer of said first material closer to said current spreading layer is thicker than any layer of said first material farther from said current spreading layer and any layer of said second material closer to said current spreading layer is thicker than any layer of said second material farther from said current spreading layer; and
a reflective layer on one of said dielectric layers opposite said current spreading layer.

2. The LED of claim 1 , said light emitting structure comprising an active region interposed between a p-type semiconductor layer and an n-type semiconductor layer.

3. The LED of claim 2 , wherein said current spreading layer is on said p-type semiconductor layer opposite said active region.

4. The LED of claim 1 , said light emitting structure comprising Group-III nitride materials.

5. The LED of claim 1 , wherein said current spreading layer provides a reflectivity viewing angle cut-off above which said plurality of dielectric layers reflectivity is approximately 100%.

6. The LED of claim 5 , wherein said plurality of dielectric layers provide improved reflectivity below said viewing angle cut-off compared to a similar LED without said at least one dielectric layer.

7. The LED of claim 1 , wherein said first material comprises silicon dioxide (SiO 2 ).

8. The LED of claim 1 , further comprising conductive vias through said at least one dielectric layer.

9. The LED of claim 1 , said light emitting structure comprising:
at least two oppositely doped semiconductor layers;
an active region interposed between said at least two oppositely doped semiconductor layers; and
a substrate disposed such that said current spreading layer is on said substrate.

10. The LED of claim 1 , said reflective layer comprising a metal.

11. The LED of claim 1 , said reflective layer comprising a conductive material and electrically contacting said current spreading layer.

12. The LED of claim 1 , said reflective layer comprising at least one conductive via through said at least one dielectric layer to said current spreading layer.

Assignees

• Heikman Sten
• Jacob-Mitos Matthew
• Li Ting
• Ibbetson James
• Us Energy

Inventors

• Heikman Sten
• Jacob-Mitos Matthew
• Li Ting
• Ibbetson James

Classifications

• H10W90/756

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• H10W74/00

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• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10H20/856

  Reflecting means · CPC title

• H10H20/835

  Reflective materials · CPC title