Bonding structure including metal nano particle

Patent metadata

Field	Value
Publication number	US-9362242-B2
Application number	US-201414247272-A
Country	US
Kind code	B2
Filing date	Apr 8, 2014
Priority date	Aug 8, 2013
Publication date	Jun 7, 2016
Grant date	Jun 7, 2016

Abstract

A bonding structure including metal nano particles includes a first member having a metal surface on at least one side, a second member having a metal surface on at least one side, the second member being disposed such that the metal surface of the second member faces the metal surface of the first member, and a bonding material bonding the first member and the second member by sinter-bonding the metal nano particles. At least one of the metal surfaces of the first member and the second member is formed to be a rough surface having a surface roughness within the range from 0.5 μm to 2.0 μm.

First claim

What is claimed is:

1. A bonding structure including metal nano particles, comprising:
a first member having a metal surface on at least one side;
a second member having a metal surface on at least one side, said second member being disposed such that said metal surface of said second member faces said metal surface of said first member; and
a bonding material bonding said first member and said second member by sinter-bonding the metal nano particles,
wherein at least one of said metal surfaces of said first member and said second member is formed to be a rough surface having a surface roughness of 0.5 μm Rz-JIS to 2.0 μm Rz-JIS.

2. The bonding structure including metal nano particles according to claim 1 , wherein
said rough surface includes a first roughness region having a first surface roughness and a second roughness region having a second surface roughness greater than said first surface roughness, and
said first roughness region and said second roughness region are formed in straight stripes in parallel with each other.

3. The bonding structure including metal nano particles according to claim 1 , wherein
said rough surface includes a first roughness region having a first surface roughness and a second roughness region having a second surface roughness greater than said first surface roughness, and
said second roughness region is formed in a cross shape or in a grid pattern.

4. The bonding structure including metal nano particles according to claim 1 , wherein said rough surface is formed in a region greater than a bonding region to an opposite metal surface in at least one of said metal surfaces of said first member and said second member.

5. The bonding structure including metal nano particles according to claim 1 , wherein said first member is a semiconductor element and said second member is a heat spreader.

6. The bonding structure including metal nano particles according to claim 5 , wherein said semiconductor element is SiC.

7. The bonding structure including metal nano particles according to claim 1 , wherein said rough surface has a surface roughness of 0.5 μm Rz-JIS to less than 2.0 μm Rz-JIS.

8. The bonding structure including metal nano particles according to claim 7 , wherein said at least one of said metal surfaces of said first member and said second member is roughened to form said rough surface.

Assignees

• Mitsubishi Electric Corp

Inventors

• Iwata Aya
• Hino Yasunari

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title

• H10W72/07332

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W72/07331

  Connecting techniques · CPC title

• H10W72/01951

  Changing the shapes of bond pads · CPC title