Semiconductor light emitting device

Patent metadata

Field	Value
Publication number	US-9362447-B2
Application number	US-201414508784-A
Country	US
Kind code	B2
Filing date	Oct 7, 2014
Priority date	Jan 15, 2014
Publication date	Jun 7, 2016
Grant date	Jun 7, 2016

Abstract

There is provided a semiconductor light emitting device. The device includes an n-type semiconductor layer, and a p-type semiconductor layer. The p-type semiconductor layer includes a plurality of first layers and second layers, each containing a p-type impurity and are alternately stacked. The impurity concentrations of the plurality of first layers increase in a direction away from the n-type semiconductor layer. An active layer is disposed between the n-type semiconductor layer and the p-type semiconductor layer.

First claim

What is claimed is:

1. A semiconductor light emitting device comprising:
an n-type semiconductor layer;
a p-type semiconductor layer including a plurality of first and second layers, each containing a p-type impurity, the plurality of first and second layers are alternately stacked, and impurity concentrations of the plurality of first layers increase in a direction away from the n-type semiconductor layer; and
an active layer disposed between the n-type semiconductor layer and the p-type semiconductor layer,
wherein thicknesses of the plurality of first layers having increasing impurity concentrations increase in relation with the increase in impurity concentrations in the direction away from the n-type semiconductor layer.

2. The semiconductor light emitting device of claim 1 , wherein each of the plurality of second layers has an impurity concentration lower than that of the first layers immediately adjacent thereto.

3. The semiconductor light emitting device of claim 1 , wherein:
thicknesses of each of the plurality of second layers are gradually decreased in a direction away from the active layer, and
a maximum difference in thickness of the plurality of second layers is greater than a maximum difference in thickness of the plurality of first layers.

4. The semiconductor light emitting device of claim 1 , wherein respective thicknesses of the plurality of first layers are gradually increased in proportion to impurity concentrations in the direction away from the active layer.

5. The semiconductor light emitting device of claim 1 , wherein respective thicknesses of the plurality of second layers are gradually increased in the direction away from the active layer.

6. The semiconductor light emitting device of claim 5 , wherein respective thicknesses of the plurality of first layers are equal to or greater than those of the second layers adjacent thereto.

7. The semiconductor light emitting device of claim 1 , further comprising:
a p-type contact layer disposed on the p-type semiconductor layer,
wherein the p-type contact layer is disposed to be in contact with any one of the plurality of second layers.

8. The semiconductor light emitting device of claim 1 , wherein the active layer is disposed to be in contact with any one of the plurality of first layers included in the p-type semiconductor layer.

9. The semiconductor light emitting device of claim 1 , wherein an n-type impurity is doped in at least one of a plurality of interfaces between the plurality of first layers and the plurality of second layers.

10. The semiconductor light emitting device of claim 1 , wherein each of the plurality of second layers is doped with the p-type impurity diffused from the first layers.

11. The semiconductor light emitting device of claim 1 , wherein the p-type semiconductor layer includes a third layer disposed at an interface between the p-type semiconductor layer and the active layer.

12. The semiconductor light emitting device of claim 11 , wherein a thickness of the third layer is determined according to a thickness of the p-type semiconductor layer.

13. A light emitting device package comprising:
a mounting board;
the semiconductor light emitting device of claim 1 disposed on the mounting board;
a wavelength conversion unit disposed at least on an upper surface of the semiconductor light emitting device; and
an encapsulant surrounding the semiconductor light emitting device.

14. A light emitting device package comprising:
a package body;
the semiconductor light emitting device of claim 1 disposed on the package body; and
an encapsulant surrounding the semiconductor light emitting device.

15. A semiconductor light emitting device comprising:
an n-type semiconductor layer;
an active layer disposed on the n-type semiconductor layer; and
a p-type semiconductor layer disposed on the active layer and including pluralities of first and second layers which are alternately stacked, wherein:
the plurality of first layers and the plurality of second layers include a p-type impurity,
an impurity concentration of each of the plurality of first layers is higher than the impurity concentrations of the second layers adjacent thereto, and
thicknesses of the plurality of first layers having the impurity concentrations higher than adjacent second layers increase in a direction away from the n-type semiconductor layer,

wherein an impurity concentration of each of the plurality of first layers is higher than or equal to that of other first layers disposed closer to the active layer, and
wherein thicknesses of each of the plurality of first layers are proportional to impurity concentrations of each of the plurality of first layers.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Jong Hyun
• Han Sang Heon
• Yoon Suk Ho
• Hyun Jae Sung

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07554

  changes in dispositions · CPC title

• H10W72/01515

  Forming coatings · CPC title

• H10W72/547

  Dispositions of multiple bond wires · CPC title